Ultra-compact Waferlevel Chip Size Packeage Output Capacitor-less Single Output Video Drivers
BH76906GU_09 | BH76706GU | BH76909GU | BH76912GU | BH76906GU | BH76916GU | |
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描述 | Ultra-compact Waferlevel Chip Size Packeage Output Capacitor-less Single Output Video Drivers | Ultra-compact Waferlevel Chip Size Packeage Output Capacitor-less Single Output Video Drivers | Ultra-compact Waferlevel Chip Size Packeage Output Capacitor-less Single Output Video Drivers | Ultra-compact Waferlevel Chip Size Packeage Output Capacitor-less Single Output Video Drivers | Ultra-compact Waferlevel Chip Size Packeage Output Capacitor-less Single Output Video Drivers | Ultra-compact Waferlevel Chip Size Packeage Output Capacitor-less Single Output Video Drivers |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | - | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) |
零件包装代码 | - | BGA | BGA | BGA | BGA | BGA |
包装说明 | - | VFBGA, BGA8,3X3,20 | VFBGA, BGA8,3X3,20 | VFBGA, BGA8,3X3,20 | VFBGA, BGA8,3X3,20 | VFBGA, BGA8,3X3,20 |
针数 | - | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | - | compli | compli | compli | compli | compli |
商用集成电路类型 | - | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
JESD-30 代码 | - | S-PBGA-B8 | S-PBGA-B8 | S-PBGA-B8 | S-PBGA-B8 | S-PBGA-B8 |
JESD-609代码 | - | e1 | e1 | e1 | e1 | e1 |
长度 | - | 1.68 mm | 1.68 mm | 1.68 mm | 1.68 mm | 1.68 mm |
功能数量 | - | 1 | 1 | 1 | 1 | 1 |
端子数量 | - | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA |
封装等效代码 | - | BGA8,3X3,20 | BGA8,3X3,20 | BGA8,3X3,20 | BGA8,3X3,20 | BGA8,3X3,20 |
封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 | 260 | 260 |
电源 | - | 3 V | 3 V | 3 V | 3 V | 3 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
最大压摆率 | - | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA |
最大供电电压 (Vsup) | - | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V |
最小供电电压 (Vsup) | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | - | YES | YES | YES | YES | YES |
温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | - | BALL | BALL | BALL | BALL | BALL |
端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 1.68 mm | 1.68 mm | 1.68 mm | 1.68 mm | 1.68 mm |
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