HFBR-0500Z Series
Versatile Link
The Versatile Fiber Optic Connection
Data Sheet
Description
The Versatile Link series is a complete family of fiber
optic link components for applications requiring a low
cost solution. The HFBR-0500Z series includes trans-
mitters, receivers, connectors and cable specified for
easy design. This series of components is ideal for
solving problems with voltage isolation/insulation,
EMI/RFI immunity or data security. The optical link
design is simplified by the logic compatible receivers
and complete specifi-cations for each component. The
key optical and electrical parameters of links configured
with the HFBR-0500Z family are fully guaranteed from
0° to 70°C.
A wide variety of package configurations and connectors
provide the designer with numerous mechanical solutions
to meet application requirements. The transmitter and
receiver components have been designed for use in high
volume/low cost assembly processes such as auto inser-
tion and wave soldering.
Transmitters incorporate a 660 nm LED. Receivers
include a monolithic dc coupled, digital IC receiver
with open collector Schottky output transistor. An
internal pullup resistor is avail able for use in the
HFBR-25X1Z/2Z/4Z receivers. A shield has been in-
tegrated into the receiver IC to provide additional,
localized noise immunity.
Internal optics have been optimized for use with 1 mm
diameter plastic optical fiber. Versatile Link specifications
incorporate all connector interface losses. Therefore,
optical calculations for common link applications are
simplified.
Features
x
RoHS-compliant
x
Low cost fiber optic components
x
Enhanced digital links: dc-5 MBd
x
Extended distance links up to 120 m at 40 kBd
x
Low current link: 6 mA peak supply current
x
Horizontal and vertical mounting
x
Interlocking feature
x
High noise immunity
x
Easy connectoring: simplex, duplex, and latching
connectors
x
Flame retardant
x
Transmitters incorporate a 660 nm red LED for easy
visibility
x
Compatible with standard TTL circuitry
Applications
x
Reduction of lightning/voltage transient susceptibility
x
Motor controller triggering
x
Data communications and local area networks
x
Electromagnetic Compatibility (EMC) for regulated
systems: FCC, VDE, CSA, etc.
x
Tempest-secure data processing equipment
x
Isolation in test and measurement instruments
x
Error free signalling for industrial and manufacturing
equipment
x
Automotive communications and control networks
x
Noise immune communication in audio and video
equipment
HFBR-0500Z Series Part Number Guide
HFBR X5XXZ
1 = Transmitter
2 = Receiver
Z = RoHS-compliant
5 = 600 nm Transmitter and
Receiver Products
2 = Horizontal Package
3 = Vertical Package
1 = 5 MBd High Performance Link
2 = 1 MBd High Performance Link
3 = 40 kBd Low Current/Extended Distance Link
4 = 1 MBd Standard Link
6 = 155 MBd Receiver
7 = 155 MBd Transmitter
8 = 10 MBd High Performance Link
Link Selection Guide
(Links specified from 0 to 70°C, for plastic optical fiber unless specified.)
Signal Rate
Distance (m) 25°C
Distance (m)
40 kBd
1 MBd
1 MBd
5 Mbd
120
20
55
30
110
10
45
20
Transmitter
HFBR-1523Z
HFBR-1524Z
HFBR-1522Z
HFBR-1521Z
Receiver
HFBR-2523Z
HFBR-2524Z
HFBR-2522Z
HFBR-2521Z
Evaluation Kit
HFBR-0500Z 1 MBd Versatile Link:
This kit contains: HFBR-1524Z Tx, HFBR-2524Z Rx,
polishing kit, 3 styles of plastic connectors, Bulkhead
feedthrough, 5 meters of 1 mm diameter plastic cable,
lapping film and grit paper, and HFBR-0500Z data sheet.
Package Orientation
Performance and pinouts for the vertical and hori-
zontal packages are identical. To provide additional
attachment support for the vertical Versatile Link
housing, the designer has the option of using a self-
tapping screw through a printed circuit board into a
mounting hole at the bottom of the package. For most
applications this is not necessary.
Application Literature
Application Note 1035 (Versatile Link)
Package Housing Color
Versatile Link components and simplex connectors are
color coded to eliminate confusion when making connec-
tions. Receivers are blue and transmitters are gray, except
for the HFBR-15X3Z transmitter, which is black.
Package and Handling Information
The compact Versatile Link package is made of a flame
retardant VALOX
®
UL 94 V-0 material (UL file # E121562)
and uses the same pad layout as a standard, eight pin
dual-in-line package. Vertical and horizontal mountable
parts are available. These low profile Versatile Link pack-
ages are stackable and are enclosed to provide a dust
resistant seal. Snap action simplex, simplex latching,
duplex, and duplex latching connectors are offered with
simplex or duplex cables.
VALOX
®
is a registered trademark of the General Electric Corporation.
2
Handling
Versatile Link components are auto-insertable. When
wave soldering is performed with Versatile Link compo-
nents, the optical port plug should be left in to prevent
contamination of the port. Do not use reflow solder
processes (i.e., infrared reflow or vapor-phase reflow).
Nonhalogenated water soluble fluxes (i.e., 0% chloride),
not rosin based fluxes, are recommended for use with
Versatile Link components.
