Hex buffer/line driver 3-State
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | SOP, SOP16,.25 |
| Reach Compliance Code | unknow |
| 控制类型 | ENABLE LOW |
| JESD-30 代码 | R-PDSO-G16 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.008 A |
| 湿度敏感等级 | 1 |
| 位数 | 6 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Su | 26 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 74LV365D | 74LV365 | 74LV365DB | 74LV365N | 74LV365PW | 74LV365PWDH | |
|---|---|---|---|---|---|---|
| 描述 | Hex buffer/line driver 3-State | Hex buffer/line driver 3-State | Hex buffer/line driver 3-State | Hex buffer/line driver 3-State | Hex buffer/line driver 3-State | Hex buffer/line driver 3-State |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | - |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - |
| 包装说明 | SOP, SOP16,.25 | - | SSOP, SSOP16,.3 | DIP, DIP16,.3 | TSSOP, TSSOP16,.25 | - |
| Reach Compliance Code | unknow | - | unknow | unknow | unknow | - |
| 控制类型 | ENABLE LOW | - | ENABLE LOW | ENABLE LOW | ENABLE LOW | - |
| JESD-30 代码 | R-PDSO-G16 | - | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | - |
| 负载电容（CL） | 50 pF | - | 50 pF | 50 pF | 50 pF | - |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
| 最大I（ol） | 0.008 A | - | 0.008 A | 0.008 A | 0.008 A | - |
| 位数 | 6 | - | 6 | 6 | 6 | - |
| 功能数量 | 1 | - | 1 | 1 | 1 | - |
| 端子数量 | 16 | - | 16 | 16 | 16 | - |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | TRUE | - | TRUE | TRUE | TRUE | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | SOP | - | SSOP | DIP | TSSOP | - |
| 封装等效代码 | SOP16,.25 | - | SSOP16,.3 | DIP16,.3 | TSSOP16,.25 | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | - | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
| 电源 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | - |
| Prop。Delay @ Nom-Su | 26 ns | - | 26 ns | 26 ns | 26 ns | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
| 标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | - |
| 表面贴装 | YES | - | YES | NO | YES | - |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | - |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - |
| 端子形式 | GULL WING | - | GULL WING | THROUGH-HOLE | GULL WING | - |
| 端子节距 | 1.27 mm | - | 0.635 mm | 2.54 mm | 0.635 mm | - |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | - |
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