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NT5DS64M8BS-6KI

产品描述DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, TSSOP2-66
产品类别存储    存储   
文件大小6MB,共79页
制造商南亚科技(Nanya)
官网地址http://www.nanya.com/cn
标准
南亚科技股份有限公司以成为最佳DRAM(动态随机存取记忆体)之供应商为目标,强调以服务客户为导向,透过与夥伴们紧密的合作,强化产品的研发与制造,进而提供客户全方位产品及系统解决方案。面对持续成长的利基型DRAM市场,南亚科技除了提供从128Mb到8Gb产品,更持续拓展产品多元化。主要的应用市场包括数位电视、机上盒(STB)、网通、平板电脑等智慧电子系统、车用及工规等产品。同时,为满足大幅成长的行动与穿戴装置市场需求,南亚科技更专注於研发及制造低功耗记忆体产品。近年来,南亚科技积极经营利基型记忆体市场,专注於低功耗与客制化核心产品线的研发。在制程进度上,更导入20奈米制程技术,致力於生产DDR4和LPDDR4产品,期能进一步提升整体竞争力。南亚科技也将持续强化高附加价值利基型记忆体战线与完美的客户服务,强化本业营运绩效,确保所有股东权益,创造企业永续经营之价值。
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NT5DS64M8BS-6KI概述

DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, TSSOP2-66

NT5DS64M8BS-6KI规格参数

参数名称属性值
是否Rohs认证符合
厂商名称南亚科技(Nanya)
零件包装代码TSSOP
包装说明TSOP2, TSSOP66,.46
针数66
Reach Compliance Codeunknown
ECCN代码EAR99
访问模式FOUR BANK PAGE BURST
最长访问时间0.7 ns
其他特性AUTO/SELF REFRESH
最大时钟频率 (fCLK)166 MHz
I/O 类型COMMON
交错的突发长度2,4,8
JESD-30 代码R-PDSO-G66
长度22.22 mm
内存密度536870912 bit
内存集成电路类型DDR DRAM
内存宽度8
功能数量1
端口数量1
端子数量66
字数67108864 words
字数代码64000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织64MX8
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TSOP2
封装等效代码TSSOP66,.46
封装形状RECTANGULAR
封装形式SMALL OUTLINE
电源2.5 V
认证状态Not Qualified
刷新周期8192
座面最大高度1.2 mm
自我刷新YES
连续突发长度2,4,8
最大待机电流0.005 A
最大压摆率0.3 mA
最大供电电压 (Vsup)2.7 V
最小供电电压 (Vsup)2.3 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
宽度10.16 mm

NT5DS64M8BS-6KI文档预览

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NT5DS128M4BF
NT5DS64M8BF
NT5DS32M16BF
NT5DS128M4BT
NT5DS64M8BT
NT5DS32M16BT
NT5DS128M4BG
NT5DS64M8BG
NT5DS32M16BG
NT5DS128M4BS
NT5DS64M8BS
NT5DS32M16BS
512Mb DDR SDRAM
Features
CAS Latency and Frequency
CAS
Latency
2
2.5
3
Maximum Operating Frequency (MHz)
DDR400(5TI)
DDR333(6KI)
-
133
166
166
200
-
• DDR 512M bit, die B, based on 110nm design rules
• Double data rate architecture: two data transfers per
clock cycle
• Bidirectional data strobe (DQS) is transmitted and
received with data, to be used in capturing data at the
receiver
• DQS is edge-aligned with data for reads and is center-
aligned with data for writes
Differential clock inputs (CK and CK)
Four internal banks for concurrent operation
Data mask (DM) for write data
DLL aligns DQ and DQS transitions with CK transitions
Commands entered on each positive CK edge; data and
data mask referenced to both edges of DQS
Burst lengths: 2, 4, or 8
CAS Latency: 2 / 2.5(6KI) or 2.5 / 3(5TI)
Auto Precharge option for each burst access
Auto Refresh and Self Refresh Modes
7.8µs Maximum Average Periodic Refresh Interval
SSTL-2 compatible
V
DD
= V
DDQ
= 2.5V
±
0.2V (6KI)
V
DD
= V
DDQ
= 2.6V
±
0.1V (5TI)
Description
NT5DS128M4BG, NT5DS32M16BG, NT5DS64M8BG,
NT5DS128M4BS, NT5DS32M16BS, NT5DS64M8BS,
NT5DS128M4BF, NT5DS32M16BF, NT5DS64M8BF,
NT5DS128M4BT, NT5DS32M16BT, NT5DS64M8BT are the
die B of 512Mb SDRAM devices based using DDR interface.
They are all based on Nanya’s 110 nm design process.
The 512Mb DDR SDRAM is a high-speed CMOS, dynamic
random-access memory containing 536,870,912 bits. It is
internally configured as a quad-bank DRAM.
The 512Mb DDR SDRAM uses a double-data-rate architec-
ture to achieve high-speed operation. The double data rate
architecture is essentially a
2n
prefetch architecture with an
interface designed to transfer two data words per clock cycle
at the I/O pins. A single read or write access for the 512Mb
DDR SDRAM effectively consists of a single
2n-bit
wide, one
clock cycle data transfer at the internal DRAM core and two
corresponding n-bit wide, one-half-clock-cycle data transfers
at the I/O pins.
A bidirectional data strobe (DQS) is transmitted externally,
along with data, for use in data capture at the receiver. DQS
is a strobe transmitted by the DDR SDRAM during Reads
and by the memory controller during Writes. DQS is edge-
aligned with data for Reads and center-aligned with data for
Writes.
The 512Mb DDR SDRAM operates from a differential clock
(CK and CK; the crossing of CK going high and CK going
LOW is referred to as the positive edge of CK). Commands
(address and control signals) are registered at every positive
edge of CK. Input data is registered on both edges of DQS,
and output data is referenced to both edges of DQS, as well
as to both edges of CK.
Read and write accesses to the DDR SDRAM are burst ori-
ented; accesses start at a selected location and continue for
a programmed number of locations in a programmed
sequence. Accesses begin with the registration of an Active
command, which is then followed by a Read or Write com-
mand. The address bits registered coincident with the Active
command are used to select the bank and row to be
accessed. The address bits registered coincident with the
Read or Write command are used to select the bank and the
starting column location for the burst access.
The DDR SDRAM provides for programmable Read or Write
burst lengths of 2, 4, or 8 locations. An Auto Precharge func-
tion may be enabled to provide a self-timed row precharge
that is initiated at the end of the burst access.
As with standard SDRAMs, the pipelined, multibank architec-
ture of DDR SDRAMs allows for concurrent operation,
thereby providing high effective bandwidth by hiding row pre-
charge and activation time.
An auto refresh mode is provided along with a power-saving
Power Down mode. All inputs are compatible with the JEDEC
Standard for SSTL_2. All outputs are SSTL_2, Class II com-
patible.
The functionality described and the timing specifications
included in this data sheet are for the DLL Enabled mode of
operation.
REV 1.3
11/2007
1
©
NANYA TECHNOLOGY CORP
. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
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