SPECIFICATIONS
SIM card Conn.
WL Series
SIM Card, SMT Type
1.80mm [.071”] Height
6 Pos.
Mechanical
Normal Force:
0.3N min
Durability:
5000 Cycles
Electrical
Voltage Rating:
15Vmax
Current Rating:
0.5 A max
Contact Resistance:
100 m
Ω
max at 10mA.
Dielectric Withstanding Voltage:
540V AC/1 min.
Insulation Resistance:
1000 M
Ω
min (initial), 100 M
Ω
min (final),
Physical
Insert molding:
THERMOPLASTIC UL 94V-0, Color Black
Contact:
Copper Alloy
Plating:
See “ORDERING INFORMATION”
Operating Temperature:
-30
℃
to +85
℃
DRAWING
ORDERING
I N FO R M ATIO N
3- M05 -TR
Package And Solder Tail Type
T = Tray
TR= Tape & Reel
1F= Tray (Lead Free)
7F= Tape & Reel (Lead Free)
PRODUCT NO.: WL 6 18 A
SIM Card Conn.
No. Contact
6= 6 Pin
8= 8 Pin
Modification Code
Code No.: 2 or 3 Code(A~Z or 0~9)
Body Height
05= 2.5mm
06=2.6mm
07=0.7mm
08=2.8mm
10=1.0mm
11=1.1mm
90=9.0mm
Upper Cover Type
Contact Area Plating Thickness
1= Gold Flash
2= 20u" Gold Plating
3= 30u" Gold Plating
6= 10u" Gold Plating
7= 15u" Gold Plating
A= 10u" Pd/Ni +Gold Plating
B= 20u" Pd/Ni +Gold Plating
C= 30u" Pd/Ni +Gold Plating
D= 40u" Pd/Ni +Gold Plating
L= 25u" Pd/Ni +Gold Plating
~
A= Upper Cover B= Slider In Type
C= Hinge Type
D= Metal Hook or Cover Type
E= Metal Cover with Push-Push F= Pogo Pin Type
G= Metal Cover with Inject&Door H= Compression Type
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
FPGA/CPLD
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