NAND Gate, CMOS, PDIP14,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | LG Semicon Co Ltd |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDIP-T14 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | NAND GATE |
最大I(ol) | 0.004 A |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 2/6 V |
Prop。Delay @ Nom-Sup | 23 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
GD74HC20 | GD54HC20J | GD74HCT20 | GD74HC20J | GD74HCT20J | GD74HCT20D | GD54HCT20J | GD74HC20D | |
---|---|---|---|---|---|---|---|---|
描述 | NAND Gate, CMOS, PDIP14, | NAND Gate, CMOS, CDIP14, | NAND Gate, CMOS, PDIP14, | NAND Gate, CMOS, CDIP14, | NAND Gate, CMOS, CDIP14, | NAND Gate, CMOS, PDSO14, | NAND Gate, CMOS, CDIP14, | NAND Gate, CMOS, PDSO14, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDSO-G14 | R-XDIP-T14 | R-PDSO-G14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
最大I(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C |
最低工作温度 | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP | SOP | DIP | SOP |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | SOP14,.25 | DIP14,.3 | SOP14,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
电源 | 2/6 V | 2/6 V | 5 V | 2/6 V | 5 V | 5 V | 5 V | 2/6 V |
Prop。Delay @ Nom-Sup | 23 ns | 26 ns | 30 ns | 23 ns | 30 ns | 30 ns | 40 ns | 23 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | NO | NO | NO | NO | NO | NO | NO | NO |
表面贴装 | NO | NO | NO | NO | NO | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | LG Semicon Co Ltd | - | - | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd |
包装说明 | - | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 | DIP, DIP14,.3 | SOP, SOP14,.25 |
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