SCOPE：
This specification applies to the Pb Free high current type SMD Common mode filter
for MCM-7060F-SERIES
PRODUCT INDENTIFICATION
MCM-7060F- 301
①
②
③
①
Product Code
②
Dimensions Code
③
Impedance Code
(1) SHAPES AND DIMENSIONS
A: 7.0±0.5
B: 6.0±0.5
C: 3.8Max.
D: 3.5Typ.
E: 1.5±0.2
F: 1.5±0.2
G: 1.75±0.2
mm
mm
mm
mm
mm
mm
mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS
Z
: HP 4291B IMPEDANCE ANALYZER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3) CHARACTERISTICS
(3)-1 Temperature rise
…...................
＋40℃
Max.
(3)-2 Ambient temperature
…….........
＋60℃
Max.
(3)-3 Operate temperature range ......
－40℃½＋105℃
(Including self temp. rise)
(3)-4 Storage temperature range ......
－40℃½＋105℃
MAG.LAYERS
MCM-7060F-SERIES
Page 1/7
TABLE 1
Impedance(Ω)
MAGLAYERS PT/NO.
at 100MHz
Min.
MCM-7060F-101
MCM-7060F-301
MCM-7060F-501
MCM-7060F-601
MCM-7060F-701
MCM-7060F-102
MCM-7060F-132
100
225
275
500
500
800
910
Typ.
140
300
350
700
700
1020
1300
10m
10m
10m
15m
15m
17m
21m
Resistance RDC(Ω)
Max.(1 line)
Rated
Current
(A) Max.
9
5
5
4
4
3
2.5
Insulation
Resistance
(MΩ) Min.
10
10
10
10
10
10
10
Rated
Voltage
(V)Max.
80
80
80
80
80
80
80
CHARACTERISTICS(REFERENCE)
MCM-7060F-301
MCM-7060F-601
10000
10000
IMPEDANCE(Ohm)
Common mode
IMPEDANCE(Ohm)
1000
1000
Common
100
Differential mode
100
Differential
10
10
1
1
10
100
1000
FREQUENCY(MHz)
MCM-7060F-701
10000
1
1
10
100
1000
FREQUENCY(MHz)
MCM-7060F-102
10000
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
1000
Common mode
1000
Common
Differential mode
100
Differential mode
100
10
10
1
1
10
100
1000
1
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
M A G .L A Y E R S
MCM-7060F-SERIES
Page-2/7
(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM
Solder ability
SPECIFICATION
The product shall be connected to the test
circuit board by the fillet (the height is 0.2mm).
TEST DETAILS
Apply cream solder to the printed circuit board .
Refer to clause 8 for Reflow profile.
Resistance to
Soldering heat
(reflow soldering)
There shall be no damage or problems.
Temperature profile of reflow soldering
Sodering temperature (℃)
300
250
200
150
100
50
2 min
10
sec.
2 min. or more
Pre-heating
soldering
(Peak temperature 260±3℃ 10 sec
30 sec Min
(230
+0
℃)
150 ~ 180℃
Slow cooling
(Stored at room
temperature)
The specimen shall be passed through the reflow oven
with the condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric
eric conditions for 1 hour, after which the measurement
shall be made.
Terminal strength
The terminal electrode and the ferrite must
not damaged.
Solder a chip to test substrate , and then laterally apply
a load 9.8N in the arrow direction.
Strength on PC board The terminal electrode and the ferrite must
bending
not damaged.
Solder a chip to test substrate and then apply a load.
High
temperature
resistance
Impedance:Within±20% of the initial value.
After the samples shall be soldered onto the test circuit
Insulation resistance and DC resistance on the board,the test shall be done.
specification(refer to clause 2-1) shall be met.
The terminal electrode and the ferrite must not
damaged.
Measurement : After placing for 24 hours min.
Temperature : +85±2℃
Applied voltage : Rated voltage
Applied current : Rated current
Testing time : 500±12 hours
M A G .L A Y E R S
MCM-7060F-SERIES
Page-3/7
(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM
Humidity
resistance
SPECIFICATION
Impedance:Within±20% of the initial value.
Insulation resistance and DC resistance on the
specification(refer to clause 2-1) shall be met.
The terminal electrode and the ferrite must not
damaged.
TEST DETAILS
After the samples shall be soldered onto the test circuit
board,the test shall be done.
Measurement : After placing for 24 hours min.
Temperature : +60±2℃ , Humidity : 90 to 95 %RH
Applied voltage : Rated voltage
Applied current : Rated current
Testing time : 500±12 hours
Thermal shock
Impedance:Within±20% of the initial value.
Insulation resistance and DC resistance on the
specification(refer to clause 2-1) shall be met.
The terminal electrode and the ferrite must
not damaged.
Low
temperature
storage
Impedance:Within±20% of the initial value.
Insulation resistance and DC resistance on the
specification(refer to clause 2-1) shall be met.
The terminal electrode and the ferrite must
not damaged.
After the samples shall be soldered onto the test
circuit board,the test shall be done.
Measurement : After placing for 24 hours min.
Temperature : -40±2℃
Testing time : 500±12 hours
Vibration
Impedance:Within±20% of the initial value.
Insulation resistance and DC resistance on
the specification(refer to clause 2-1)
shall be met.
The terminal electrode and the ferrite must
not damaged.
After the samples shall be soldered onto the test circuit
board,the test shall be done.
Frequency : 10 to 55 Hz
Amplitude : 1.52 mm
Dimension and times : X ,Y and Z directions
for 2 hours each.
Solderability
New solder More than 75%
Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
over the whole of the sample before hard, the sample shall
then be preheated for about 2 minutes in a temperature
of 130½150℃ and after it has been immersed to a depth
0.5mm below for 3±0.2 seconds fully in molten solder
M705 with a temperature of 245±2℃. More than 75% of the
electrode sections shall be couered
with new solder smoothly when the sample is taken out
of the solder bath.
M A G .L A Y E R S
MCM-7060F-SERIES
Page-4/7
(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t＝1.6mm
(5)-1 LAND PATTERN DIMENSIONS
(STANDARD PATTERN)
Unit:mm
(6) TEST EQUIPMENT
(6)-1 Impedance
Measured by using HP4291B RF Impedance Analyzer.
Measurement terminal
①
②
(6)-2 DC Resistance
Measured by using Chroma 16502 milliohm meter.
④
③
Measurement terminal
①
②
(6)-3 Insulation Resistance
Measured by using Chroma 19073
Measurement voltage : 50v ,Measurement time : 60 sec.
④
③
Measurement terminal
①
②
④
③
MAG.LAYERS
MCM-7060F-SERIES
Page-5/7
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