SMD2016 SERIES PTC DEVICES
SMD2016 SERIES PTC Devices
The SMD2016 Halogen and Lead(Pb) Free Series, a polymer-based Positive Temperature
Coefficient (PTC) device to protect electrical circuits against overcurrent conditions with
resettable feature, is fully compatible with current industrial standards.
The new designed SMD2016 Halogen and Lead(Pb) Free Series provides surface mount
overcurrent protection with superior performance that is compliant with RoHS Directive
2002/95/EC.
Application: The SMD2016 Halogen and Lead(Pb) Free Series is ideal for computers and
peripherals and can be applied to almost anywhere there is a low voltage power supply and a
load to be protected.
The solder plated termination is designed to meet or exceed solderability specifications and
provide excellent solder joint inspectability.
Agency Approval:
UL/CSA File No.E201431
TÜV Certificate # R50099121
ELECTRICAL CHARACTERISTICS
Maximum
Time To Trip
Part Number
SMD2016P030TF
SMD2016P050TF
SMD2016P100TF
SMD2016P100TF/33
SMD2016P150TF
SMD2016P200TF
I
hold
(A)
0.30
0.55
1.10
1.10
1.50
2.00
I
trip
(A)
0.60
1.10
2.20
2.20
3.00
4.20
V
max
(Vdc)
60
60
15
33
15
6
I
max
(A)
20
20
40
40
40
40
P
d max.
Current Time
(W)
(A)
(Sec.)
1.40
1.40
1.40
1.40
1.40
1.40
1.50
2.50
8.00
8.00
8.00
8.00
3.00
5.00
0.50
0.50
1.00
3.00
still air.
Resistance
R
min
(Ω)
0.500
0.200
0.100
0.100
0.070
0.048
Agency
Approval
R
1max
UL/CSA TÜV
(Ω)
2.300
1.000
0.400
0.400
0.180
0.100
Note:
I
hold
= Hold current: maximum current device will pass without tripping in 20℃
I
trip
= Trip current: minimum current at which the device will trip in 20℃ still air.
V
max
= Maximum voltage device can withstand without damage at rated current (I
max
)
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
= Power dissipated from device when in the tripped state at 20℃ still air.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
1max
= Maximum resistance of device at 20℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec.
*Value
specified were determined using the PWB with 0.090”*1.5oz copper traces.
Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
◎Specifications
are subject to change without notice.
*Customer
should verify the device performance in their specified conditions.
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SMD2016 SERIES PTC DEVICES
THERMAL DERATING CURVE FOR SMD2016 SERIES
200.00
A－SMD2016P050TF
SMD2016P100TF
SMD2016P200TF
B－SMD2016P030TF
SMD2016P100TF/33
SMD2016P150TF
100.00
150.00
B
A
Percentage Rated Current
50.00
A
B
0.00
-40.00
0.00
40.00
80.00
120.00
Device's Ambient Temperature (
℃
)
THERMAL DERATING CHART FOR SMD2016 SERIES – Ihold (Amps)
RECOMMENDED DATA
-40℃
SMD2016P030TF
0.45
SMD2016P050TF
0.93
SMD2016P100TF
1.66
SMD2016P100TF/33 1.66
SMD2016P150TF
2.26
SMD2016P200TF
2.80
Model
-20℃
0.40
0.80
1.47
1.47
2.00
2.50
Ambient Operation Temperature
0℃
23℃
40℃
50℃
60℃
0.35
0.30
0.25
0.23
0.20
0.65
0.50
0.42
0.38
0.33
1.29
1.10
0.91
0.83
0.73
1.29
1.10
0.91
0.83
0.73
1.76
1.50
1.24
1.13
1.00
2.19
2.00
1.84
1.74
1.50
70℃
0.18
0.30
0.64
0.64
0.87
1.34
85℃
0.14
0.23
0.50
0.50
0.68
1.14
*Customer
should verify the device performance in their specified conditions.
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SMD2016 SERIES PTC DEVICES
AVERAGE TIME-CURRENT CURVE FOR SMD2016 SERIES
100.00
A
10.00
B
D
C
E
F
Time to Trip (Sec.)
A－SMD2016P030TF
B－SMD2016P050TF
C－SMD2016P100TF
D－SMD2016P100TF/33
E－SMD2016P150TF
F－SMD2016P200TF
1.00
0.10
0.01
0.10
1.00
10.00
Fault Current (Amp.)
*Customer
should verify the device performance in their specified conditions.
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SMD2016 SERIES PTC DEVICES
SOLDER REFLOW
RECOMMENDED CONDITIONS
Profile Feature
Average Ramp-Up Rate (Ts
max
to Tp)
Preheat
-Temperature Min (Ts
min
)
-Temperature Max (Ts
max
)
-Time (Ts
min
to Ts
max
)
Time maintained above:
-Temperature (T
L
)
-Time (t
L
)
Peak Temperature (Tp)
Time within 5℃ of actual Peak
Temperature (tp)
Ramp-Down Rate
Time 25℃ to Peak Temperature
Storage Condition
Pb-Free Assembly
3℃/second max.
150℃
200℃
60-180 seconds
217℃
60-150 seconds
260℃
20-40 seconds
6℃/second max.
8 minutes max.
0℃~35℃,
≦70%RH
Note 1: All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Recommended reflow methods: IR, vapor phase oven, hot air oven, N
2
environment for lead-free
Recommended maximum paste thickness is 0.25mm (0.010 inch)
Devices can be cleaned using standard industry methods and solvents.
Devices can be reworked using the standard industry practices.
*Customer
should verify the device performance in their specified conditions.
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SMD2016 SERIES PTC DEVICES
FIGURE
PHYSICAL DIMENSIONS (mm)
A
Part Number
SMD2016P030TF
SMD2016P050TF
SMD2016P100TF
SMD2016P100TF/33
SMD2016P150TF
SMD2016P200TF
Min.
4.72
4.72
4.72
4.72
4.72
4.72
Max.
5.44
5.44
5.44
5.44
5.44
5.44
Min.
3.70
3.70
3.70
3.70
3.70
3.70
B
Max.
4.43
4.43
4.43
4.43
4.43
4.43
Min.
0.75
1.20
0.50
0.75
0.75
0.50
C
Max.
1.25
2.00
0.75
1.25
1.55
0.75
Min.
0.30
0.30
0.30
0.30
0.30
0.30
D
Max.
1.50
1.50
1.50
1.50
1.50
1.50
Min.
0.25
0.25
0.25
0.25
0.25
0.25
E
Max.
0.65
0.65
0.65
0.65
0.65
0.65
ENVIRONMENTAL SPECIFICATIONS
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Vibration
-40℃ to +85℃
125℃
+85℃, 1000 hours
+85℃, 85%R.H. 1000 hours
MIL-STD-202 Method 107G
+85℃/-40℃ 20 times
MIL-STD-202, Method 215
MIL-STD-883C, Method 2007.1, Condition A
±5% typical resistance change
±5% typical resistance change
-30% typical resistance change
No change
No change
*Customer
should verify the device performance in their specified conditions.
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