Synchronous DRAM, 2MX32, 5.4ns, CMOS, PDSO86, 0.400 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-86
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | SK Hynix(海力士) |
零件包装代码 | TSOP2 |
包装说明 | TSOP2, |
针数 | 86 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
访问模式 | FOUR BANK PAGE BURST |
最长访问时间 | 5.4 ns |
其他特性 | AUTO/SELF REFRESH |
JESD-30 代码 | R-PDSO-G86 |
JESD-609代码 | e6 |
长度 | 22.238 mm |
内存密度 | 67108864 bit |
内存集成电路类型 | SYNCHRONOUS DRAM |
内存宽度 | 32 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 86 |
字数 | 2097152 words |
字数代码 | 2000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 2MX32 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.194 mm |
自我刷新 | YES |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Bismuth (Sn/Bi) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 10.16 mm |
HY57V563220ALTP-6 | HY57V563220AT-H | HY57V563220ATP-6 | HY57V563220ALT-6 | HY57V563220ATP-H | HY57V563220ALTP-H | HY57V563220AT-6 | HY57V563220ALT-H | |
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描述 | Synchronous DRAM, 2MX32, 5.4ns, CMOS, PDSO86, 0.400 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-86 | Synchronous DRAM, 2MX32, 5.4ns, CMOS, PDSO86, 0.400 INCH, 0.80 MM PITCH, TSOP2-86 | Synchronous DRAM, 2MX32, 5.4ns, CMOS, PDSO86, 0.400 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-86 | Synchronous DRAM, 2MX32, 5.4ns, CMOS, PDSO86, 0.400 INCH, 0.80 MM PITCH, TSOP2-86 | Synchronous DRAM, 2MX32, 5.4ns, CMOS, PDSO86, 0.400 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-86 | Synchronous DRAM, 2MX32, 5.4ns, CMOS, PDSO86, 0.400 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-86 | Synchronous DRAM, 2MX32, 5.4ns, CMOS, PDSO86, 0.400 INCH, 0.80 MM PITCH, TSOP2-86 | Synchronous DRAM, 2MX32, 5.4ns, CMOS, PDSO86, 0.400 INCH, 0.80 MM PITCH, TSOP2-86 |
是否无铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 符合 | 不符合 | 不符合 |
厂商名称 | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) |
零件包装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
包装说明 | TSOP2, | TSOP2, | TSOP2, | TSOP2, | TSOP2, | TSOP2, | TSOP2, | TSOP2, |
针数 | 86 | 86 | 86 | 86 | 86 | 86 | 86 | 86 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | R-PDSO-G86 | R-PDSO-G86 | R-PDSO-G86 | R-PDSO-G86 | R-PDSO-G86 | R-PDSO-G86 | R-PDSO-G86 | R-PDSO-G86 |
长度 | 22.238 mm | 22.238 mm | 22.238 mm | 22.238 mm | 22.238 mm | 22.238 mm | 22.238 mm | 22.238 mm |
内存密度 | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit |
内存集成电路类型 | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 86 | 86 | 86 | 86 | 86 | 86 | 86 | 86 |
字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 2MX32 | 2MX32 | 2MX32 | 2MX32 | 2MX32 | 2MX32 | 2MX32 | 2MX32 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.194 mm | 1.194 mm | 1.194 mm | 1.194 mm | 1.194 mm | 1.194 mm | 1.194 mm | 1.194 mm |
自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 20 | NOT SPECIFIED | 20 | NOT SPECIFIED | 20 | 20 | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
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