AFBR-5805Z/5805TZ/5805AZ/5805ATZ
ATM Transceivers for SONET OC-3 / SDH STM-1
in Low Cost 1 x 9 Package Style
Data Sheet
Description
The AFBR-5800Z family of transceivers from Avago Tech-
nologies provide the system designer with products
to implement a range of solutions for multimode fiber
SONET OC-3 (SDH STM-1) physical layers for ATM and
other services.
The transceivers are all supplied in the industry standard
1 x 9 SIP package style with either a duplex SC or a duplex
ST* connector interface.
Features
Full compliance with ATM forum UNI SONET OC-3 mul-
timode fiber physical layer specification
Multisourced 1 x 9 package style with choice of duplex
SC or duplex ST* receptacle
Wave solder and aqueous wash process compatibility
Manufactured in an ISO 9002 certified facility
Single +3.3 V or +5.0 V power supply
RoHS Compliance
ATM 2 km Backbone Links
The AFBR-5805Z/-5805TZ are 1300 nm products with
optical performance compliant with the SONET STS-3c
(OC-3) Physical Layer Interface Specification. This physical
layer is defined in the ATM Forum User-Network Interface
(UNI) Specification Version 3.0. This document references
the ANSI T1E1.2 specification for the details of the inter-
face for 2 km multimode fiber backbone links.
The ATM 100 Mb/s-125 MBd Physical Layer interface is
best implemented with the AFBR-5803 family of Fast Eth-
ernet and FDDI Transceivers which are specified for use in
this 4B/5B encoded physical layer per the FDDI PMD stan-
dard.
Applications
Multimode fiber ATM backbone links
Multimode fiber ATM wiring closet to desktop links
Transmitter Sections
The transmitter section of the AFBR-5803Z and AFBR-
5805Z series utilize 1300 nm InGaAsP LEDs. These LEDs
are packaged in the optical subassembly portion of the
transmitter section. They are driven by a custom silicon IC
which converts differential PECL logic signals, ECL refer-
enced (shifted) to a +3.3 V or +5.0 V supply, into an analog
LED drive current.
and pin out are compliant with the multisource definition
of the 1 x 9 SIP. The low profile of the Avago Technologies
transceiver design complies with the maximum height
allowed for the duplex SC connector over the entire
length of the package.
The optical subassemblies utilize a high volume assem-
bly process together with low cost lens elements which
result in a cost effective building block.
The electrical subassembly consists of a high volume
multilayer printed circuit board on which the IC chips and
various surface-mounted passive circuit elements are at-
tached.
The package includes internal shields for the electrical
and optical subassemblies to ensure low EMI emissions
and high immunity to external EMI fields.
The outer housing including the duplex SC connector or
the duplex ST ports is molded of filled nonconductive
plastic to provide mechanical strength and electrical iso-
lation. The solder posts of the Avago Technologies design
are isolated from the circuit design of the transceiver
and do not require connection to a ground plane on the
circuit board.
The transceiver is attached to a printed circuit board with
the nine signal pins and the two solder posts which exit
the bottom of the housing. The two solder posts provide
the primary mechanical strength to withstand the loads
imposed on the transceiver by mating with duplex or
simplex SC or ST connectored fiber cables.
Receiver Sections
The receiver section of the AFBR-5803Z and AFBR-
5805Z series utilize InGaAs PIN photodiodes coupled to
a custom silicon transimpedance preamplifier IC. These
are packaged in the optical subassembly portion of the
receiver.
These PIN/preamplifier combinations are coupled to
a custom quantizer IC which provides the final pulse
shaping for the logic output and the Signal Detect func-
tion. The data output is dif-ferential. The signal detect
output is single-ended. Both data and signal detect
outputs are PECL compatible, ECL referenced (shifted) to
a 3.3 V or +5.0 V power supply.
Package
The overall package concept for the Avago Technologies
transceivers consists of three basic elements; the two
optical subassemblies, an electrical subassembly and the
housing as illustrated in Figure 1a and Figure 1b.
The package outline drawing and pin out are shown in
Figures 2a, 2b and 3. The details of this package outline
ELECTRICAL SUBASSEMBLY
DIFFERENTIAL
DATA OUT
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
DUPLEX SC
RECEPTACLE
PIN PHOTODIODE
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
DRIVER IC
LED
TOP VIEW
Figure 1a. SC Connector Block Diagram
2
ELECTRICAL SUBASSEMBLY
DIFFERENTIAL
DATA OUT
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
DUPLEX ST
RECEPTACLE
PIN PHOTODIODE
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
DRIVER IC
LED
TOP VIEW
Figure 1b. ST Connector Block Diagram.
Case Temperature
Measurement Point
39.12
MAX.
(1.540)
12.70
(0.500)
6.35
(0.250)
25.40
MAX.
