Parallel In Parallel Out, LS Series, 8-Bit, Right Direction, True Output, TTL, PDIP20, PLASTIC, DIP-20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | DIP |
包装说明 | DIP, DIP20,.3 |
针数 | 20 |
Reach Compliance Code | unknow |
计数方向 | RIGHT |
系列 | LS |
JESD-30 代码 | R-PDIP-T20 |
JESD-609代码 | e0 |
长度 | 26.289 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | PARALLEL IN PARALLEL OUT |
最大频率@ Nom-Su | 26000000 Hz |
位数 | 8 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP20,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
最大电源电流(ICC) | 65 mA |
传播延迟(tpd) | 38 ns |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
宽度 | 7.62 mm |
最小 fmax | 50 MHz |
Base Number Matches | 1 |
AM25LS22PC | AM25LS22XC | AM25LS22DC | AM25LS22XM | |
---|---|---|---|---|
描述 | Parallel In Parallel Out, LS Series, 8-Bit, Right Direction, True Output, TTL, PDIP20, PLASTIC, DIP-20 | Parallel In Parallel Out, LS Series, 8-Bit, Right Direction, True Output, TTL, 0.096 X 0.112 INCH, DIE-20 | Parallel In Parallel Out, LS Series, 8-Bit, Right Direction, True Output, TTL, CDIP20, HERMETIC SEALED, CERDIP-20 | Parallel In Parallel Out, LS Series, 8-Bit, Right Direction, True Output, TTL, 0.096 X 0.112 INCH, DIE-20 |
零件包装代码 | DIP | DIE | DIP | DIE |
包装说明 | DIP, DIP20,.3 | DIE, | DIP, DIP20,.3 | DIE, |
针数 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknow | unknown | unknown | unknown |
计数方向 | RIGHT | RIGHT | RIGHT | RIGHT |
系列 | LS | LS | LS | LS |
JESD-30 代码 | R-PDIP-T20 | R-XUUC-N20 | R-CDIP-T20 | R-XUUC-N20 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT |
位数 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 125 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
封装代码 | DIP | DIE | DIP | DIE |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | UNCASED CHIP | IN-LINE | UNCASED CHIP |
最大电源电流(ICC) | 65 mA | 65 mA | 65 mA | 65 mA |
传播延迟(tpd) | 38 ns | 38 ns | 38 ns | 44 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.5 V |
最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | YES |
技术 | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
端子位置 | DUAL | UPPER | DUAL | UPPER |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
最小 fmax | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
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