Inverter, CMOS,
| 参数名称 | 属性值 |
| 厂商名称 | RCA |
| 包装说明 | , DIE OR CHIP |
| Reach Compliance Code | unknown |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | INVERTER |
| 最大I（ol） | 0.004 A |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装等效代码 | DIE OR CHIP |
| 电源 | 2/6 V |
| Prop。Delay @ Nom-Sup | 34 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| CD74HC14H | CD74HCT14H | CD54HC14F | CD54HC14H | CD54HCT14F | CD74HC14E | CD74HC14M | CD54HCT14H | CD74HCT14E | CD74HCT14M | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Inverter, CMOS, | Inverter, CMOS, | Inverter, CMOS, CDIP14, | Inverter, CMOS, | Inverter, CMOS, CDIP14, | Inverter, CMOS, PDIP14, | Inverter, CMOS, PDSO14, | Inverter, CMOS, | Inverter, CMOS, PDIP14, | Inverter, CMOS, PDSO14, |
| 厂商名称 | RCA | RCA | RCA | RCA | RCA | RCA | RCA | RCA | RCA | RCA |
| 包装说明 | , DIE OR CHIP | , DIE OR CHIP | DIP, DIP14,.3 | , DIE OR CHIP | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 | , DIE OR CHIP | DIP, DIP14,.3 | SOP, SOP14,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C |
| 封装等效代码 | DIE OR CHIP | DIE OR CHIP | DIP14,.3 | DIE OR CHIP | DIP14,.3 | DIP14,.3 | SOP14,.25 | DIE OR CHIP | DIP14,.3 | SOP14,.25 |
| 电源 | 2/6 V | 5 V | 2/6 V | 2/6 V | 5 V | 2/6 V | 2/6 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL |
| Prop。Delay @ Nom-Sup | 34 ns | 48 ns | 41 ns | 41 ns | 57 ns | 34 ns | 34 ns | - | - | - |
| 是否Rohs认证 | - | - | 不符合 | - | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| JESD-30 代码 | - | - | R-XDIP-T14 | - | R-XDIP-T14 | R-PDIP-T14 | R-PDSO-G14 | - | R-PDIP-T14 | R-PDSO-G14 |
| JESD-609代码 | - | - | e0 | - | e0 | e0 | e0 | - | e0 | e0 |
| 端子数量 | - | - | 14 | - | 14 | 14 | 14 | - | 14 | 14 |
| 封装主体材料 | - | - | CERAMIC | - | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | DIP | - | DIP | DIP | SOP | - | DIP | SOP |
| 封装形状 | - | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | IN-LINE | - | IN-LINE | IN-LINE | SMALL OUTLINE | - | IN-LINE | SMALL OUTLINE |
| 表面贴装 | - | - | NO | - | NO | NO | YES | - | NO | YES |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | - | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | GULL WING | - | THROUGH-HOLE | GULL WING |
| 端子节距 | - | - | 2.54 mm | - | 2.54 mm | 2.54 mm | 1.27 mm | - | 2.54 mm | 1.27 mm |
| 端子位置 | - | - | DUAL | - | DUAL | DUAL | DUAL | - | DUAL | DUAL |
单片机
RF/无线
stm32/stm8
创意市集
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嵌入式系统
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