Microcontroller, 8-Bit, MROM, MOS, PDIP64, 0.750 INCH, SHRINK, PLASTIC, DIP-64
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | NEC(日电) |
零件包装代码 | DIP |
包装说明 | 0.750 INCH, SHRINK, PLASTIC, DIP-64 |
针数 | 64 |
Reach Compliance Code | compliant |
具有ADC | YES |
地址总线宽度 | 16 |
位大小 | 8 |
最大时钟频率 | 10 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | 8 |
JESD-30 代码 | R-PDIP-T64 |
JESD-609代码 | e0 |
I/O 线路数量 | 53 |
端子数量 | 64 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SDIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
ROM可编程性 | MROM |
座面最大高度 | 5.08 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 2.7 V |
表面贴装 | NO |
技术 | MOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 1.778 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 19.05 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
UPD78012FYCW-XXX | UPD78018FYCW-XXX | UPD78018FYGC-XXX-AB8 | UPD78012FYGC-XXX-AB8 | UPD78014FYCW-XXX | UPD78015FYGC-XXX-AB8 | |
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描述 | Microcontroller, 8-Bit, MROM, MOS, PDIP64, 0.750 INCH, SHRINK, PLASTIC, DIP-64 | Microcontroller, 8-Bit, MROM, MOS, PDIP64, 0.750 INCH, SHRINK, PLASTIC, DIP-64 | Microcontroller, 8-Bit, MROM, MOS, PQFP64, 14 X 14 MM, PLASTIC, QFP-64 | Microcontroller, 8-Bit, MROM, MOS, PQFP64, 14 X 14 MM, PLASTIC, QFP-64 | Microcontroller, 8-Bit, MROM, MOS, PDIP64, 0.750 INCH, SHRINK, PLASTIC, DIP-64 | Microcontroller, 8-Bit, MROM, MOS, PQFP64, 14 X 14 MM, PLASTIC, QFP-64 |
厂商名称 | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) |
零件包装代码 | DIP | DIP | QFP | QFP | DIP | QFP |
包装说明 | 0.750 INCH, SHRINK, PLASTIC, DIP-64 | 0.750 INCH, SHRINK, PLASTIC, DIP-64 | 14 X 14 MM, PLASTIC, QFP-64 | 14 X 14 MM, PLASTIC, QFP-64 | 0.750 INCH, SHRINK, PLASTIC, DIP-64 | 14 X 14 MM, PLASTIC, QFP-64 |
针数 | 64 | 64 | 64 | 64 | 64 | 64 |
Reach Compliance Code | compliant | unknown | compliant | unknown | compliant | compliant |
具有ADC | YES | YES | YES | YES | YES | YES |
地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 |
最大时钟频率 | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | R-PDIP-T64 | R-PDIP-T64 | S-PQFP-G64 | S-PQFP-G64 | R-PDIP-T64 | S-PQFP-G64 |
I/O 线路数量 | 53 | 53 | 53 | 53 | 53 | 53 |
端子数量 | 64 | 64 | 64 | 64 | 64 | 64 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SDIP | SDIP | QFP | QFP | SDIP | QFP |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE |
封装形式 | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | FLATPACK | FLATPACK | IN-LINE, SHRINK PITCH | FLATPACK |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM |
座面最大高度 | 5.08 mm | 5.08 mm | 2.85 mm | 2.85 mm | 5.08 mm | 2.85 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
表面贴装 | NO | NO | YES | YES | NO | YES |
技术 | MOS | MOS | MOS | MOS | MOS | MOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 1.778 mm | 1.778 mm | 0.8 mm | 0.8 mm | 1.778 mm | 0.8 mm |
端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | QUAD |
宽度 | 19.05 mm | 19.05 mm | 14 mm | 14 mm | 19.05 mm | 14 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 | 不符合 |
JESD-609代码 | e0 | - | e0 | - | e0 | e0 |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
端子面层 | TIN LEAD | - | TIN LEAD | - | TIN LEAD | TIN LEAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
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