Versatile Link components are moisture sensitive
devices and are shipped in a moisture sealed bag. If the
components are exposed to air for an extended period
of time, they may require a baking step before the solder-
ing process. Refer to the special labeling on the shipping
tube for details.
Level
Recommended Chemicals for Cleaning/Degreasing
Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane,
heptane. Other: soap solution, naphtha.
Do not use partially halogenated hydrocarbons such
as 1,1.1 trichloroethane, ketones such as MEK, acetone,
chloroform, ethyl acetate, methylene dichloride, phenol,
methylene chloride, or N-methylpyrolldone. Also, Avago
does not recommend the use of cleaners that use
halogenated hydrocarbons because of their potential
environmental harm.
CAUTION
This bag contains
MOISTURE-SENSITIVE
DEVICES
4
1. Shelf life in sealed bag: 12 months at < 40°C and < 90% Relative Humidity (RH).
2. After this bag is opened, devices that will be subjected to wave soldering, or
equivalent processing (solder temperature < 260°C for 10 sec) must be:
a) Mounted within 72 hours at factory conditions of ≤ 30°C/60% RH.
b) Stored at ≤ 20% RH.
3. Devices require baking, before mounting, if:
a) Desiccant changes to PINK.
b) If 2a or 2b are not met.
4. If baking is required, devices may be baked outside of tube for 20 hours at 75°C.
Bag Seal Date: ______________________________________________________
(If blank, see barcode label)
Note: LEVEL defined by EIA JEDEC Standard J-STD-020
Mechanical Dimensions
Horizontal Modules
Vertical Modules
2.03
(0.080)
6.86
(0.270)
10.16
(0.400)
18.8
(0.74)
5.08
(0.200)
4.19
(0.165)
2.03
(0.080)
5.08
10.16 (0.200)
(0.400)
18.29
(0.720)
0.64
(0.025)
6.86
(0.27)
7.62
(0.30)
7.62
(0.300)
3.81
(0.150) MAX.
3.56
(0.140) MIN.
0.51
(0.020)
1.27
(0.050)
2.54
(0.100)
18.80
(0.740)
0.64 (0.025) DIA.
2.77
(0.109)
1.85
(0.073)
3
Versatile Link Printed Board Layout Dimensions
Horizontal Module
7.62
(0.300)
1.01
(0.040) DIA.
4
3
2
1
Vertical Module
2.54
(0.100)
TOP
VIEW
7.62
(0.300)
PCB EDGE
1.85
MIN.
(0.073)
5
8
DIMENSIONS
IN
MILLIMETERS (INCHES).
Interlocked (Stacked) Assemblies
(refer to Figure 1)
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the inter-
locking mechanism by sliding the L bracket body from
above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked
units into uniform alignment. This technique prevents
potential harm that could occur to fingers and hands of
assemblers from the package pins. Stacked horizontal
packages can be disengaged if necessary. Repeated
stacking and unstacking causes no damage to individual
units.
To stack vertical packages, hold one unit in each hand,
with the pins facing away and the optical ports on the
bottom. Slide the L bracket unit into the L slot unit. The
straight edge used for horizontal package alignment is
not needed.
Stacking Horizontal Modules
Stacking Vertical Modules
Figure 1. Interlocked (stacked) horizontal or vertical packages
4
5 MBd Link (HFBR-15X1Z/25X1Z)
System Performance 0 to 70°C unless otherwise specified.
Parameter
High
Performance
5 MBd
Data Rate
Link Distance
(Standard Cable)
Link Distance
(Improved Cable)
Propagation
Delay
Pulse Width
Distortion t
PLH
-t
PHL
Notes:
1. The propagation delay for one metre of cable is typically 5 ns.
2. Typical propagation delay is measured at P
R
= -15 dBm.
3. Estimated typical link life expectancy at 40°C exceeds 10 years at 60 mA.
Symbol
Min.
dc
19
27
22
27
Typ.
Max.
5
Units
MBd
m
m
m
m
Conditions
BER ≤10
-9
, PRBS:2
7
-1
I
Fdc
= 60 mA
I
Fdc
= 60 mA, 25°C
I
Fdc
= 60 mA
I
Fdc
= 60 mA, 25°C
R
L
= 560 Ω, C
L
= 30 pF
fiber length = 0.5 m
-21.6 ≤P
R
≤-9.5 dBm
P
R
= -15 dBm
R
L
= 560 Ω, C
L
= 30 pF
Ref.
Fig. 3
Note 3
Fig. 4
Note 3
Fig. 5, 8
Notes 1, 2
Fig. 5, 7
48
53
80
50
30
140
140
t
PLH
t
PHL
t
D
ns
ns
ns
Figure 2. Typical 5 MBd interface circuit
100
100
IF – FORWARD CURRENT (mA)
50
40
30
20
OVERDRIVE
UNDERDRIVE
IF – FORWARD CURRENT (mA)
50
40
30
20
OVERDRIVE
UNDERDRIVE
10
0°C–70°C
25°C
0
10
20
30
40
50
10
0°C–70°C
25°C
0
10
20
30
40
50
60
5
5
– CABLE LENGTH – METRES
– CABLE LENGTH – METRES
Figure
3.
Guaranteed system performance with
standard cable (HFBR-15X1Z/25X1Z)
Figure 4. Guaranteed system performance with
improved cable (HFBR-15X1Z/25X1Z)
5
stm32/stm8
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