Operational Amplifier, 1 Func, 800uV Offset-Max, BIPolar, CQCC20,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Comlinear Corporation |
| Objectid | 1402327883 |
| 包装说明 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown |
| compound_id | 293710637 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 20 µA |
| 25C 时的最大偏置电流 (IIB) | 20 µA |
| 最小共模抑制比 | 92 dB |
| 标称共模抑制比 | 100 dB |
| 频率补偿 | YES (AVCL>=10) |
| 最大输入失调电压 | 800 µV |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 低-失调 | NO |
| 负供电电压上限 | -7 V |
| 标称负供电电压 (Vsup) | -5 V |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | +-5 V |
| 可编程功率 | YES |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称压摆率 | 350 V/us |
| 最大压摆率 | 16 mA |
| 供电电压上限 | 7 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 标称均一增益带宽 | 1700000 kHz |
| 最小电压增益 | 20000 |
| 宽带 | YES |
| CLC425A8L-2 | CLC425AJE | CLC425AMC | CLC425ALC | CLC425AIB | |
|---|---|---|---|---|---|
| 描述 | Operational Amplifier, 1 Func, 800uV Offset-Max, BIPolar, CQCC20, | Operational Amplifier, 1 Func, 800uV Offset-Max, BIPolar, PDSO8, | Operational Amplifier, 1 Func, 800uV Offset-Max, BIPolar, DIE | Operational Amplifier, 1 Func, 800uV Offset-Max, BIPolar, DIE | Operational Amplifier, 1 Func, 800uV Offset-Max, BIPolar, CDIP8, DIP-8 |
| 厂商名称 | Comlinear Corporation | Comlinear Corporation | Comlinear Corporation | Comlinear Corporation | Comlinear Corporation |
| 包装说明 | QCCN, LCC20,.35SQ | SOP, SOP8,.25 | DIE | DIE | DIP, DIP8,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 20 µA | 20 µA | 20 µA | 20 µA | 20 µA |
| 25C 时的最大偏置电流 (IIB) | 20 µA | 20 µA | 20 µA | 20 µA | 20 µA |
| 最小共模抑制比 | 92 dB | 92 dB | 92 dB | 92 dB | 92 dB |
| 标称共模抑制比 | 100 dB | 100 dB | 100 dB | 100 dB | 100 dB |
| 频率补偿 | YES (AVCL>=10) | YES (AVCL>=10) | YES (AVCL>=10) | YES (AVCL>=10) | YES (AVCL>=10) |
| 最大输入失调电压 | 800 µV | 800 µV | 800 µV | 800 µV | 800 µV |
| JESD-30 代码 | S-CQCC-N20 | R-PDSO-G8 | X-XUUC-N | X-XUUC-N | R-GDIP-T8 |
| 低-失调 | NO | NO | NO | NO | NO |
| 负供电电压上限 | -7 V | -7 V | -7 V | -7 V | -7 V |
| 标称负供电电压 (Vsup) | -5 V | -5 V | -5 V | -5 V | -5 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -55 °C | -55 °C | -40 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED |
| 封装等效代码 | LCC20,.35SQ | SOP8,.25 | DIE OR CHIP | DIE OR CHIP | DIP8,.3 |
| 封装形状 | SQUARE | RECTANGULAR | UNSPECIFIED | UNSPECIFIED | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE | UNCASED CHIP | UNCASED CHIP | IN-LINE |
| 电源 | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V |
| 可编程功率 | YES | YES | YES | YES | YES |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称压摆率 | 350 V/us | 350 V/us | 350 V/us | 350 V/us | 350 V/us |
| 最大压摆率 | 16 mA | 16 mA | 16 mA | 16 mA | 16 mA |
| 供电电压上限 | 7 V | 7 V | 7 V | 7 V | 7 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
| 端子形式 | NO LEAD | GULL WING | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子位置 | QUAD | DUAL | UPPER | UPPER | DUAL |
| 标称均一增益带宽 | 1700000 kHz | 1700000 kHz | 1900 kHz | 1900 kHz | 1900 kHz |
| 最小电压增益 | 20000 | 20000 | 20000 | 20000 | 20000 |
| 宽带 | YES | YES | YES | YES | YES |
| 是否Rohs认证 | 不符合 | 不符合 | - | - | 不符合 |
| JESD-609代码 | e0 | e0 | - | - | e0 |
| 端子数量 | 20 | 8 | - | - | 8 |
| 封装代码 | QCCN | SOP | - | - | DIP |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) |
| 端子节距 | 1.27 mm | 1.27 mm | - | - | 2.54 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
