UM50125/50129
Single Line ESD Protection Diode Array
UM50125
SOD523 1.2×0.8
UM50129
DFN2/FBP2 1.0×0.6
General Description
The UM50125/50129 ESD protection diode is designed to replace multilayer varistors (MLVs) in
portable instrumentation, notebook computers, digital power meter, digital camera and
communication systems. They feature large cross-sectional area junctions for conducting high
transient currents, offer desirable electrical characteristics for board level protection, such as fast
response time, lower operating voltage, lower clamping voltage and no device degradation when
compared to MLVs. The UM50125/50129 ESD protection diode protects sensitive semiconductor
components from damage or upset due to electrostatic discharge (ESD) and other voltage induced
transient events. The UM50125 is available in SOD523 package and the UM50129 is available in
DFN2/FBP2 1.0×0.6 (compatible with SOD923 & SOD882) package, both with working
voltages of 12 volt. It gives designer the flexibility to protect one unidirectional line in
applications where arrays are not practical. Additionally, it may be “sprinkled” around the board
in applications where board space is at a premium. It may be used to meet the ESD immunity
requirements of IEC 61000-4-2, ±30kV air, ±30kV contact discharge.
Applications
Cell Phone Handsets and Accessories
Notebooks, Desktops and Servers
Portable Instrumentation and
Accessories
Digital Power Meter
Digital Cameras
Communication Systems
Features
Transient protection for data lines to
IEC 61000-4-2 (ESD):
±30kV (air), ±30kV (contact)
Small package for use in portable electronics
Suitable replacement for MLV’s in ESD
protection applications
Protect one I/O or power line
Low clamping voltage
Stand off voltage:12V
Low leakage current
Solid-state silicon-avalanche technology
Pin Configurations
Top View
UM50125
SOD523
1.2×0.8
UM50129
DFN2/FBP2 1.0×0.6
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UM50125/50129
Ordering Information
Part
Number
UM50125
UM50129
Working
Voltage
12.0V
12.0V
Packaging Type
SOD523 1.2×0.8 mm
2
DFN2/FBP2 1.2×0.8 mm
2
Channel
1
1
Marking
Code
ZA
EA
Shipping Qty
3000pcs/7 Inch
Tape & Reel
5000pcs/7 Inch
Tape & Reel
Absolute Maximum Ratings
Rating
Peak Pulse Power (tp = 8/20μs)
Maximum Peak Pulse Current (t=8/20μs)
Lead Soldering Temperature
Operating Temperature
Storage Temperature
Symbol
P
PK
I
PP
T
L
T
J
T
STG
Value
140
5.9
260 (10 sec.)
-55 to +125
-55 to +150
Units
Watts
Amps
°C
°C
°C
Symbol Definition
Parameter
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
pp
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ V
RWM
Breakdown Voltage @ I
t
Test Current
Forward Current
Forward Voltage @ I
F
Peak Power Dissipation
Max. Capacitance @ V
R
= 0V, f = 1MHz
Symbol
I
PP
V
C
V
RWM
I
R
V
BR
I
t
I
F
V
F
P
PK
C
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UM50125/50129
Electrical Characteristics
(T=25°C, Device for 12.0V Reverse Stand-off Voltage)
Parameter
Symbol
Conditions
Reverse Stand-Off
V
RWM
Voltage
Reverse Breakdown
V
BR
It = 1mA
Voltage
Reverse Leakage Current
Clamping Voltage
Junction Capacitance
I
R
V
C
C
J
V
RWM
= 12V, T=25°C
I
PP
=5.9A, t
p
= 8/20μS
V
R
= 0V, f = 1MHz
20
Min
Typ
Max
12
Unit
V
V
μA
V
pF
16
18
0.5
23
30
Applications Information
Device Connection Options
UM50125/50129 ESD protection diode is designed to protect one data, I/O, or power supply line.
The device is unidirectional and may be used on lines where the signal polarity is above ground.
The cathode dot should be placed towards the line that is to be protected.
Circuit Board Layout Recommendations for Suppression of ESD
Good circuit board layout is critical for the suppression of ESD induced transients. The following
guidelines are recommended:
1. Place the TVS near the input terminals or connectors to restrict transient coupling.
2. Minimize the path length between the TVS and the protected line.
3. Minimize all conductive loops including power and ground loops.
4. The ESD transient return path to ground should be kept as short as possible.
5. Never run critical signals near board edges.
6. Use ground planes whenever possible. For multilayer printed-circuit boards, use ground
vias.
7. Keep parallel signal paths to a minimum.
8. Avoid running protection conductors in parallel with unprotected conductor.
9. Minimize all printed-circuit board conductive loops including power and ground loops.
10. Avoid using shared transient return paths to a common ground point.
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UM50125/50129
Package Information
UM50125 SOD523 1.2×0.8
Outline Drawing
Symbol
A
A1
b
c
D
E
E1
E2
L
θ
DIMENSIONS
MILLIMETERS
Min
Max
0.510
0.770
0.500
0.700
0.250
0.350
0.080
0.150
0.750
0.850
1.100
1.300
1.500
1.700
0.200REF
0.010
0.070
7°REF
INCHES
Min
Max
0.020
0.031
0.020
0.028
0.010
0.014
0.003
0.006
0.030
0.033
0.043
0.051
0.059
0.067
0.008REF
0.001
0.003
7°REF
Land Pattern
NOTES:
1. Compound dimension: 1.20×0.80;
2. Unit: mm;
3. General tolerance ±0.05mm unless otherwise specified;
4. The layout is just for reference.
Tape and Reel Orientation
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UM50125/50129
UM50129 DFN2 1.0×0.6
Outline Drawing
Symbol
A
A1
b
D
E
E1
e
R
DIMENSIONS
MILLIMETERS
INCHES
Min
Max
Min
Max
0.470
0.530
0.019
0.021
0.000
0.050
0.000
0.002
0.200
0.300
0.008
0.012
0.950
1.075
0.037
0.042
0.550
0.675
0.022
0.027
0.450
0.550
0.018
0.022
0.400
0.016
0.050
0.150
0.002
0.006
Land Pattern
NOTES:
1. Compound dimension: 1.00×0.60;
2. Unit: mm;
3. General tolerance ±0.025mm unless otherwise specified;
4. The layout is just for reference.
Tape and Reel Orientation
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