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935275051112

产品描述8 I/O, PIA-GENERAL PURPOSE, PDSO16
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小155KB,共25页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

935275051112概述

8 I/O, PIA-GENERAL PURPOSE, PDSO16

935275051112规格参数

参数名称属性值
是否Rohs认证符合
厂商名称NXP(恩智浦)
包装说明TSSOP,
Reach Compliance Codecompliant
ECCN代码EAR99
JESD-30 代码R-PDSO-G16
JESD-609代码e4
长度5 mm
湿度敏感等级1
I/O 线路数量8
端口数量1
端子数量16
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
座面最大高度1.1 mm
最大供电电压5.5 V
最小供电电压2.3 V
标称供电电压3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
宽度4.4 mm
uPs/uCs/外围集成电路类型PARALLEL IO PORT, GENERAL PURPOSE

935275051112相似产品对比

935275051112 935283047118 935275051118 935275049518 935275049112 935275049118 935275049512 935289192118 935277801118 935275048118
描述 8 I/O, PIA-GENERAL PURPOSE, PDSO16 8 I/O, PIA-GENERAL PURPOSE, PQCC16 8 I/O, PIA-GENERAL PURPOSE, PDSO16 8 I/O, PIA-GENERAL PURPOSE, PDSO16 8 I/O, PIA-GENERAL PURPOSE, PDSO16 8 I/O, PIA-GENERAL PURPOSE, PDSO16 8 I/O, PIA-GENERAL PURPOSE, PDSO16 8 I/O, PIA-GENERAL PURPOSE, PDSO16, 4.40 MM, PLASTIC, MS-153, SOT403-1, TSSOP-16 8 I/O, PIA-GENERAL PURPOSE, PDSO16, 4.40 MM, PLASTIC, MS-153, SOT403-1, TSSOP-16 8 I/O, PIA-GENERAL PURPOSE, PQCC16
包装说明 TSSOP, HVQCCN, 4.40 MM, PLASTIC, MS-153, SOT403-1, TSSOP-16 7.50 MM, PLASTIC, MS-013, SOT162-1, SOP-16 7.50 MM, PLASTIC, MS-013, SOT162-1, SOP-16 SOP-16 7.50 MM, PLASTIC, MS-013, SOT162-1, SOP-16 4.40 MM, PLASTIC, MS-153, SOT403-1, TSSOP-16 4.40 MM, PLASTIC, MS-153, SOT403-1, TSSOP-16 HVQCCN,
Reach Compliance Code compliant unknow compliant unknown unknown unknown unknown unknown unknown unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 代码 R-PDSO-G16 S-PQCC-N16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 S-PQCC-N16
长度 5 mm 3 mm 5 mm 10.3 mm 10.3 mm 10.3 mm 10.3 mm 5 mm 5 mm 4 mm
I/O 线路数量 8 8 8 8 8 8 8 8 8 8
端口数量 1 1 1 1 1 1 1 1 1 1
端子数量 16 16 16 16 16 16 16 16 16 16
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP HVQCCN TSSOP SOP SOP SOP SOP TSSOP TSSOP HVQCCN
封装形状 RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
座面最大高度 1.1 mm 1 mm 1.1 mm 2.65 mm 2.65 mm 2.65 mm 2.65 mm 1.1 mm 1.1 mm 1 mm
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
标称供电电压 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING NO LEAD GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING NO LEAD
端子节距 0.65 mm 0.5 mm 0.65 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 DUAL QUAD DUAL DUAL DUAL DUAL DUAL DUAL DUAL QUAD
宽度 4.4 mm 3 mm 4.4 mm 7.5 mm 7.5 mm 7.5 mm 7.5 mm 4.4 mm 4.4 mm 4 mm
uPs/uCs/外围集成电路类型 PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
厂商名称 NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)

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