D Flip-Flop, LVC/LCX/Z Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, CMOS, PDSO8
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Nexperia |
包装说明 | VSON, |
Reach Compliance Code | compliant |
系列 | LVC/LCX/Z |
JESD-30 代码 | R-PDSO-N8 |
JESD-609代码 | e3 |
长度 | 1.35 mm |
逻辑集成电路类型 | D FLIP-FLOP |
湿度敏感等级 | 1 |
位数 | 1 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出极性 | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VSON |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 13.4 ns |
认证状态 | Not Qualified |
座面最大高度 | 0.35 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 1.65 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 0.35 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
触发器类型 | POSITIVE EDGE |
宽度 | 1 mm |
最小 fmax | 200 MHz |
74LVC1G74GS | 74LVC1G74DP | 74LVC1G74DC | 74LVC1G74GD | 74LVC1G74GF | 74LVC1G74GM | 74LVC1G74GN | 74LVC1G74GT | |
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描述 | D Flip-Flop, LVC/LCX/Z Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, CMOS, PDSO8 | D Flip-Flop, LVC/LCX/Z Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, CMOS, PDSO8 | D Flip-Flop, LVC/LCX/Z Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, CMOS, PDSO8 | D Flip-Flop, LVC/LCX/Z Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, CMOS, PDSO8 | D Flip-Flop, LVC/LCX/Z Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, CMOS, PDSO8 | D Flip-Flop, LVC/LCX/Z Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, CMOS, PQCC8 | D Flip-Flop, LVC/LCX/Z Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, CMOS, PDSO8 | D Flip-Flop, LVC/LCX/Z Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, CMOS, PDSO8 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
包装说明 | VSON, | TSSOP, | VSSOP, | VSON, | VSON, | VQCCN, | SON, | VSON, |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli |
系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 代码 | R-PDSO-N8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | S-PQCC-N8 | R-PDSO-N8 | R-PDSO-N8 |
JESD-609代码 | e3 | e4 | e4 | e4 | e3 | e4 | e3 | e3 |
长度 | 1.35 mm | 3 mm | 2.3 mm | 3 mm | 1.35 mm | 1.6 mm | 1.2 mm | 1.95 mm |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
位数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | VSON | TSSOP | VSSOP | VSON | VSON | VQCCN | SON | VSON |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
传播延迟(tpd) | 13.4 ns | 13.4 ns | 13.4 ns | 13.4 ns | 13.4 ns | 13.4 ns | 13.4 ns | 13.4 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.35 mm | 1.1 mm | 1 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.35 mm | 0.5 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Tin (Sn) |
端子形式 | NO LEAD | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.35 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.35 mm | 0.5 mm | 0.3 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 1 mm | 3 mm | 2 mm | 2 mm | 1 mm | 1.6 mm | 1 mm | 1 mm |
最小 fmax | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
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