SMD0805 SERIES PTC DEVICES
SMD0805 SERIES PTC Devices
The SMD0805 Halogen and Lead(Pb) Free Series, a polymer-based Positive Temperature
Coefficient (PTC) device to protect electrical circuits against overcurrent conditions with
resettable feature, is fully compatible with current industrial standards.
The new designed SMD0805 Halogen and Lead(Pb) Free Series provides surface mount
overcurrent protection with superior performance that
are compliant with IEC 61249-2-21:2003
and RoHS Directive 2002/95/EC.
Application: The SMD0805 Halogen and Lead(Pb) Free Series is ideal for computers and
peripherals and can be applied to almost anywhere there is a low voltage power supply and a
load to be protected.
The solder plated termination is designed to meet or exceed solderability specifications and
provide excellent solder joint inspectability.
Agency Approval:
UL/CSA File No. E201431
TÜV Certificate # R50099121
ELECTRICAL CHARACTERISTICS
Part Number
SMD0805P010TF
SMD0805P020TF
SMD0805P035TF
SMD0805P050TF
SMD0805P075TF
SMD0805P100TF
SMD0805P110TF
Maximum
Time To Trip
I
hold
(A)
0.10
0.20
0.35
0.50
0.75
1.00
1.10
I
trip
(A)
0.30
0.50
0.75
1.00
1.50
1.95
2.00
V
max
(Vdc)
15
9
6
6
6
6
6
I
max
(A)
100
100
100
100
40
40
100
Resistance
Agency
Approval
P
d max.
Current Time R
min
(W)
(A)
(Sec.) (Ω)
0.5
0.50
1.50 1.000
0.5
8.00
0.02 0.650
0.5
8.00
0.10 0.250
0.5
8.00
0.10 0.150
0.6
8.00
0.20 0.090
0.6
8.00
0.30 0.060
0.8
8.00
0.10 0.050
still air.
R
1max
UL/CSA TÜV
(Ω)
6.000
3.500
1.200
0.850
0.350
0.210
0.160
Note:
I
hold
= Hold current: maximum current device will pass without tripping in 23℃
I
trip
= Trip current: minimum current at which the device will trip in 23℃ still air.
V
max
= Maximum voltage device can withstand without damage at rated current (I
max
)
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
= Power dissipated from device when in the tripped state at 23℃ still air.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
1max
= Maximum resistance of device at 23℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec.
*Value
specified were determined using the PWB with 0.020”*1.5oz copper traces.
Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
◎Specifications
are subject to change without notice.
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SMD0805 SERIES PTC DEVICES
THERMAL DERATING CURVE FOR SMD0805 SERIES
200.00
Percentage of Rated Current
150.00
100.00
50.00
0.00
-40.00
0.00
40.00
80.00
120.00
Device Ambient Temperature (
℃
)
THERMAL DERATING CHART FOR SMD0805 SERIES – Ihold (Amps)
RECOMMENDED DATA
Model
SMD0805P010TF
SMD0805P020TF
SMD0805P035TF
SMD0805P050TF
SMD0805P075TF
SMD0805P100TF
SMD0805P110TF
-40℃ -20℃
0.14
0.12
0.28
0.25
0.47
0.44
0.68
0.62
1.00
0.90
1.35
1.25
1.45
1.35
Ambient Operation Temperature
0℃
23℃ 40℃ 50℃ 60℃
0.11
0.10
0.08
0.07
0.06
0.23
0.20
0.17
0.14
0.12
0.39
0.35
0.30
0.27
0.24
0.55
0.50
0.40
0.37
0.33
0.79
0.75
0.63
0.57
0.53
1.10
1.00
0.82
0.74
0.65
1.20
1.10
0.92
0.84
0.75
70℃
0.05
0.10
0.20
0.29
0.41
0.55
0.65
85℃
0.03
0.07
0.14
0.23
0.34
0.42
0.52
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SMD0805 SERIES PTC DEVICES
AVERAGE TIME-CURRENT CURVE FOR SMD0805 SERIES
100.00
A
B
C
D
E F
10.00
Time to Trip (Sec.)
A－SMD0805P010TF
B－SMD0805P020TF
C－SMD0805P035TF
D－SMD0805P050TF
E－SMD0805P075TF
F－SMD0805P100TF
SMD0805P110TF
1.00
0.10
0.01
0.10
1.00
10.00
Fault Current (Amp.)
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SMD0805 SERIES PTC DEVICES
SOLDER REFLOW
RECOMMENDED CONDITIONS
Profile Feature
Average Ramp-Up Rate (Ts
max
to Tp)
Preheat
-Temperature Min (Ts
min
)
-Temperature Max (Ts
max
)
-Time (Ts
min
to Ts
max
)
Time maintained above:
-Temperature (T
L
)
-Time (t
L
)
Peak Temperature (Tp)
Time within 5℃ of actual Peak
Temperature (tp)
Ramp-Down Rate
Time 25℃ to Peak Temperature
Storage Condition
Pb-Free Assembly
3℃/second max.
150℃
200℃
60-180 seconds
217℃
60-150 seconds
260℃
20-40 seconds
6℃/second max.
8 minutes max.
0℃~35℃,
≦70%RH
Note 1: All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Recommended reflow methods: IR, vapor phase oven, hot air oven, N
2
environment for lead-free
Recommended maximum paste thickness is 0.25mm (0.010 inch)
Devices can be cleaned using standard industry methods and solvents.
Devices can be reworked using the standard industry practices.
*Customer
should verify the device performance in their specified conditions.
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SMD0805 SERIES PTC DEVICES
FIGURE
PHYSICAL DIMENSIONS (mm)
A
Part Number
SMD0805P010TF
SMD0805P020TF
SMD0805P035TF
SMD0805P050TF
SMD0805P075TF
SMD0805P100TF
SMD0805P110TF
Min.
2.00
2.00
2.00
2.00
2.00
2.00
Max.
2.20
2.20
2.20
2.20
2.20
2.20
Min.
1.20
1.20
1.20
1.20
1.20
1.20
B
Max.
1.50
1.50
1.50
1.50
1.50
1.50
Min.
0.55
0.55
0.45
0.75
0.75
0.80
C
Max.
1.00
1.00
0.75
1.25
1.25
1.80
Min.
0.20
0.20
0.20
0.20
0.20
0.20
D
Max.
0.55
0.55
0.55
0.55
0.55
0.55
Min.
0.10
0.10
0.10
0.10
0.15
0.15
E
Max.
0.45
0.45
0.45
0.45
0.45
0.45
2.00
2.20
1.20
1.50
0.80
1.40
0.20
0.55
0.05
0.45
ENVIRONMENTAL SPECIFICATIONS
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Vibration
-40℃ to +85℃
125℃
+85℃, 1000 hours
+85℃, 85%R.H. 1000 hours
MIL-STD-202 Method 107G
+85℃/-40℃ 20 times
MIL-STD-202, Method 215
MIL-STD-883C, Method 2007.1, Condition A
±5% typical resistance change
±5% typical resistance change
-30% typical resistance change
No change
No change
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