FG1AA thru FG1MA
SURFACE MOUNT
STANDARD RECOVERY RECTIFIER
FEATURES
REVERSE VOLTAGE – 50 to 1000 Volts
FORWARD CURRENT – 1.0 Ampere
SMA FLAT
SMA FLAT
DIM.
A
B
C
MIN.
0.90
1.25
0.15
2.25
4.80
3.95
0.75
MAX.
1.10
1.65
0.40
2.95
5.60
4.60
1.50
•
Very low profile package – 0.9mm
•
Glass passivated chip
•
For surface mounted applications
•
Low reverse leakage current
•
Low forward voltage drop
•
High current capability
MECHANICAL DATA
D
E
E1
L
•
Case: JEDEC DO-221AC
•
Case Material: “Green” molding compound, UL
•
•
Terminals: Lead Free Plating (Matte Tin Finish.)
•
Reliability tested in accordance with AEC-Q101
•
Component in accordance to RoHs 2002/95/EC
flammability classification 94V-0, (No Br. Sb. Cl.)
Moisture Sensitivity: Level 1 per J-STD-020C
All dimension in millimeter
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
°C
ambient temperature unless otherwise specified.
PARAMETER
Device marking code
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Average Rectified Output Current
@T
L
=130°C
Peak Forward Surge Current 8.3ms single half
sine-wave
Operating junction temperature range
Storage temperature range
SYMBOL FG1AA FG1BA FG1DA FG1GA
Note
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
T
J
T
STG
FG1JA
FG1JA
600
420
600
FG1KA FG1MA UNIT
FG1KA FG1MA
800
560
800
1000
700
1000
---
V
V
V
A
A
°C
°C
FG1AA FG1BA FG1DA FG1GA
50
35
50
100
70
100
200
140
200
400
280
400
1.0
30
-55 to +150
-55 to +150
PARAMETER
Forward Voltage (1)
Leakage Current (1)
TEST CONDITIONS
IF=1.0A
VR=V
DC
Tj=25°C
Tj=25°C
Tj=125°C
SYMBOL
V
F
I
R
Max.
1.1
5
100
UNIT
V
uA
THERMAL CHARACTERISTIC
Typical junction capacitance (2)
Typical thermal resistance _ Junction to Case (3)
Typical thermal resistance _ Junction to Ambient (3)
Typical thermal resistance _ Junction to Lead (3)
SYMBOL
C
J
R
Θ
JC
R
Θ
JA
R
Θ
JL
Typical
10
24
86
15
UNIT
pF
°C/W
°C/W
°C/W
Note :
(1)
(2)
(3)
REV. 1,Sep-2010, KSDP02
300us Pulse width, 2% Duty cycle.
Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
Thermal Resistance test performed in accordance with JESD-51. Unit mounted on 0.75t glass-epoxy substrate with foot print copper
pad. R
Θ
JL
is measured at the lead
of cathode band,
R
Θ
JC
is measured at the top centre of body.
RATING AND CHARACTERISTIC CURVES
FG1AA~FG1MA
FIG.1- FORWARD CURRE NT DERATING CURVE
1.2
35
FIG.2- MAXIMUM NON-REPETITIV E SURGE
CURRENT
AVERAGE FORWARD CURRENT, (A)
1
0.8
0.6
Mounted on glass-epoxy
substrate with 1oz/ft
2
_foot print
copper pad.
0.4
PEAK FORWARD SURGE CURRENT,
(A)
30
25
20
15
10
0.2
RESISTIVE OR
INDUCTIVE LOAD
8.3ms Single Half-Wave
5
0
0
25
50
75
100
125
150
0
1
10
100
LEAD TEMAERATURE, (℃)
NUMBER OF CYCLES AT 60Hz
FIG.3- TYP ICAL FO RWORD CHARACTERISTICS
100
100
FIG.4- TYPICAL JUNCTION CAPACITANCE
INSTANTANEOUS FORWARD
CURRENT, (A)
10
1
CAPACITANCE, (pF)
Tj=125°
C
10
0.1
Tj=25°C
Tj=25°C, f=1MHz
0.01
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
1
1
10
100
INSTANTANEOUS FORWARD VO LTAGE, (V)
REVERSE VO LTAGE, (V)
FIG.5- TYPICAL REVERSE CHARACTERISTICS
0.1
INSTANTANEOUS REVERSE CURRENT, (uA)
Tj=125°C
0.01
Tj=100°C
Tj=75°C
0.001
Tj=50°C
Tj=25°C
0.0001
0.00001
10
30
50
70
90
110
130
PERCENT OF RATED PEAK REVERSE VOLTAGE, (V)
Legal Disclaimer Notice
FG1AA~FG1MA
Important Notice and Disclaimer
LSC reserves the right to make changes to this document and its products and specifications
at any time without notice. Customers should obtain and confirm the latest product
information and specifications before final design, purchase or use.
LSC makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does LSC assume any liability for application
assistance or customer product design. LSC does not warrant or accept any liability with
products which are purchased or used for any unintended or unauthorized application.
No license is granted by implication or otherwise under any intellectual property rights of
LSC.
LSC products are not authorized for use as critical components in life support devices or
systems without express written approval of LSC.
FPGA/CPLD
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