Flash Module, 2MX16, 120ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56
| 参数名称 | 属性值 |
| 包装说明 | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最长访问时间 | 120 ns |
| 备用内存宽度 | 8 |
| JESD-30 代码 | R-CDSO-G56 |
| JESD-609代码 | e4 |
| 内存密度 | 33554432 bit |
| 内存集成电路类型 | FLASH MODULE |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 56 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 2MX16 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 编程电压 | 5 V |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | GULL WING |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 类型 | NOR TYPE |
| 宽度 | 12.96 mm |
| Base Number Matches | 1 |
| WF2M16-120DAM5 | WF2M16-120DAI5 | WF2M16-150DAI5 | WF2M16-120DLC5 | WF2M16-120DLI5 | WF2M16-150DLC5 | WF2M16-150DLI5 | WF2M16-150DAM5 | WF2M16-90DAI5 | WF2M16-90DAM5 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Flash Module, 2MX16, 120ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | Flash Module, 2MX16, 120ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | Flash Module, 2MX16, 150ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | Flash, 2MX16, 120ns, CDSO44, SOJ-44 | Flash, 2MX16, 120ns, CDSO44, SOJ-44 | Flash, 2MX16, 150ns, CDSO44, SOJ-44 | Flash, 2MX16, 150ns, CDSO44, SOJ-44 | Flash Module, 2MX16, 150ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | Flash Module, 2MX16, 90ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | Flash Module, 2MX16, 90ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 |
| 包装说明 | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | SOJ, | SOJ, | SOJ, | SOJ, | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 |
| Reach Compliance Code | unknown | unknown | unknown | compliant | compliant | compliant | compliant | unknown | unknown | unknow |
| 最长访问时间 | 120 ns | 120 ns | 150 ns | 120 ns | 120 ns | 150 ns | 150 ns | 150 ns | 90 ns | 90 ns |
| 备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-CDSO-G56 | R-CDSO-G56 | R-CDSO-G56 | R-CDSO-J44 | R-CDSO-J44 | R-CDSO-J44 | R-CDSO-J44 | R-CDSO-G56 | R-CDSO-G56 | R-CDSO-G56 |
| 内存密度 | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bi |
| 内存集成电路类型 | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH | FLASH | FLASH | FLASH | FLASH MODULE | FLASH MODULE | FLASH MODULE |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 56 | 56 | 56 | 44 | 44 | 44 | 44 | 56 | 56 | 56 |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | - | -40 °C | - | -40 °C | -55 °C | -40 °C | -55 °C |
| 组织 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | SSOP | SSOP | SSOP | SOJ | SOJ | SOJ | SOJ | SSOP | SSOP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY |
| 端子形式 | GULL WING | GULL WING | GULL WING | J BEND | J BEND | J BEND | J BEND | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 12.96 mm | 12.96 mm | 12.96 mm | 10.92 mm | 10.92 mm | 10.92 mm | 10.92 mm | 12.96 mm | 12.96 mm | 12.96 mm |
| ECCN代码 | 3A001.A.2.C | 3A991.B.1.A | 3A991.B.1.A | - | - | - | - | 3A001.A.2.C | 3A991.B.1.A | 3A001.A.2.C |
| JESD-609代码 | e4 | e4 | e4 | - | - | - | - | e4 | e4 | e4 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | - | - | Not Qualified | Not Qualified | Not Qualified |
| 端子面层 | GOLD | GOLD | GOLD | - | - | - | - | GOLD | GOLD | GOLD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | - | - | - | - | NOR TYPE | NOR TYPE | NOR TYPE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
PCB设计
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PCB设计
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