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MSCDB-0905H-R47N

产品描述General Purpose Inductor, 0.47uH, 30%, 1 Element, Ferrite-Core, SMD, 3524, CHIP, 3524, LEAD FREE
产品类别无源元件    电感器   
文件大小109KB,共8页
制造商美磊(MAGLAYERS)
官网地址http://www.maglayers.com/
标准  
Mag.Layers科技有限公司成立于1990年4月,致力于为日益增长的电子工业提供高质量和低成本的组件解决方案。1997,Mag. Layers是同行业中第一家获得ISO9001认证的台湾公司。分别于2000、2005、2005分别获得了QS9000证书和TS16949。优质的产品以有竞争力的价格是我们成功的基础。我们在全球范围内支持客户,在台湾、中国、香港、东南亚、日本、韩国、欧洲和美国设有销售办事处。生产设施位于新竹和桃源、台湾和昆山中国,总计超过100000平方米,以及10K和100K级CL。爱琴厅。客户服务是我们业务关系的准则。Layers致力于创新的技术,先进的材料,部件设计,加工和自动化,帮助我们开发尖端和令人兴奋的产品到市场。创新和满意是我们持续成长的关键。联系MAG.层,我们将服务和成长与你。
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MSCDB-0905H-R47N概述

General Purpose Inductor, 0.47uH, 30%, 1 Element, Ferrite-Core, SMD, 3524, CHIP, 3524, LEAD FREE

MSCDB-0905H-R47N规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称美磊(MAGLAYERS)
包装说明3524
Reach Compliance Codecompliant
ECCN代码EAR99
大小写代码3524
构造Unshielded
型芯材料Ferrite
直流电阻0.01 Ω
标称电感 (L)0.47 µH
电感器应用HIGH CURRENT INDUCTOR
电感器类型GENERAL PURPOSE INDUCTOR
制造商序列号MSCDB-0905H
功能数量1
端子数量2
最高工作温度60 °C
最低工作温度-40 °C
封装高度5.2 mm
封装长度9 mm
封装形式SMT
封装宽度6.1 mm
包装方法Tape
最大额定电流6 A
系列MSCDB-0905H
形状/尺寸说明RECTANGULAR PACKAGE
屏蔽NO
表面贴装YES
端子位置DUAL ENDED
端子形状WRAPAROUND
测试频率0.1 MHz
容差30%

