IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
Reach Compliance Code | not_compliant |
位大小 | 32 |
JESD-30 代码 | S-PBGA-B740 |
JESD-609代码 | e0 |
湿度敏感等级 | 3 |
端子数量 | 740 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装等效代码 | BGA740,37X37,40 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
峰值回流温度(摄氏度) | 225 |
电源 | 1.8/2.5,3.3 V |
认证状态 | Not Qualified |
速度 | 266 MHz |
表面贴装 | YES |
技术 | CMOS |
端子面层 | Tin/Lead/Silver (Sn/Pb/Ag) |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
Base Number Matches | 1 |
MPC8360EZUADDHA | MPC8360EVVADDHA | MPC8360VVADDHA | MPC8360ZUAHFHA | MPC8360ZUADDHA | |
---|---|---|---|---|---|
描述 | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC |
是否无铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 符合 | 符合 | 不符合 | 不符合 |
Reach Compliance Code | not_compliant | unknown | unknown | not_compliant | not_compliant |
位大小 | 32 | 32 | 32 | 32 | 32 |
JESD-30 代码 | S-PBGA-B740 | S-PBGA-B740 | S-PBGA-B740 | S-PBGA-B740 | S-PBGA-B740 |
JESD-609代码 | e0 | e3 | e3 | e0 | e0 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
端子数量 | 740 | 740 | 740 | 740 | 740 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BGA | BGA | BGA |
封装等效代码 | BGA740,37X37,40 | BGA740,37X37,40 | BGA740,37X37,40 | BGA740,37X37,40 | BGA740,37X37,40 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | 225 |
电源 | 1.8/2.5,3.3 V | 1.8/2.5,3.3 V | 1.8/2.5,3.3 V | 1.8/2.5,3.3 V | 1.8/2.5,3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
速度 | 266 MHz | 266 MHz | 266 MHz | 500 MHz | 266 MHz |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
端子面层 | Tin/Lead/Silver (Sn/Pb/Ag) | MATTE TIN | MATTE TIN | Tin/Lead/Silver (Sn/Pb/Ag) | Tin/Lead/Silver (Sn/Pb/Ag) |
端子形式 | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
Base Number Matches | 1 | - | - | 1 | 1 |
厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
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