LVC/LCX/Z SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-GDIP-T14 |
| 长度 | 19.56 mm |
| 逻辑集成电路类型 | INVERTER |
| 功能数量 | 6 |
| 输入次数 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-DRAIN |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 3.9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| SN54LVC06AJ | SN54LVC06AFK | SN54LVC06AW | SN74LVC06ADGV | |
|---|---|---|---|---|
| 描述 | LVC/LCX/Z SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14 | LVC/LCX/Z SERIES, HEX 1-INPUT INVERT GATE, CQCC20, CERAMIC, LCC-20 | LVC/LCX/Z SERIES, HEX 1-INPUT INVERT GATE, CDFP14, CERAMIC, DFP-14 | LVC/LCX/Z SERIES, HEX 1-INPUT INVERT GATE, PDSO14, TVSOP-14 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP | QLCC | DFP | SOIC |
| 包装说明 | DIP, | QCCN, | DFP, | TSSOP, TSSOP14,.25 |
| 针数 | 14 | 20 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-GDIP-T14 | S-CQCC-N20 | R-GDFP-F14 | R-PDSO-G14 |
| 长度 | 19.56 mm | 8.89 mm | 9.21 mm | 4.4 mm |
| 逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER |
| 功能数量 | 6 | 6 | 6 | 6 |
| 输入次数 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 20 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C |
| 输出特性 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCN | DFP | TSSOP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | FLATPACK | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 3.9 ns | 3.9 ns | 3.9 ns | 5.6 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.03 mm | 2.03 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | NO LEAD | FLAT | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 0.4 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 7.62 mm | 8.89 mm | 6.29 mm | 3.6 mm |
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