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IBM0436A81DLAB-3F: 产品描述Standard SRAM, 256KX36, 1.8ns, CMOS, PBGA119, BGA-119; 产品类别存储存储; 文件大小279KB，共25页; 制造商IBM; 官网地址http://www.ibm.com

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IBM0436A81DLAB-3F概述

Standard SRAM, 256KX36, 1.8ns, CMOS, PBGA119, BGA-119

IBM0436A81DLAB-3F规格参数

参数名称	属性值
厂商名称	IBM
零件包装代码	BGA
包装说明	BGA, BGA119,7X17,50
针数	119
Reach Compliance Code	unknown
ECCN代码	3A991.B.2.A
最长访问时间	1.8 ns
其他特性	PIPELINED ARCHITECTURE
I/O 类型	COMMON
JESD-30 代码	R-PBGA-B119
长度	22 mm
内存密度	9437184 bit
内存集成电路类型	STANDARD SRAM
内存宽度	36
功能数量	1
端子数量	119
字数	262144 words
字数代码	256000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度
组织	256KX36
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装等效代码	BGA119,7X17,50
封装形状	RECTANGULAR
封装形式	GRID ARRAY
并行/串行	PARALLEL
电源	1.8,3.3 V
认证状态	Not Qualified
座面最大高度	2.679 mm
最大待机电流	0.065 A
最小待机电流	3.13 V
最大压摆率	0.45 mA
最大供电电压 (Vsup)	3.465 V
最小供电电压 (Vsup)	3.135 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	OTHER
端子形式	BALL
端子节距	1.27 mm
端子位置	BOTTOM
宽度	14 mm

IBM0436A81DLAB-3F相似产品对比

	IBM0436A81DLAB-3F	IBM0418A81DLAB-5	IBM0436A41DLAB-5	IBM0436A81DLAB-4	IBM0436A41DLAB-3F	IBM0418A81DLAB-3F	IBM0436A81DLAB-5	IBM0436A41DLAB-4	IBM0418A81DLAB-4
描述	Standard SRAM, 256KX36, 1.8ns, CMOS, PBGA119, BGA-119	Standard SRAM, 512KX18, 2.25ns, CMOS, PBGA119, BGA-119	Standard SRAM, 128KX36, 2.25ns, CMOS, PBGA119, BGA-119	Standard SRAM, 256KX36, 2ns, CMOS, PBGA119, BGA-119	Standard SRAM, 128KX36, 1.8ns, CMOS, PBGA119, BGA-119	Standard SRAM, 512KX18, 1.8ns, CMOS, PBGA119, BGA-119	Standard SRAM, 256KX36, 2.25ns, CMOS, PBGA119, BGA-119	Standard SRAM, 128KX36, 2ns, CMOS, PBGA119, BGA-119	Standard SRAM, 512KX18, 2ns, CMOS, PBGA119, BGA-119
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50
针数	119	119	119	119	119	119	119	119	119
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	1.8 ns	2.25 ns	2.25 ns	2 ns	1.8 ns	1.8 ns	2.25 ns	2 ns	2 ns
其他特性	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119
长度	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm
内存密度	9437184 bit	9437184 bit	4718592 bit	9437184 bit	4718592 bit	9437184 bit	9437184 bit	4718592 bit	9437184 bi
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	36	18	36	36	36	18	36	36	18
功能数量	1	1	1	1	1	1	1	1	1
端子数量	119	119	119	119	119	119	119	119	119
字数	262144 words	524288 words	131072 words	262144 words	131072 words	524288 words	262144 words	131072 words	524288 words
字数代码	256000	512000	128000	256000	128000	512000	256000	128000	512000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
组织	256KX36	512KX18	128KX36	256KX36	128KX36	512KX18	256KX36	128KX36	512KX18
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
封装等效代码	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
电源	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.679 mm	2.679 mm	2.679 mm	2.679 mm	2.679 mm	2.679 mm	2.679 mm	2.679 mm	2.679 mm
最大待机电流	0.065 A	0.065 A	0.065 A	0.065 A	0.065 A	0.065 A	0.065 A	0.065 A	0.065 A
最小待机电流	3.13 V	3.13 V	3.13 V	3.13 V	3.13 V	3.13 V	3.13 V	3.13 V	3.13 V
最大压摆率	0.45 mA	0.35 mA	0.37 mA	0.42 mA	0.45 mA	0.43 mA	0.37 mA	0.42 mA	0.4 mA
最大供电电压 (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
最小供电电压 (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
厂商名称	IBM	IBM	-	IBM	IBM	IBM	IBM	IBM	IBM

IBM0436A81DLAB-3F

IBM0436A81DLAB-3F概述

IBM0436A81DLAB-3F规格参数

IBM0436A81DLAB-3F相似产品对比

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