Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CDIP24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DIP, DIP24,.6 |
Reach Compliance Code | unknown |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-XDIP-T24 |
JESD-609代码 | e0 |
信道数量 | 16 |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP24,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5/15 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
MC14067BCLD | MC14067BCPDS | MC14067BALS | MC14067BALD | MC14067BALDS | MC14097BCLDS | |
---|---|---|---|---|---|---|
描述 | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CDIP24 | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, PDIP24 | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CDIP24 | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CDIP24 | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CDIP24 | Differential Multiplexer, 1 Func, 8 Channel, CMOS, CDIP24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
JESD-30 代码 | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
信道数量 | 16 | 16 | 16 | 16 | 16 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
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