UVPROM, 8KX8, 70ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | QFJ |
| 包装说明 | WQCCN, LCC32,.45X.55 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 70 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-CQCC-N32 |
| JESD-609代码 | e0 |
| 长度 | 13.97 mm |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WQCCN |
| 封装等效代码 | LCC32,.45X.55 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, WINDOW |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 编程电压 | 12.75 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.556 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.03 mA |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 11.43 mm |
| AM27C64-75LIB | AM27C64-75LC | AM27C64-75LCB | AM27C64-75DC | AM27C64-75DCB | AM27C64-75DIB | AM27C64-75LI | AM27C64-75DI | |
|---|---|---|---|---|---|---|---|---|
| 描述 | UVPROM, 8KX8, 70ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | UVPROM, 8KX8, 70ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | UVPROM, 8KX8, 70ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | UVPROM, 8KX8, 70ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | UVPROM, 8KX8, 70ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | UVPROM, 8KX8, 70ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | UVPROM, 8KX8, 70ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | UVPROM, 8KX8, 70ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QFJ | QFJ | QFJ | DIP | DIP | DIP | QFJ | DIP |
| 包装说明 | WQCCN, LCC32,.45X.55 | WQCCN, LCC32,.45X.55 | WQCCN, LCC32,.45X.55 | WDIP, DIP28,.6 | WDIP, DIP28,.6 | WDIP, DIP28,.6 | WQCCN, LCC32,.45X.55 | WDIP, DIP28,.6 |
| 针数 | 32 | 32 | 32 | 28 | 28 | 28 | 32 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-CQCC-N32 | R-GDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 13.97 mm | 13.97 mm | 13.97 mm | 37.1475 mm | 37.1475 mm | 37.1475 mm | 13.97 mm | 37.1475 mm |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bi |
| 内存集成电路类型 | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 28 | 28 | 28 | 32 | 28 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | WQCCN | WQCCN | WQCCN | WDIP | WDIP | WDIP | WQCCN | WDIP |
| 封装等效代码 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | DIP28,.6 | DIP28,.6 | DIP28,.6 | LCC32,.45X.55 | DIP28,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 12.75 V | 12.75 V | 12.75 V | 12.75 V | 12.75 V | 12.75 V | 12.75 V | 12.75 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.556 mm | 3.556 mm | 3.556 mm | 5.588 mm | 5.588 mm | 5.588 mm | 3.556 mm | 5.588 mm |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 11.43 mm | 11.43 mm | 11.43 mm | 15.24 mm | 15.24 mm | 15.24 mm | 11.43 mm | 15.24 mm |
| 厂商名称 | AMD(超微) | - | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
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