BZX584B5V1 SERIES
SURFACE MOUNT SILICON ZENER DIODES
VOLTAGE
5.1~8.2 Volts
POWER
200 mWatts
FEATURES
• Planar Die construction
• 200mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in comply with EU RoHS 2011/65/EU directives
• Green molding compound as per IEC61249 Std. . (Halogen Free)
0.006(0.15)
0.002(0.05)
0.067(1.70)
0.059(1.50)
0.034(0.85)
0.029(0.75)
0.014(0.35)
0.009(0.25)
0.026(0.65)
0.021(0.55)
0.050(1.25)
0.045(1.15)
MECHANICAL DATA
0.20 MIN.
• Case: SOD-523, Molded Plastic
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx weight: 0.00005 ounces, 0.001 grams
1
2
Cathode
Anode
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Maximum Power Dissipation (Notes A) at 25
O
C
Operating Junction and StorageTemperature Range
Symbol
Value
200
-55 to +150
Units
mW
O
P
D
T
J
C
ELECTRICAL CHARACTERISTICS
Nominal Zener Voltage
Part Number
Nom. V
BZX584B5V1
BZX584B5V6
BZX584B8V2
5.1
5.6
8.2
V
Z
@ I
ZT
Min. V
5
5.49
8.04
Max. V
5.2
5.71
8.36
60
40
15
Max. Zener Impedance
Z
ZT
@ I
ZT
mA
5
5
5
480
400
80
Z
ZK
@ I
ZK
mA
1
1
1
Max. Reverse
Leakage Current
I
R
@ V
R
A
2
1
0.7
V
2
2
5
Marking
Code
W9
WA
WE
NOTES :
A. Mounted on an FR4 PCB, single-sided copper, mini pad.
October 29,2013-REV.01
PAGE . 1
BZX584B5V1 SERIES
Part No_packing code_Version
BZX584B5V1_R1_00001
BZX584B5V1_R2_00001
For example :
RB500V-40_R2_00001
Part No.
Serial number
Version code means HF
Packing size code means 13"
Packing type means T/R
Packing Code
XX
Packing type
Tape and Ammunition Box
(T/B)
Tape and Reel
(T/R)
Bulk Packing
(B/P)
Tube Packing
(T/P)
Tape and Reel (Right Oriented)
(TRR)
Tape and Reel (Left Oriented)
(TRL)
FORMING
1
st
Code
A
R
B
T
S
L
F
Packing size code
N/A
7"
13"
26mm
52mm
PANASERT T/B CATHODE UP
(PBCU)
PANASERT T/B CATHODE DOWN
(PBCD)
Version Code
XXXXX
2
nd
Code
HF or RoHS
1
st
Code 2
nd
~5
th
Code
0
1
2
X
Y
U
D
HF
RoHS
0
1
serial number
serial number
October 29,2013-REV.01
PAGE . 4
BZX584B5V1 SERIES
Disclaimer
•
Reproducing and modifying information of the document is prohibited without permission
from Panjit International Inc..
•
Panjit International Inc. reserves the rights to make changes of the content herein the
document anytime without notification. Please refer to our website for the latest
document.
•
Panjit International Inc. disclaims any and all liability arising out of the application or use of
any product including damages incidentally and consequentially occurred.
•
Panjit International Inc. does not assume any and all implied warranties, including warranties
of fitness for particular purpose, non-infringement and merchantability.
•
Applications shown on the herein document are examples of standard use and operation.
Customers are responsible in comprehending the suitable use in particular applications.
Panjit International Inc. makes no representation or warranty that such applications will be
suitable for the specified use without further testing or modification.
•
The products shown herein are not designed and authorized for equipments requiring high
level of reliability or relating to human life and for any applications concerning life-saving
or life-sustaining, such as medical instruments, transportation equipment, aerospace
machinery et cetera. Customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Panjit International Inc. for any damages
resulting from such improper use or sale.
•
Since Panjit uses lot number as the tracking base, please provide the lot number for tracking
when complaining.
October 29,2013-REV.01
PAGE . 5
NXP MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
