MASK ROM, 512KX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | SAMSUNG(三星) |
零件包装代码 | TSOP2 |
包装说明 | TSOP2, |
针数 | 44 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最长访问时间 | 120 ns |
备用内存宽度 | 8 |
JESD-30 代码 | R-PDSO-G44 |
长度 | 18.41 mm |
内存密度 | 8388608 bit |
内存集成电路类型 | MASK ROM |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 44 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 512KX16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 240 |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 3.3 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 10.16 mm |
K3N4U1000D-TC120 | K3N4U1000D-TE120 | K3N4V1000D-TC10 | K3N4V1000D-TC100 | K3N4V1000D-TE100 | K3N4V1000D-TE10 | K3N4U1000D-TE12 | K3N4U1000D-TC12 | |
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描述 | MASK ROM, 512KX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | MASK ROM, 512KX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | MASK ROM, 512KX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | MASK ROM, 512KX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
包装说明 | TSOP2, | TSOP2, | TSOP2, TSOP44,.46,32 | TSOP2, | TSOP2, | TSOP2, TSOP44,.46,32 | 0.400 INCH, TSOP2-44 | TSOP2, TSOP44,.46,32 |
针数 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 120 ns | 120 ns | 100 ns | 100 ns | 100 ns | 100 ns | 120 ns | 120 ns |
备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 |
长度 | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm |
内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
组织 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 240 | 240 | NOT SPECIFIED | 240 | 240 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 3.3 V | 3.3 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.3 V | 3.3 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 3 V | 3 V | 3 V | 3 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | OTHER | COMMERCIAL | COMMERCIAL | OTHER | OTHER | OTHER | COMMERCIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
厂商名称 | SAMSUNG(三星) | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
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