OTP ROM, 128KX8, 300ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, TSOP1-32
| 参数名称 | 属性值 |
| 厂商名称 | Fairchild |
| 零件包装代码 | TSOP1 |
| 包装说明 | TSOP1, |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 300 ns |
| JESD-30 代码 | R-PDSO-G32 |
| 长度 | 18.4 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 128KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 8 mm |
| NM27LV010T300 | NM27LV010BTE200 | NM27LV010BTE250 | NM27LV010BT200 | NM27LV010TE150 | NM27LV010VE150 | NM27LV010V150 | |
|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 128KX8, 300ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, TSOP1-32 | OTP ROM, 128KX8, 200ns, CMOS, PDSO32, 8 X 20 MM, TSOP-32 | OTP ROM, 128KX8, 250ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 | OTP ROM, 128KX8, 200ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 | OTP ROM, 128KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP1-32 | OTP ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 |
| 零件包装代码 | TSOP1 | TSOP | TSOP1 | TSOP1 | TSOP1 | QFJ | QFJ |
| 包装说明 | TSOP1, | TSOP1, | TSOP1, TSSOP32,.8,20 | TSOP1, TSSOP32,.8,20 | TSOP1, TSSOP32,.8,20 | PLASTIC, LCC-32 | QCCJ, LDCC32,.5X.6 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | compliant | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 300 ns | 200 ns | 250 ns | 200 ns | 150 ns | 150 ns | 150 ns |
| JESD-30 代码 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PQCC-J32 | R-PQCC-J32 |
| 长度 | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 13.995 mm | 13.995 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | QCCJ | QCCJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.56 mm | 3.56 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.3 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 2.7 V | 2.7 V | 2.7 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3 V | 3 V | 3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | J BEND |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD |
| 宽度 | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 11.455 mm | 11.455 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - | - |
| 是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| I/O 类型 | - | - | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-609代码 | - | - | e0 | e0 | e0 | e0 | e0 |
| 输出特性 | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装等效代码 | - | - | TSSOP32,.8,20 | TSSOP32,.8,20 | TSSOP32,.8,20 | LDCC32,.5X.6 | LDCC32,.5X.6 |
| 峰值回流温度（摄氏度） | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | - | 3/3.3 V | 3 V | 3.3 V | 3.3 V | 3.3 V |
| 最大待机电流 | - | - | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| 最大压摆率 | - | - | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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