UM5304EEXF
Quad Channel Low Capacitance ESD Protection Array
UM5304EEAF
UM5304EEBF
UM5304EECF
General Description
UM5304EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series has been
specifically designed to protect sensitive components which are connected to data and transmission lines from
over-voltage caused by ESD (electrostatic discharge).
The unique design incorporates surge rated, low capacitance steering diodes in a single package. During
transient conditions, the steering diodes direct the transient to either the positive side of the power supply line or
to ground.
The low capacitance array configuration allows the user to protect four high-speed data or transmission lines.
The low inductance construction minimizes voltage overshoot during high current surges. This device is
optimized for ESD protection of portable electronics. They may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (± 15kV air, ± 8kV contact discharge).
SC70-6/SC88/SOT363
SC89-6/SOT563/SOT666
TSOP-6/SOT23-6
Applications
USB 2.0
USB OTG
Monitors and Flat Panel
Displays digital Visual Interface (DVI)
High-Definition Multimedia Interface (HDMI)
SIM Ports IEEE 1394 Firewire Ports
Features
Transient protection for high-speed data lines to
IEC 61000-4-2 (ESD) ± 15kV (air), ± 8kV (contact)
Array of surge rated diodes
Protects up to four I/O lines & power line
Low capacitance (<2pF) for high-speed interfaces
No insertion loss to 2.0GHz
Low leakage current and clamping voltage
Low operating voltage: 5.0V
Pin Configurations
Top View
M: Monthly Code
UM5304EEAF
SC70-6/SC88/SOT363
M: Monthly Code
UM5304EEBF
SC89-6/SOT563/SOT666
XX: Weekly Code
UM5304EECF
TSOP-6/SOT23-6
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UM5304EEXF
Ordering Information
Part Number
UM5304EEAF
UM5304EEBF
UM5304EECF
Working
Voltage
5.0V
Packaging Type
SC70-6/ SC88/ SOT363
SC89-6/SOT563/SOT666
TSOP-6/SOT23-6
Channel
4
Marking
Code
UAP
UBP
UCP
Shipping Qty
3000/7
Inch Tape & Reel
Absolute Maximum Ratings
Peak Pulse Power (tp = 8/20µS)
Peak Pulse Current (tp = 8/20µS )
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
Operating Temperature
Storage Temperature
P
pk
I
PP
V
ESD
T
J
T
STG
150
6
15
8
-55 to +125
-55 to +150
Watts
A
kV
°C
°C
Electrical Characteristics
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Junction Capacitance
V
RWM
V
BR
I
R
V
C
V
C
C
j
It = 1mA Pin 5 to 2
V
RWM
= 5V, T=25°C Pin 5 to 2
I
PP
= 1A, 8/20µS Any pin to pin 2
I
PP
= 6A, 8/20µS Any pin to pin 2
V
R
= 0V, f = 1MHz Any I/O pin
to pin 2
V
R
= 0V, f = 1MHz Between I/O
pins
6.0
5.0
V
V
2
15
25
2
1
µA
V
V
pF
pF
Note 1: I/O pins are pin 1, 3, 4, and 6
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UM5304EEXF
Typical Operating Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
110
Power Derating Curve
100
90
% of Rated Power or Ipp
10
Peak Pulse Power
–
P
PK
(kW)
80
70
60
50
40
30
20
10
1
0.1
0.01
0.1
1
10
Pulse Duration
–
t
p
(µs)
100
1000
0
0
25
50
75
100
125
150
Ambient Temperature - T
A
(
℃
)
Pulse Waveform
110
100
90
80
Percent of Ipp
Clamping Voltage
–
Vc (V)
Clamping Voltage vs. Peak Pulse Current
Waveform
Parameters:
tr=8μs
td=20μs
28
24
20
16
12
8
0
1
2
3
4
Pin 1, 3, 4, 6 to
Pin 2
70
60
50
40
30
20
10
0
0
5
10
e
-t
td=I
PP
/2
Pin 5 to Pin 2
Waveform
Parameters:
tr=8μs
td=20μs
5
6
15
Time (µs)
20
25
30
Peak Pulse Current
–
Ipp (A)
Forward Voltage vs. Forward Current
8
Forward Voltage
–
V
F
(V)
Junction Capacitance vs. Reverse Voltage
3
f=1MHz
2.5
6
Capacitance
–
C
j
(pF)
2
1.5
1
0.5
0
0
1
2
3
4
5
Reverse Voltage
–
V
R
(V)
Any I/O Pin
to Pin2
4
2
0
Waveform
Parameters:
tr=8μs
td=20μs
0
1
2
3
4
5
6
Forward Current
–
I
F
(A)
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UM5304EEXF
Applications Information
Device Connection Options for Protection of Four High-Speed Data Lines
This device is designed to protect data lines by clamping them to a fixed reference. When the voltage on the
protected line exceeds the reference voltage the steering diodes are forward biased, conducting the transient
current away from the sensitive circuitry. Data lines are connected at pins 1, 3, 4 and 6. Pin 2 should be
connected directly to a ground plane. The path length is kept as short as possible to minimize parasitic
inductance. The positive reference is connected at pin 5. The options for connecting the positive reference are as
follows:
To protect data lines and the power line, connect pin 5 directly to the positive supply rail (VCC). In this
configuration the data lines are referenced to the supply voltage.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is
composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the
solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the
requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly
techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can
cause degradation of the solder joint.
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UM5304EEXF
Package Information
UM5304EEAF
SC70-6/SC88/SOT363
Symbol
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
θ
Land Pattern
DIMENSIONS
MILLIMETERS
INCHES
Min
Max
Min
Max
0.900
1.100
0.035 0.043
0.000
0.100
0.000 0.004
0.900
1.000
0.035 0.039
0.150
0.350
0.006 0.014
0.080
0.150
0.003 0.006
2.000
2.200
0.079 0.087
1.150
1.350
0.045 0.053
2.150
2.450
0.085 0.096
0.650REF
0.026REF
1.200
1.400
0.047 0.055
0.525REF
0.021REF
0.260
0.460
0.010 0.018
0°
8°
0°
8°
Tape and Reel Specificatio
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