EE PLD, 6.5ns, CMOS, PBGA144, FBGA-144
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Lattice(莱迪斯) |
零件包装代码 | BGA |
包装说明 | FBGA-144 |
针数 | 144 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最大时钟频率 | 95.2 MHz |
JESD-30 代码 | S-PBGA-B144 |
JESD-609代码 | e0 |
长度 | 13 mm |
湿度敏感等级 | 3 |
专用输入次数 | 16 |
I/O 线路数量 | 96 |
端子数量 | 144 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 16 DEDICATED INPUTS, 96 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
可编程逻辑类型 | EE PLD |
传播延迟 | 6.5 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.1 mm |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
宽度 | 13 mm |
M4A3-192/96-65FAC | M4A3-384/192-7AC | M4A3-384/160-7YC | M4A3-192/96-65VC | M4A5-192/96-65VC | M4A5-32/32-5VI | M4A5-32/32-5JI | |
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描述 | EE PLD, 6.5ns, CMOS, PBGA144, FBGA-144 | EE PLD, 7ns, 384-Cell, CMOS, PBGA256, BGA-256 | EE PLD, 7ns, 384-Cell, CMOS, PQFP208, PLASTIC, QFP-208 | EE PLD, 6.5ns, 192-Cell, CMOS, PQFP144, TQFP-144 | EE PLD, 6.5ns, 192-Cell, CMOS, PQFP144, TQFP-144 | EE PLD, 5ns, CMOS, PQFP44, TQFP-44 | EE PLD, 5ns, CMOS, PQCC44, PLASTIC, LCC-44 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | FBGA-144 | BGA-256 | PLASTIC, QFP-208 | TQFP-144 | TQFP-144 | QFP, | QCCJ, |
Reach Compliance Code | compliant | _compli | compliant | not_compliant | not_compliant | compliant | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 | 95.2 MHz | 76.9 MHz | 76.9 MHz | 95.2 MHz | 95.2 MHz | 105 MHz | 105 MHz |
JESD-30 代码 | S-PBGA-B144 | S-PBGA-B256 | S-PQFP-G208 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G44 | S-PQCC-J44 |
长度 | 13 mm | 27 mm | 28 mm | 20 mm | 20 mm | 10 mm | 16.5862 mm |
湿度敏感等级 | 3 | 1 | 3 | 3 | 3 | 3 | 3 |
专用输入次数 | 16 | - | - | 16 | 16 | 2 | 2 |
I/O 线路数量 | 96 | 192 | 160 | 96 | 96 | 32 | 32 |
端子数量 | 144 | 256 | 208 | 144 | 144 | 44 | 44 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C |
组织 | 16 DEDICATED INPUTS, 96 I/O | 0 DEDICATED INPUTS, 192 I/O | 0 DEDICATED INPUTS, 160 I/O | 16 DEDICATED INPUTS, 96 I/O | 16 DEDICATED INPUTS, 96 I/O | 2 DEDICATED INPUTS, 32 I/O | 2 DEDICATED INPUTS, 32 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | LBGA | FQFP | LFQFP | LFQFP | QFP | QCCJ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY, LOW PROFILE | FLATPACK, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK | CHIP CARRIER |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 6.5 ns | 7 ns | 7 ns | 6.5 ns | 6.5 ns | 5 ns | 5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 5.25 V | 5.5 V | 5.5 V |
最小供电电压 | 3 V | 3 V | 3 V | 3 V | 4.75 V | 4.5 V | 4.5 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | BALL | GULL WING | GULL WING | GULL WING | GULL WING | J BEND |
端子节距 | 1 mm | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.8 mm | 1.27 mm |
端子位置 | BOTTOM | BOTTOM | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 13 mm | 27 mm | 28 mm | 20 mm | 20 mm | 10 mm | 16.5862 mm |
厂商名称 | Lattice(莱迪斯) | - | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) |
零件包装代码 | BGA | - | QFP | QFP | QFP | QFP | LCC |
针数 | 144 | - | 208 | 144 | 144 | 44 | 44 |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 |
座面最大高度 | 2.1 mm | 1.7 mm | 4.1 mm | 1.6 mm | 1.6 mm | - | 4.57 mm |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | TIN LEAD | TIN LEAD |
其他特性 | - | YES | YES | YES | YES | - | - |
系统内可编程 | - | YES | YES | YES | YES | - | - |
JTAG BST | - | YES | YES | YES | YES | - | - |
宏单元数 | - | 384 | 384 | 192 | 192 | - | - |
封装等效代码 | - | BGA256,20X20,50 | QFP208,1.2SQ,20 | QFP144,.87SQ,20 | QFP144,.87SQ,20 | - | - |
峰值回流温度(摄氏度) | - | 225 | - | 260 | 260 | 240 | 225 |
电源 | - | 3.3 V | 3.3 V | 3.3 V | 5 V | - | - |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 |
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