Modem, CMOS, PQFP100
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | QFP, QFP100,.63SQ,20 |
Reach Compliance Code | unknown |
JESD-30 代码 | S-PQFP-G100 |
JESD-609代码 | e0 |
端子数量 | 100 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装等效代码 | QFP100,.63SQ,20 |
封装形状 | SQUARE |
封装形式 | FLATPACK |
电源 | 3.3/5 V |
认证状态 | Not Qualified |
最大压摆率 | 26 mA |
表面贴装 | YES |
技术 | CMOS |
电信集成电路类型 | MODEM |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
Base Number Matches | 1 |
V32FBV-L3-SSS | V32FBV-L3-FFJ | DSP16A-F14-033 | DSP16A-F14-055 | DSP16A-F14-055I | DSP16A-M14-025 | DSP16A-M14-033 | DSP16A-M14-055I | |
---|---|---|---|---|---|---|---|---|
描述 | Modem, CMOS, PQFP100 | Modem, CMOS, PQFP84 | Digital Signal Processor, 16-Bit Size, CMOS, PQFP84 | Digital Signal Processor, 16-Bit Size, CMOS, PQFP84 | Digital Signal Processor, 16-Bit Size, CMOS, PQFP84 | Digital Signal Processor, 16-Bit Size, CMOS, PQCC84 | Digital Signal Processor, 16-Bit Size, CMOS, PQCC84 | Digital Signal Processor, 16-Bit Size, CMOS, PQCC84 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | QFP, QFP100,.63SQ,20 | BQFP, SPQFP84,.8SQ | BQFP, SPQFP84,.8SQ | BQFP, SPQFP84,.8SQ | BQFP, SPQFP84,.8SQ | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC84,1.2SQ |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | S-PQFP-G100 | S-PQFP-G84 | S-PQFP-G84 | S-PQFP-G84 | S-PQFP-G84 | S-PQCC-J84 | S-PQCC-J84 | S-PQCC-J84 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 100 | 84 | 84 | 84 | 84 | 84 | 84 | 84 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | BQFP | BQFP | BQFP | BQFP | QCCJ | QCCJ | QCCJ |
封装等效代码 | QFP100,.63SQ,20 | SPQFP84,.8SQ | SPQFP84,.8SQ | SPQFP84,.8SQ | SPQFP84,.8SQ | LDCC84,1.2SQ | LDCC84,1.2SQ | LDCC84,1.2SQ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
电源 | 3.3/5 V | 3.3/5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | 26 mA | 26 mA | 150 mA | 90 mA | 90 mA | 188 mA | 150 mA | 90 mA |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | J BEND | J BEND |
端子节距 | 0.5 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
位大小 | - | - | 16 | 16 | 16 | 16 | 16 | 16 |
格式 | - | - | FIXED-POINT | FIXED-POINT | FIXED-POINT | FIXED-POINT | FIXED-POINT | FIXED-POINT |
RAM(字数) | - | - | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 |
标称供电电压 | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
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