Multiplexer, AUP/ULP/V Series, 1-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, PDSO6
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Nexperia |
包装说明 | VSON, |
Reach Compliance Code | compliant |
系列 | AUP/ULP/V |
JESD-30 代码 | S-PDSO-N6 |
JESD-609代码 | e3 |
长度 | 1 mm |
逻辑集成电路类型 | MULTIPLEXER |
湿度敏感等级 | 1 |
功能数量 | 1 |
输入次数 | 2 |
输出次数 | 1 |
端子数量 | 6 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VSON |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 21 ns |
认证状态 | Not Qualified |
座面最大高度 | 0.5 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 0.8 V |
标称供电电压 (Vsup) | 1.1 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 0.35 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 1 mm |
74AUP1G158GF | 74AUP1G158GM | 74AUP1G158GN | 74AUP1G158GS | 74AUP1G158GW | |
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描述 | Multiplexer, AUP/ULP/V Series, 1-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, PDSO6 | Multiplexer, AUP/ULP/V Series, 1-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, PDSO6 | Multiplexer, AUP/ULP/V Series, 1-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, PDSO6 | Multiplexer, AUP/ULP/V Series, 1-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, PDSO6 | Multiplexer, AUP/ULP/V Series, 1-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, PDSO6 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
包装说明 | VSON, | VSON, | SON, | VSON, | TSSOP, |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
系列 | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
JESD-30 代码 | S-PDSO-N6 | R-PDSO-N6 | R-PDSO-N6 | S-PDSO-N6 | R-PDSO-G6 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
长度 | 1 mm | 1.45 mm | 1 mm | 1 mm | 2 mm |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
输入次数 | 2 | 2 | 2 | 2 | 2 |
输出次数 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 6 | 6 | 6 | 6 | 6 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | VSON | VSON | SON | VSON | TSSOP |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
传播延迟(tpd) | 21 ns | 21 ns | 21 ns | 21 ns | 21 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.5 mm | 0.5 mm | 0.35 mm | 0.35 mm | 1.1 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
标称供电电压 (Vsup) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | GULL WING |
端子节距 | 0.35 mm | 0.5 mm | 0.3 mm | 0.35 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
宽度 | 1 mm | 1 mm | 0.9 mm | 1 mm | 1.25 mm |
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