EE PLD, 7ns, 384-Cell, CMOS, PQFP208, PLASTIC, QFP-208
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Lattice(莱迪斯) |
| 零件包装代码 | QFP |
| 包装说明 | PLASTIC, QFP-208 |
| 针数 | 208 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | YES |
| 最大时钟频率 | 76.9 MHz |
| 系统内可编程 | YES |
| JESD-30 代码 | S-PQFP-G208 |
| JESD-609代码 | e0 |
| JTAG BST | YES |
| 长度 | 28 mm |
| 湿度敏感等级 | 3 |
| 专用输入次数 | |
| I/O 线路数量 | 160 |
| 宏单元数 | 384 |
| 端子数量 | 208 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 0 DEDICATED INPUTS, 160 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FQFP |
| 封装等效代码 | QFP208,1.2SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH |
| 电源 | 3.3 V |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 7 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.1 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 宽度 | 28 mm |
| M4A3-384/160-7YC | M4A3-384/192-7AC | M4A3-192/96-65VC | M4A5-192/96-65VC | M4A3-192/96-65FAC | M4A5-32/32-5VI | M4A5-32/32-5JI | |
|---|---|---|---|---|---|---|---|
| 描述 | EE PLD, 7ns, 384-Cell, CMOS, PQFP208, PLASTIC, QFP-208 | EE PLD, 7ns, 384-Cell, CMOS, PBGA256, BGA-256 | EE PLD, 6.5ns, 192-Cell, CMOS, PQFP144, TQFP-144 | EE PLD, 6.5ns, 192-Cell, CMOS, PQFP144, TQFP-144 | EE PLD, 6.5ns, CMOS, PBGA144, FBGA-144 | EE PLD, 5ns, CMOS, PQFP44, TQFP-44 | EE PLD, 5ns, CMOS, PQCC44, PLASTIC, LCC-44 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | PLASTIC, QFP-208 | BGA-256 | TQFP-144 | TQFP-144 | FBGA-144 | QFP, | QCCJ, |
| Reach Compliance Code | compliant | _compli | not_compliant | not_compliant | compliant | compliant | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 | 76.9 MHz | 76.9 MHz | 95.2 MHz | 95.2 MHz | 95.2 MHz | 105 MHz | 105 MHz |
| JESD-30 代码 | S-PQFP-G208 | S-PBGA-B256 | S-PQFP-G144 | S-PQFP-G144 | S-PBGA-B144 | S-PQFP-G44 | S-PQCC-J44 |
| 长度 | 28 mm | 27 mm | 20 mm | 20 mm | 13 mm | 10 mm | 16.5862 mm |
| 湿度敏感等级 | 3 | 1 | 3 | 3 | 3 | 3 | 3 |
| 专用输入次数 | - | - | 16 | 16 | 16 | 2 | 2 |
| I/O 线路数量 | 160 | 192 | 96 | 96 | 96 | 32 | 32 |
| 端子数量 | 208 | 256 | 144 | 144 | 144 | 44 | 44 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C |
| 组织 | 0 DEDICATED INPUTS, 160 I/O | 0 DEDICATED INPUTS, 192 I/O | 16 DEDICATED INPUTS, 96 I/O | 16 DEDICATED INPUTS, 96 I/O | 16 DEDICATED INPUTS, 96 I/O | 2 DEDICATED INPUTS, 32 I/O | 2 DEDICATED INPUTS, 32 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FQFP | LBGA | LFQFP | LFQFP | BGA | QFP | QCCJ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH | GRID ARRAY, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY | FLATPACK | CHIP CARRIER |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 7 ns | 7 ns | 6.5 ns | 6.5 ns | 6.5 ns | 5 ns | 5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 5.25 V | 3.6 V | 5.5 V | 5.5 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 4.75 V | 3 V | 4.5 V | 4.5 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 5 V | 3.3 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | BALL | GULL WING | GULL WING | BALL | GULL WING | J BEND |
| 端子节距 | 0.5 mm | 1.27 mm | 0.5 mm | 0.5 mm | 1 mm | 0.8 mm | 1.27 mm |
| 端子位置 | QUAD | BOTTOM | QUAD | QUAD | BOTTOM | QUAD | QUAD |
| 宽度 | 28 mm | 27 mm | 20 mm | 20 mm | 13 mm | 10 mm | 16.5862 mm |
| 厂商名称 | Lattice(莱迪斯) | - | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) |
| 零件包装代码 | QFP | - | QFP | QFP | BGA | QFP | LCC |
| 针数 | 208 | - | 144 | 144 | 144 | 44 | 44 |
| 其他特性 | YES | YES | YES | YES | - | - | - |
| 系统内可编程 | YES | YES | YES | YES | - | - | - |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 |
| JTAG BST | YES | YES | YES | YES | - | - | - |
| 宏单元数 | 384 | 384 | 192 | 192 | - | - | - |
| 封装等效代码 | QFP208,1.2SQ,20 | BGA256,20X20,50 | QFP144,.87SQ,20 | QFP144,.87SQ,20 | - | - | - |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 5 V | - | - | - |
| 座面最大高度 | 4.1 mm | 1.7 mm | 1.6 mm | 1.6 mm | 2.1 mm | - | 4.57 mm |
| 端子面层 | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD |
| 峰值回流温度（摄氏度） | - | 225 | 260 | 260 | - | 240 | 225 |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | 30 | 30 |
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