MSCDB-0905H-R47N文档预览

SCOPE:
This specification applies to the Pb Free high current type SMD inductors for
MSCDB-0905H-SERIES
PRODUCT INDENTIFICATION
MSCDB - 0905H - R47 M
③ ④
Product Code
Dimensions Code
Inductance Code
Tolerance Code
(1) SHAPES AND DIMENSIONS
A: 9.00 Max.
B: 6.10 Max.
C: 5.20 Max.
D: 5.84 Typ.
mm
mm
mm
mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS
L
: HP 4284A PRECISION LCR METER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3) CHARACTERISTICS
(3)-1 Ambient temperature
…….........
+60℃
Max.
(3)-2 Operate temperature range ......
-40℃½+125℃
(Including self temp. rise)
(3)-3 Storage temperature range ......
-40℃½+125℃
M AG.LAYERS
MSCDB-0905H-SERIES
Page 1/8
TABLE 1
MAGLAYERS
PT/NO.
MSCDB-0905H-R18□
MSCDB-0905H-R33□
MSCDB-0905H-R47□
MSCDB-0905H-R56□
MSCDB-0905H-1R0□
MSCDB-0905H-1R2□
MSCDB-0905H-1R5□
MSCDB-0905H-2R2□
MSCDB-0905H-3R3□
MSCDB-0905H-4R7□
MSCDB-0905H-6R8□
MSCDB-0905H-100□
MSCDB-0905H-150□
MSCDB-0905H-220□
MSCDB-0905H-330□
MSCDB-0905H-470□
MSCDB-0905H-680□
MSCDB-0905H-101□
Inductance
L(μH)
0.18
0.33
0.47
0.56
1.0
1.2
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
Percent
Tolerance
N
N
M,N
M,N
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Test
Frequency
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
100kHz/0.25V
Resistance
RDC(Ω)Max.
5.0m
9.0m
10.0m
13.8m
18.0m
19.0m
20.0m
35.0m
43.0m
54.0m
90.0m
0.111
0.175
0.255
0.370
0.474
0.750
1.110
Rated DC Current
IDC(A)
9.0
7.0
6.0
5.2
4.4
4.3
4.2
3.1
2.9
2.2
1.7
1.5
1.2
1.0
0.82
0.72
0.58
0.47
R18
R33
R47
R56
1R0
1R2
1R5
2R2
3R3
4R7
6R8
100
150
220
330
470
680
101
Marking
※ □
specify the inductance tolerance , M(±20%) , N(±30%)
※IDC
: Based on inductance change (△L/Lo:drop 10% Max.) @ ambient temp. 25℃ and
Based on temperature rise (△T: 40℃ TYP.)
MAG.LAYERS
MSCDB-0905H-SERIES
Page-2/8
(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM
Substrate bending
SPECIFICATION
△L/Lo≦±5%
TEST DETAILS
The sample shall be soldered onto the printed circuit board
in figure 1 and a load applied unitil the figure in the arrow
There shall be
no mechanical
damage or elec-
trical damege.
direction is made approximately 3mm.(keep time 30 seconds)
PCB dimension shall the page 7/9
F(Pressurization)
PRESSURE ROD
figure-1
Vibration
△L/Lo≦±5%
The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm
There shall be
no mechanical
damage.
and a frequency of from 10 to 55Hz/1 minute repeated should
be applied to the 3 directions (X,Y,Z) for 2 hours each.
(A total of 6 hours)
Solderability
New solder
More than 90%
Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
over the whole of the sample before hard, the sample shall
then be preheated for about 2 minutes in a temperature of
130½150℃ and after it has been immersed to a depth 0.5mm
below for 3±0.2 seconds fully in molten solder M705 with
a temperature of 245±5℃.
More than 90% of the electrode sections shall be couered
with new solder smoothly when the sample is taken out of
the solder bath.
MAG.LAYERS
MSCDB-0905H-SERIES
Page-3/8
MECHANICAL
TEST ITEM
Resistance to
Soldering heat
(reflow soldering)
There shall be
no damage or
Sodering temperature (℃)
SPECIFICATION
Temperature profile of reflow soldering
problems.
300
250
200
150
100
50
soldering
(Peak temperature 260±3℃ 10 sec
30 sec Min
Pre-heating
(230
+0
℃)
150 ~ 180℃
Slow cooling
(Stored at room
temperature)
2 min
10
sec.
2 min. or more
The specimen shall be passed through the reflow oven with the
condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric conditions
for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM
Dielectric
withstand
voltage
SPECIFICATION
There shall be
no other
damage or
problems.
Temperature
characteristics
△L/L20℃≦±10%
0½2000 ppm/℃
The test shall be performed after the sample has stabilized in
an ambient temperature of -20 to +85℃,and the value
calculated based on the value applicable in a normal
temperature and narmal humidity shall be
△L/L20℃≦±10%.
TEST DETAILS
AC 100V voltage shall be applied for 1 minute acrosset the top
surface and the terminal of this sample
M AG.LAYERS
MSCDB-0905H-SERIES
Page-4/8
ENVIROMENT CHARACTERISTICS
TEST ITEM
High temperature
storage
There shall be
no mechanical
damage.
△L/Lo≦±5%
SPECIFICATION
The sample shall be left for 96±4 hours in an atmospere with
a temperature of 85±2℃ and a normal humidity.
Upon completion of the measurement shall be made after the
sample has been left in a normal temperature and normal
humidity for 1 hour.
Low temperature
storage
△L/Lo≦±5%
The sample shall be left for 96±4 hours in an atmosphere with
a temperature of -25±3℃.
There shall be
no mechanical
damage.
Change of
temperature
There shall be
no other dama-
ge of problems
△L/Lo≦±5%
Upon completion of the test, the measurement shall be made
after the sample has been left in a normal temperature and
normal humidity for 1 hour.
The sample shall be subject to 5 continuos cycles, such as shown
in the table 2 below and then it shall be subjected to standard
atmospheric conditions for 1 hour, after which measurement
shall be made.
table 2
Temperature
1
-25±3℃
(Themostat No.1)
2
Standard
atmospheric
3
85±2℃
(Themostat No.2)
4
Standard
atmospheric
Moisture storage
△L/Lo≦±5%
The sample shall be left for 96±4 hours in a temperature of
40±2℃ and a humidity(RH) of 90½95%.
There shall be
no mechanical
damage.
Test conditions:
The sample shall be reflow soldered onto the printed circuit board in every test.
Upon completion of the test, the measurement shall be made
after the sample has been left in a normal temperature and
normal humidity more than 1 hour.
No.2→No.1
30 min.
No.1→No.2
Duration
30 min.
M A G .L A Y E R S
MSCDB-0905H-SERIES
Page-5/8
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