FB330M ~ FB340M
SURFACE MOUNT
SCHOTTKY BARRIER RECTIFIER
C
FEATURES
REVERSE VOLTAGE – 40Volts
FORWARD CURRENT – 3.0 Ampere
Mite Flat
DO-222AA
DIM.
MIN.
MAX.
A
0.80
0.95
b
0.40
0.65
b2
0.70
1.00
C
0.10
0.25
D
1.75
2.05
E
3.60
3.90
E1
2.80
3.10
h
0.35
0.50
L
0.50
0.80
L1
2.10
2.60
L2
0.45
0.75
L3
0.20
0.50
All Dimension in millimeter
•
Very low profile package – 0.80mm
•
High efficiency
•
Low forward voltage drop, low power loss
•
For use in low voltage, high frequency inverters,
free wheeling, dc-to-dc converters and polarity protection
applications
•
ESD Capability:
Machine Model, C (> 400 V)
Human Body Model, 3B ( > 8 kV)
MECHANICAL DATA
•
Case: JEDEC DO-222AA
•
Case Material: “Green” molding compound, UL
•
•
Terminals: Lead Free Plating (Matte Tin Finish.)
•
Reliability tested in accordance with AEC-Q101
•
Component in accordance to RoHs 2002/95/EC
flammability classification 94V-0, (No Br. Sb. Cl.)
Moisture Sensitivity: Level 1 per J-STD-020C
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
°C
ambient temperature unless otherwise specified.
PARAMETER
Device marking code
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Average Rectified Output Current
@T
L
=115°C,(Fig.1)
SYMBOL
Note
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
T
STG
,T
J
FB330M
B33
30
21
30
3.0
50
-55 to +150
FB340M
B34
40
28
40
UNIT
---
V
V
V
A
A
°C
Peak Forward Surge Current 8.3ms single half sine-wave
Operating junction and storage temperature range
PARAMETER
Forward Voltage (1)
Leakage Current (1)
TEST CONDITIONS
IF=3.0A
VDC=Rated
Tj=25°C
Tj=125°C
Tj=25°C
Tj=100°C
SYMBOL
V
F
I
R
Typ.
0.52
0.45
---
---
Max.
0.58
0.48
200
15
UNIT
V
uA
mA
THERMAL CHARACTERISTIC
Typical junction capacitance (2)
Typical thermal resistance_Junction to Case (3)
Typical thermal resistance_Junction to Ambient(3)
Typical thermal resistance_Junction to Lead (3)
SYMBOL
C
J
R
Θ
JC
R
Θ
JA
R
Θ
JL
Typical
135
15
85
20
UNIT
pF
°C/W
°C/W
°C/W
Note :
(1)
(2)
(3)
300us Pulse width, 2% Duty cycle.
Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
Thermal Resistance test performed in accordance with JESD-51. Unit mounted on glass-epoxy substrate with
1oz/ft
2
_7x5 mm copper pad. R
Θ
JL
is measured at the lead of cathode band, R
Θ
JC
is measured at the top
centre of body, R
Θ
Ja
is measured at top surface of the package to surrounding natural convection (Still air)
ambient.
REV.5, Mar-2012, KSHP01
RATING AND CHARACTERISTIC CURVES
FB330M ~FB340M
FIG.1- FORWARD CURRENT DERATING CURVE
3.5
60
FIG.2- MAXIMUM NON-REPETITIVE SURGE
CURRENT
AVERAGE FORWARD CURRENT, (A)
3
2.5
2
RESISTIVE OR
INDUCTIVE LOAD
1.5
1
Mounted on glass-epoxy
substrate with 1oz/ft
2
_7x5 mm
copper pad.
0.5
PEAK FORWARD SURGE CURRENT,
(A)
50
40
30
20
10
8.3ms Single Half-Wave
0
0
25
50
75
100
O
0
125
150
175
1
10
100
LEAD TEMAERATURE, ( C)
NUMBER OF CYCLES AT 60Hz
Fig.3 TYPICAL FORWARD CHARACTERISTICS
100
1000
Fig.4 TYPICAL JUNCTION CAPACITANCE
INSTANTANEOUS FORWARD CURRENT,(A)
Tj=125°C
Tj=25°C
1
CAPACITANCE,(pF)
10
100
10
Tj=25°C, f=1MHz
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
INSTANTANEOUS FORWARD VOLTAGE,(V)
1
0.1
1
REVERSE VOLTAGE,(V)
10
100
Fig.5 TYPICAL REVERSE CHARACTERISTICS
10
120
Fig.6 MAX DC REVERSE VOLTAGE
PERCENT OF REVERSE VOLTAGE, (%)
INSTANEOUS REVERSE CURRENT(mA)
Tj=100°C
1
100
80
0.1
60
40
0.01
20
Mounted on glass-epoxy
substrate with 1oz/ft
2
_7x5 mm
copper pad. RthJa in Still-air
=85℃/W
Mounted on DO-216AA pad
RthJa in Still-air=140℃/W
Tj=25°C
6
12
18
24
30
36
42
0.001
0
0
25
50
75
100
125
150
175
REVERSE VOLTAGE (V)
AMBIENT TEMPERATURE(℃)
Legal Disclaimer Notice
FB330M~FB340M
Important Notice and Disclaimer
LSC reserves the right to make changes to this document and its products and specifications
at any time without notice. Customers should obtain and confirm the latest product
information and specifications before final design, purchase or use.
LSC makes no warranty, representation or guarantee regarding the suitability of its products
for any particular purpose, nor does LSC assume any liability for application assistance or
customer product design. LSC does not warrant or accept any liability with products which
are purchased or used for any unintended or unauthorized application.
No license is granted by implication or otherwise under any intellectual property rights of
LSC.
LSC products are not authorized for use as critical components in life support devices or
systems without express written approval of LSC.
Microchip MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