(1.000)
AREA
RESERVED
FOR
PROCESS
PLUG
12.70
(0.500)
3.30 ± 0.38
(0.130 ± 0.015)
+ 0.08
– 0.05
+ 0.003
(0.030
– 0.002
0.75
5.93 ± 0.1
(0.233 ± 0.004)
)
10.35 MAX.
(0.407)
2.92
(0.115)
Ø
0.46
(9x)
(0.018)
NOTE 1
18.52
(0.729)
4.14
(0.163
1.27 + 0.25
– 0.05
+ 0.010
(0.050
)
– 0.002
NOTE 1
23.55
(0.927)
20.32 [8x(2.54/.100)]
(0.800)
16.70
(0.657)
17.32 20.32
(0.682 (0.800)
23.32
(0.918)
0.87
(0.034)
Note 1:
23.24
(0.915)
15.88
(0.625)
Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts
have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 2a. Package Outline Drawing
3
42 MAX.
(1.654)
24.8
(0.976)
5.99
(0.236)
25.4
MAX.
(1.000)
12.7
(0.500)
Case Temperature
Measurement Point
12.0
MAX.
(0.471)
2.6 ±0.4
(0.102 ± 0.016)
Ø 0.46
(0.018)
NOTE 1
20.32
± 0.38
(± 0.015)
3.3 ± 0.38
(0.130 ± 0.015)
+ 0.25
- 0.05
(0.050) + 0.010
( - 0.002 )
1.27
20.32
(0.800)
Ø 2.6
(0.102)
22.86
(0.900)
20.32
[(8x (2.54/0.100)]
(0.800)
21.4
(0.843)
3.6
(0.142)
17.4
(0.685)
1.3
(0.051)
23.38
(0.921)
18.62
(0.733)
Note 1:
Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts
have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating.
DIMENSIONS IN MILLIMETERS (INCHES).
Figure 2b. ST Package Outline Drawing
1 = V
EE
2 = RD
3 = RD
4 = SD
5 = V
CC
6 = V
CC
7 = TD
8 = TD
9 = V
EE
TOP VIEW
Figure 3. Pin Out Diagram.
N/C
Rx
Tx
N/C
4
(
+ 0.08
0.5
- 0.05
(0.020) + 0.003
( - 0.002
Application Information
OPTICAL POWER BUDGET (dB)
12
AFBR-5805Z, 62.5/125 μm
The Applications Engineering group in the Avago Tech-
nologies Fiber Optics Communication Division is avail-
able to assist you with the technical understanding and
design trade-offs associated with these transceivers. You
can contact them through your Avago Technologies sales
representative.
The following information is provided to answer some of
the most common questions about the use of these parts.
10
8
6
4
2
AFBR-5805Z
50/125 μm
0
Transceiver Optical Power Budget versus Link Length
Optical Power Budget (OPB) is the available optical power
for a fiber optic link to accommodate fiber cable losses
plus losses due to in-line connectors, splices, optical
switches, and to provide margin for link aging and un-
planned losses due to cable plant reconfiguration or
repair.
Figure 4 illustrates the predicted OPB associated with the
transceiver series specified in this data sheet at the Begin-
ning of Life (BOL). These curves represent the attenuation
and chromatic plus modal dispersion losses associated
with the 62.5/125 μm and 50/125 μm fiber cables only.
The area under the curves represents the remaining OPB
at any link length, which is available for overcoming non-
fiber cable related losses.
Avago Technologies’ LED technology has produced 1300
nm LED devices with lower aging characteristics than nor-
mally associated with these technologies in the industry.
The industry convention is 1.5 dB aging for 1300 nm LEDs.
The Avago Technologies 1300 nm LEDs are specified to
experience less than 1 dB of aging over normal commeri-
cal equipment mission life periods. Contact your Avago
Technologies sales representative for additional details.
Figure 4 was generated for the 1300 nm transceivers with
a Avago Technologies fiber optic link model containing
the current industry conventions for fiber cable specifica-
tions and the draft ANSI T1E1.2. These optical parameters
are reflected in the guaranteed performance of the trans-
ceiver specifications in this data sheet. This same model
has been used extensively in the ANSI and IEEE commit-
tees, including the ANSI T1E1.2 committee, to establish
the optical performance requirements for various fiber
optic interface standards. The cable parameters used
come from the ISO/IEC JTC1/SC 25/WG3 Generic Cabling
for Customer Premises per DIS 11801 document and the
EIA/TIA-568-A Commercial Building Telecommunications
Cabling Standard per SP-2840.
0.3 0.5
1.0
1.5
2.0
2.5
FIBER OPTIC CABLE LENGTH (km)
Figure 4. Optical Power Budget at BOL versus
Fiber Optic Cable Length.
5
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