SCOPE：
This specification applies to the Pb Free Chip lnductors for
MFI-322522C-SERIES
PRODUCT INDENTIFICATION
MFI- 322522 C - 100 K
①
②
③
④ ⑤
①
Product Code
②
Dimensions Code
③
Current Type
④
Inductance Code
⑤
Tolerance Code
(1) SHAPES AND DIMENSIONS
A: 3.2±0.3
B: 2.5±0.2
C: 2.2±0.2
D: 1.9±0.1
E: 0.4Typ.
F: 0.6Typ.
mm
mm
mm
mm
mm
mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS
L,Q: HP 4285A PRECISION LCR METER
SRF : HP 4291B IMPEDANCE ANALYZER
(or equivalent)
(or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3) CHARACTERISTICS
(3)-1 Ambient temperature
…….........
＋60℃
Max.
(3)-2 Operate temperature range ......
－40℃½＋105℃
(Including self temp. rise)
(3)-3 Storage temperature range ......
－40℃½＋105℃
MAG.LAYERS
MFI-322522C-SERIES
Page 1/6
TABLE 1
MAGLAYERS
PT/NO.
MFI-322522C-R15□
MFI-322522C-R22□
MFI-322522C-R33□
MFI-322522C-R47□
MFI-322522C-1R0□
MFI-322522C-1R5□
MFI-322522C-2R2□
MFI-322522C-3R3□
MFI-322522C-4R7□
MFI-322522C-6R8□
MFI-322522C-100□
MFI-322522C-150□
MFI-322522C-220□
MFI-322522C-330□
MFI-322522C-470□
MFI-322522C-560□
MFI-322522C-680□
MFI-322522C-820□
MFI-322522C-101□
MFI-322522C-151□
MFI-322522C-221□
MFI-322522C-331□
Inductance
L(μH)
0.15
0.22
0.33
0.47
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
56
68
82
100
150
220
330
Percent
Tolerance
M
M
M,N
M
M
M
M
K,M
K,M
K,M
K
K
K
K
K
K
K
K
K
K
K
K
Quality
Min.
5
5
5
5
10
10
10
10
15
15
15
15
15
15
15
15
15
15
15
20
20
20
L,Q Freq.
(MHz)
25.2
25.2
25.2
25.2
7.96
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
0.796
0.796
0.796
0.796
SRF
(MHz)Min.
400
250
300
150
100
80
68
54
46
38
30
26
21
17
14
13
12
10
10
7
6
5
DCR
(Ω) Max.
0.25
0.30
0.40
0.30
0.30
0.30
0.30
0.35
0.45
0.50
0.80
1.6
2.2
2.8
3.2
5.0
5.0
7.0
7.5
11
14
21
IDC
(mA) Max.
1350
1150
850
1000
850
700
600
500
430
360
300
250
210
170
150
120
120
110
100
85
70
60
※
1.
□
Specify the inductance tolerance,K(±10%),M(±20%),N(±30%)
2.IDC:Based on inductance change(△L/L0:≦-10%) and
Based on temperature rise(△T:20℃ Typ.)
MAG.LAYERS
MFI-322522C-SERIES
Page-2/6
(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM
SPECIFICATION
TEST DETAILS
Soldered sample on PC board to be bend
down to 2mm as below drawing.
Bending test
Appearance : No looseness and
damage
The sample shall be subject to
“drop
test”
illustrated in following figure.
At the completion of the
“drop
test”, there
shall be no abnormality in functioning.
Appearance : No looseness
Free drop
Drop test
Apply 4.9N load for 5 Sec, as shown by
following figure.
Pressing strength
Appearance : No looseness and
damage
Appearance : No looseness
Vibration test
Inductance change rate :
△L/L0≦±5%
Appearance : No looseness and
damage
Inductance change rate :
△L/L0≦±5%
Appearance : No looseness and
damage
Not less than 90% of the electrode
sections shall be newly coated
with solder smoothly when the
sample is taken out of the solder
bath.
Submit the sample to a vibration test in X, Y
and Z directions, 2 hours for each direction.
Vibration freq.: 10½55Hz
Amplitude : 1.5mm
Dipping the sample into solder bath.
Pre-heat : 150+0/-20℃, 2 minutes.
Soak into the solder bath: 260±5℃, 10±1
seconds.
Resistance to
soldering heat
Solder ability test
Dipping the sample into solder bath.
Pre-heat : 150+0/-20℃, 2 minutes.
Soak into the solder bath: 230±5℃, 4±1
seconds.
MAG.LAYERS
MFI-322522C-SERIES
Page-3/6
1m
Inductance change rate :
△L/L0≦±5%
CLIMATIC
TEST ITEM
SPECIFICATION
TEST DETAILS
Thermal shock
Exposure sample at the conditions in the figure
Appearance : No looseness
below, characteristics are measured after the
Inductance change rate :
ambient air exposure of 1 or 2 hours.
△L/L0≦±5%
100 cycles of +85℃ for 30 minutes, -40℃ for 30
Q change rate :
△Q/Q0≦±30%
minutes.
Low temperature
storage
Appearance : No looseness
Inductance change rate :
△L/L0≦±5%
Q change rate :△Q/Q0≦±30%
Exposure sample at -40℃, for 1000 hours.
Characteristics are measured after the ambient
air exposure of 1 or 2 hours.
High temperature
storage
Appearance : No looseness
Exposure sample at 85℃, for 1000 hours.
Inductance change rate :
Characteristics are measured after the ambient
△L/L0≦±5%
air exposure of 1 or 2 hours.
Q change rate :
△Q/Q0≦±30%
Moisture storage
Appearance : No looseness
Inductance change rate :
△L/L0≦±5%
Q change rate :△Q/Q0≦±30%
Exposure sample at 60℃, 95%RH for 1000 hours.
Characteristics are measured after the ambient
air exposure of 1 or 2 hours.
MAG.LAYERS
MFI-322522C-SERIES
Page-4/6
(5) LAND DIMENSION (Ref.)
(Please use this product by reflow soldering)
(5)-1 RECOMMENDED FOOTPRINT
(5)-2 RECOMMENDED REFLOW PATTERN
T e m p e ra tu r e (
℃
)
300
260
200
150
100
50
T im e
1 to 4 m in .
1 0 se c
m o r e th a n 2 m in .
P r e h e a t in g
S o ld in g
260
℃
N a tu r a l C o o l i n g
(5)-3 IRON SOLDERING
Use a solder iron of less than 30W when soldering ,do not allow the soldering
iron tip directly touch the Ferrite body outside of terminal electrode.
3 seconds max. at 260℃.
MAG.LAYERS
MFI-322522C-SERIES
Page-5/6
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