D Latch, 1-Func, 8-Bit, CMOS, CDIP16,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D LATCH |
| 最大I（ol） | 0.004 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 55 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| GD54HCT259J | GD74HCT259J | GD74HC259J | GD74HC259D | GD74HC259 | GD54HC259J | GD74HCT259 | GD74HCT259D | |
|---|---|---|---|---|---|---|---|---|
| 描述 | D Latch, 1-Func, 8-Bit, CMOS, CDIP16, | D Latch, 1-Func, 8-Bit, CMOS, CDIP16, | D Latch, 1-Func, 8-Bit, CMOS, CDIP16, | D Latch, 1-Func, 8-Bit, CMOS, PDSO16, | D Latch, 1-Func, 8-Bit, CMOS, PDIP16, | D Latch, 1-Func, 8-Bit, CMOS, CDIP16, | D Latch, 1-Func, 8-Bit, CMOS, PDIP16, | D Latch, 1-Func, 8-Bit, CMOS, PDSO16, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | SOP | DIP | DIP | DIP | SOP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 电源 | 5 V | 5 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 55 ns | 46 ns | 42 ns | 42 ns | 42 ns | 50 ns | 46 ns | 46 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | YES | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | - | - | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd |
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