FIFO, 64X36, 8ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP |
| 包装说明 | PLASTIC, QFP-132 |
| 针数 | 132 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 8 ns |
| 其他特性 | MAIL BOX BYPASS REGISTER |
| 周期时间 | 12 ns |
| JESD-30 代码 | S-PQFP-G132 |
| JESD-609代码 | e0 |
| 长度 | 24.13 mm |
| 内存密度 | 2304 bit |
| 内存宽度 | 36 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 132 |
| 字数 | 64 words |
| 字数代码 | 64 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64X36 |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, BUMPER |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 225 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 24.13 mm |
| IDT72V3614L12PQF8 | IDT72V3614L15PF9 | IDT72V3614L15PQF9 | IDT72V3614L20PF9 | IDT72V3614L20PQF9 | IDT72V3614L12PQF9 | IDT72V3614L12PFG8 | IDT72V3614L12PF9 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | FIFO, 64X36, 8ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132 | FIFO, 64X36, 10ns, Synchronous, CMOS, PQFP120, TQFP-120 | FIFO, 64X36, 10ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132 | FIFO, 64X36, 12ns, Synchronous, CMOS, PQFP120, TQFP-120 | FIFO, 64X36, 12ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132 | FIFO, 64X36, 8ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132 | FIFO, 64X36, 8ns, Synchronous, CMOS, PQFP120, TQFP-120 | FIFO, 64X36, 8ns, Synchronous, CMOS, PQFP120, TQFP-120 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | PLASTIC, QFP-132 | LFQFP, | BQFP, | LFQFP, | BQFP, | BQFP, | LFQFP, | LFQFP, |
| 针数 | 132 | 120 | 132 | 120 | 132 | 132 | 120 | 120 |
| Reach Compliance Code | not_compliant | _compli | compliant | not_compliant | compliant | compliant | compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 8 ns | 10 ns | 10 ns | 12 ns | 12 ns | 8 ns | 8 ns | 8 ns |
| 其他特性 | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER |
| 周期时间 | 12 ns | 15 ns | 15 ns | 20 ns | 20 ns | 12 ns | 12 ns | 12 ns |
| JESD-30 代码 | S-PQFP-G132 | S-PQFP-G120 | S-PQFP-G132 | S-PQFP-G120 | S-PQFP-G132 | S-PQFP-G132 | S-PQFP-G120 | S-PQFP-G120 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e3 | e0 |
| 长度 | 24.13 mm | 14 mm | 24.13 mm | 14 mm | 24.13 mm | 24.13 mm | 14 mm | 14 mm |
| 内存密度 | 2304 bit | 2304 bi | 2304 bit | 2304 bit | 2304 bit | 2304 bit | 2304 bit | 2304 bit |
| 内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
| 湿度敏感等级 | 3 | 4 | 3 | 4 | 3 | 3 | 3 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 132 | 120 | 132 | 120 | 132 | 132 | 120 | 120 |
| 字数 | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
| 字数代码 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 64X36 | 64X36 | 64X36 | 64X36 | 64X36 | 64X36 | 64X36 | 64X36 |
| 可输出 | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BQFP | LFQFP | BQFP | LFQFP | BQFP | BQFP | LFQFP | LFQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, BUMPER | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, BUMPER | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, BUMPER | FLATPACK, BUMPER | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 225 | 240 | 225 | 240 | 225 | 225 | 260 | 240 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.572 mm | 1.6 mm | 4.572 mm | 1.6 mm | 4.572 mm | 4.572 mm | 1.6 mm | 1.6 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | TIN LEAD | Tin/Lead (Sn85Pb15) | TIN LEAD | TIN LEAD | Matte Tin (Sn) - annealed | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.4 mm | 0.635 mm | 0.4 mm | 0.635 mm | 0.635 mm | 0.4 mm | 0.4 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 | 20 | 30 | 20 |
| 宽度 | 24.13 mm | 14 mm | 24.13 mm | 14 mm | 24.13 mm | 24.13 mm | 14 mm | 14 mm |
| 厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
模拟电子
电子竞赛
Microchip MCU
微控制器 MCU
PCB设计
RF/无线
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
