SPECIFICATIONS
mPGA478 Socket
BGA Series CPU Socket
Vertical, SMT Type
1.27mm [.050”] Pitch
478 Pos.
Mechanical
Socket Engagement/Disengagement Force:
4.5Kg max.
Durability:
50 Cycles min.
Socket Retention Force:
10g min.
Solder Ball Shear Force:
500g min.
Chip Unmating Force:
6Kg min.
Electrical
Contact Resistance:
25m
Ω
max.
Dielectric Withstanding Voltage:
360V
Insulation Resistance:
800M
Ω
min.
Physical
Cover:
Thermoplastic, UL 94V-0 rated, Natural Color
Base:
Thermoplastic, UL 94V-0 rated, Black Color
Cam:
Thermoplastic, UL 94V-0 rated, Brown Color
Cap:
Thermoplastic, UL 94V-0 rated, Brown Color
Contact:
Copper Alloy
Plating:
See “ORDERING INFORMATION”
Operating Temperature:
-55
℃
to +125
℃
DRAWING
ORDERING
I N FO R M ATI O N
PR ODUCT NO.: P Z 4 7 8 0 * - 2 7 4 8 - * 1
Actual Loading
No. of Pos.
478=478 Pos.
Pick-up Package
1=Cap
Package
0=Hard Tray
Termination Type & Length
0=BGA Type(63/37 Sn/Pb)
Actuaction & Body Type
8=Handle Design (Plastic Cam)
Contact Area Plating
7=15u" Gold
Base color
Grid Array Type
27=26X26 for Nothwood
4=Black
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
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