SGM3123
White LED Driver with
Low Dropout Current Source
GENERAL DESCRIPTION
The SGM3123 low-dropout bias supply for white LEDs
is a high-performance alternative to the simple ballast
resistors used in conventional white LED designs. It is
optimized
for
low
power
keypad
and
portable
backlighting applications.
The SGM3123 uses an internal resistor to set the bias
current for four LEDs, which are matched to ±5%. The
SGM3123's advantages over ballast resistors include
much lower bias variation with supply voltage variation,
significantly lower dropout voltage, and in some
applications, significantly improved efficiency.
The SGM3123 requires only a 40mV dropout voltage at
a 20mA load on each output to match the LED
brightness.
The SGM3123 is available in Green TQFN-3×3-16L
package. It operates over an ambient temperature range
of -40℃ to +85℃.
FEATURES
●
Support up to 4 LEDs
●
Low 40mV Dropout at 20mA
●
Less than ±5% LED Current Matching
●
Simple LED Brightness Control
●
Low Shutdown Current
●
2.5V to 5.0V Supply Voltage Range
●
Thermal Shutdown Protection
●
Operating Temperature Range: -40℃ to +85℃
●
Available in Green TQFN-3×3-16L Package
APPLICATIONS
Wireless Handsets
MP3, MP4, and PMP
Cellular Phones
Portable Communication Devices
Digital Cameras, Camcorders
PDAs, Palmtops, and Handy Terminals
LED/Display Back Light Driver
LEDs for Camera Flash
Battery-Powered Equipment
SG Micro Corp
www.sg-micro.com
REV. A. 2
SGM3123
PACKAGE/ORDERING INFORMATION
MODEL
SGM3123
ORDER NUMBER
SGM3123YTQ16G/TR
PACKAGE
DESCRIPTION
TQFN-3×3-16L
White LED Driver with
Low Dropout Current Source
SPECIFIED
TEMPERATURE
RANGE
-40°C to +85°C
PACKAGE
OPTION
Tape and Reel, 3000
MARKING
INFORMATION
3123TQ
ABSOLUTE MAXIMUM RATINGS
V
IN
to GND……………….…………...…..….………….-0.3V to 6V
The Other Pins to GND………………....…………….. -0.3V to 6V
Storage Temperature Range...….….……..….... -65℃ to +150℃
Junction Temperature…………….……….……….………...150℃
Operating Temperature Range...……….….……. -40℃ to +85℃
Power Dissipation
(1)
CAUTION
This integrated circuit can be damaged by ESD if you don’t pay
attention to ESD protection. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because
very small parametric changes could cause the device not to
meet its published specifications.
SGMICRO reserves the right to make any change in circuit
design, specification or other related things if necessary without
notice at any time. Please contact SGMICRO sales office to get
the latest datasheet.
, P
D
@ T
A
= 25℃
TQFN-3×3-16L ….............................................................1.47W
(1)
Package Thermal Resistance
TQFN-3×3-16L,
θ
JA
………….….…………………..….….68℃/W
Lead Temperature (Soldering 10 sec)
…………………………………...…….…….…....………….. 260℃
ESD Susceptibility
HBM……………………………………….…………..………4000V
MM………………………………………….………..…………400V
NOTES:
1. The thermal resistance figures are for general reference only.
Actual thermal characteristics may vary with the PCB layout,
size of metal trace, the thermal conduction path between metal
layers and the environment of the system.
2. Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at
these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
SG Micro Corp
www.sg-micro.com
2
SGM3123
PIN CONFIGURATION
(TOP VIEW)
NC
12
VIN
GND
EN
EN
13
14
NC
11
NC
10
NC
9
White LED Driver with
Low Dropout Current Source
8
7
VOUT
PGND
LED1
LED2
GND
15
16
1
NC
2
NC
3
4
6
5
LED4 LED3
TQFN-3×3-16L
PIN DESCRIPTION
PIN
1, 2, 9, 10,
11, 12
3, 4, 5, 6
7
8
13
14
15, 16
Exposed
Pad
NAME
NC
LED1-LED4
PGND
VOUT
VIN
GND
EN
GND
No Internal Connection.
LED1-LED4 Output Pin. Connect to LED1-LED4’s cathode. 20mA constant current
output. They are high impedance when EN is low.
Power Ground.
Output Voltage Source for LED1 to LED4.
Supply Voltage Input.
Analog Ground.
Enable Input (Active High).
Exposed pad should be soldered to PCB board and connected to GND.
FUNCTION
SG Micro Corp
www.sg-micro.com
3
SGM3123
White LED Driver with
Low Dropout Current Source
ELECTRICAL CHARACTERISTICS
(V
IN
= 3.7V, T
A
= +25°C, unless otherwise noted.)
PARAMETER
Operation Voltage Range
Shutdown Supply Current
LED Sink Current
Quiescent Power Supply Current
LED Dropout Voltage
LED Current Deviation Matching
OPT
OPT Hysteresis
Input High Voltage at EN
Input Low Voltage at EN
V
IH
V
IL
V
EN
> V
IH
for enable IH
V
EN
< V
IL
for disable IL
1.5
0.4
D
LED
SYMBOL
V
IN
I
SHDN
I
LED
I
Q
I
LED
= 0
I
LED
= 20mA, V
LED
@ I
LEDn
= 90% × I
LED
-5
150
10
V
EN
< 0.4V
18
CONDITIONS
MIN
2.5
1
20
190
40
90
+5
22
TYP
MAX
5.0
UNITS
V
μA
mA
μA
mV
%
°C
°C
V
V
SG Micro Corp
www.sg-micro.com
4
SGM3123
White LED Driver with
Low Dropout Current Source
TYPICAL PERFORMANCE CHARACTERISTICS
LED Current vs. Input Voltage
30
25
LED Current (mA)
20
15
10
5
0
2
2.5
3
3.5
4
4.5
Input Voltage (V)
5
5.5
LED1
LED2
LED3
LED4
LED Current vs. Temperature
30
LED Current (mA)
25
20
15
10
-40
-15
10
35
60
85
Temperature (℃)
Supply Current vs. Supply Voltage
240
Supply Current (μA)
180
120
60
0
1.5
2.5
3.5
4.5
Supply Voltage (V)
5.5
SG Micro Corp
www.sg-micro.com
5
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