SB820FCT SERIES
SCHOTTKY BARRIER RECTIFIER
VOLTAGE
FEATURES
0.112(2.85)
0.100(2.55)
0.272(6.9)
0.248(6.3)
20 to 60 Volts
CURRENT
8 Amperes
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O utilizing
Flame Retardant Epoxy Molding Compound.
• Exceeds environmental standards of MIL-S-19500/228
• Low power loss, high efficiency.
• Low forward voltage, high current capability
• High surge capacity.
• For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
• In compliance with EU RoHS 2002/95/EC directives
0.406(10.3)
0.381(9.7)
0.134(3.4)
0.118(3.0)
0.189(4.8)
0.165(4.2)
0.130(3.3)
0.114(2.9)
0.606(15.4)
0.583(14.8)
MECHANICAL DATA
• Case: ITO-220AB full molded plastic package
• Terminals: Lead solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Mounting Position: Any
• Weight: 0.055 ounces, 1.5615 grams.
0.055(1.4)
0.039(1.0)
0.055(1.4)
0.039(1.0)
0.028(0.7)
0.019(0.5)
0.100(2.55)
0.177(4.5)
0.137(3.5)
0.543(13.8)
0.512(13.0)
0.114(2.9)
0.098(2.5)
0.100(2.55)
0.027(0.67)
0.022(0.57)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PA RA ME TE R
Ma xi mum Re c urre nt P e a k Re ve rs e Vo lta g e
Ma xi mum RMS Vo lta g e
Ma xi mum D C B lo c k i ng Vo lta g e
Ma xi mum A ve ra g e F o rwa rd C urre nt a t T
C
=7 5
O
C
P e a k F o rwa r d S urg e C urre nt : 8 .3 ms si ng le ha lf s i ne - wa ve
s up e ri mp o se d o n ra te d lo a d (J E D E C me tho d )
Ma xi mum F o r wa rd Vo lta g e a t 4 .0 A
Ma xi mum D C Re ve rs e C urre nt a t Ra te d D C
B lo c k i ng Vo lta g e
Typ i ca l The r ma l Re si s ta nce
Op e ra ti ng J unc ti o n Te mp e ra ture Ra ng e
S to ra g e Te mp e r ature Ra ng e
T
J
=2 5
O
C
T
J
=1 0 0
O
C
S YMB OL
V
RRM
V
RMS
V
R
I
F (AV )
I
F S M
V
F
I
R
R
θ
JC
T
J
T
S TG
S B 8 2 0 F C T S B 8 3 0 F C T S B 8 4 0 F C T S B 8 4 5 F C T S B 8 5 0 F C T S B 8 6 0 F C T
UNITS
20
14
20
30
21
30
40
28
40
8
150
0 .5 5
45
31
45
50
35
50
60
42
60
V
V
V
A
A
0 .7 5
0 .1
50
3
O
V
0 .2
50
mA
C / W
O
- 55 to +1 2 5
-5 5 to +1 5 0
-5 5 to +1 5 0
C
C
O
NOTES:
Both Bonding and Chip structure are available.
May 30.2011-REV.04
PAGE . 1
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