BZD27C3V6P~BZD27C75P
VOLTAGE REGULATOR DIODES
VOLTAGE
FEATURES
0.075(1.90)
0.067(1.70)
3.6 to 75 Volts
POWER
800 mW
•
Sillicon Planar Zener Diode
•
Low profile surface-mount package
•
Zener and surge current specification
•
Low leakage current
•
Excellent stability
•
High temperature soldering : 260 C/10 sec. at terminals
•
Lead free in comply with EU RoHS 2011/65/EU directives
•
Green molding compound as per IEC61249 Std. . (Halogen Free)
0.145(3.70)
0.137(3.50)
O
0.115(2.90)
0.106(2.70)
MECHANICAL DATA
Case: SOD-123FL
Terminals : Solderable per MIL-STD-750,Method 2026
Approx Weight: 0.0168 grams
0.030(0.75)
0.017(0.45)
1
2
Cathode
Anode
ABSOLUTE MAXIMUM RATINGS
(TA=25
O
C , unless otherwise specified)
Parameter
Power dissipation
Test conditon
T
L
=80
O
C
T
A
=25
O
C
100
μ
s square pulse(note 2)
Non-repetitive peak pulse power dissipation
10/1000
μ
s waveform (BZD27-C7V5P to BZD27-C75P)
P
RSM
150
Symbol
P
TOT
P
TOT
P
ZSM
Value
2.3
0.8 (note 1)
300
W
Units
W
THERMAL CHARACTERISTICS
(TA=25
O
C , unless otherwise noted)
P a ra me te r
The r m a l r e s i s t a nc e j unc t i o n t o a m b i e nt a i r
The r m a l r e s i s t a nc e j unc t i o n t o l e a d
M a xi m um j unc t i o n t e m p e r a t ur e
S t o r a g e t e m p e r a t ur e r a ng e
Te s t c o n d i t i o n
S ym b o l
R
θ
J A
R
θ
J L
Τ
J
T
s
Va l ue
180
30
150
-5 5 to + 1 5 0
U ni t
K /W
K /W
O
0.008(0.20)
0.004(0.10)
C
C
O
ELCTRICAL CHARACTERISTICS
PA RA M E TE R
F o r w a r d vo l t a g e
Te s t c o n d i t i o n
I
F
= 0 . 2 A
S ym b o l
V
F
Mi n
Ty p
Max
1.2
0.044(1.10)
0.031(0.80)
0.043(1.08)
0.038(0.98)
U ni t s
V
NOTES:
1. Mounted on epoxy-glass PCB with 3X3 mm Cu pads (>40m thick)
2. T
J
=25
O
C prior to surge
STAD-JAN.12.2007
PAGE . 1
BZD27C3V6P~BZD27C75P
Typical Characteristics (T
A
=25
O
C unless otherwise specified)
Figure1. Forward Current vs. Forward Voltage
Figure4. Maximum Pulse Power Dissipation vs.
Zener Voltage
Figure2. Typ. Diode Capacitance vs. Reverse Voltage
Figure5. Non-Repetitive Peak
Reverse Current Pulse Definition
Figure3. Power Dissipation vs. Ambient Temperature
STAD-JAN.12.2007
PAGE . 3
BZD27C3V6P~BZD27C75P
Part No_packing code_Version
BZD27C3V6P_R1_00001
BZD27C3V6P_R2_00001
For example :
RB500V-40_R2_00001
Part No.
Serial number
Version code means HF
Packing size code means 13"
Packing type means T/R
Packing Code
XX
Packing type
Tape and Ammunition Box
(T/B)
Tape and Reel
(T/R)
Bulk Packing
(B/P)
Tube Packing
(T/P)
Tape and Reel (Right Oriented)
(TRR)
Tape and Reel (Left Oriented)
(TRL)
FORMING
1
st
Code
A
R
B
T
S
L
F
Packing size code
N/A
7"
13"
26mm
52mm
PANASERT T/B CATHODE UP
(PBCU)
PANASERT T/B CATHODE DOWN
(PBCD)
Version Code
XXXXX
2
nd
Code
HF or RoHS
1
st
Code 2
nd
~5
th
Code
0
1
2
X
Y
U
D
HF
RoHS
0
1
serial number
serial number
STAD-JAN.12.2007
PAGE . 5
FPGA/CPLD
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