3-to-8 line decoder/demultiplexer; inverting
74HCT138 | HCT138 | 74HC138D | 74HCT138N | 74HCT138D | 74HC138PW | 74HC138DB | 74HCT138DB | 74HCT138PW | 74HC138 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | 3-to-8 line decoder/demultiplexer; inverting | 3-to-8 line decoder/demultiplexer; inverting | HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO16 | HCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDIP16 | 3-to-8 line decoder/demultiplexer; inverting | HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO16 | 3-to-8 line decoder/demultiplexer; inverting | 3-to-8 line decoder/demultiplexer; inverting | 3-to-8 line decoder/demultiplexer; inverting | 3-to-8 line decoder/demultiplexer; inverting |
是否Rohs认证 | - | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
厂商名称 | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - |
包装说明 | - | - | SOP, SOP16,.25 | DIP, DIP16,.3 | SOP, SOP16,.25 | TSSOP, TSSOP16,.25 | SSOP, SSOP16,.3 | SOP, SOP16,.3 | TSSOP, TSSOP16,.25 | - |
Reach Compliance Code | - | - | unknow | unknow | unknown | unknow | unknow | unknow | unknow | - |
JESD-30 代码 | - | - | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | - |
负载电容(CL) | - | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - |
逻辑集成电路类型 | - | - | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | - |
最大I(ol) | - | - | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | - |
功能数量 | - | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
端子数量 | - | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 | - |
最高工作温度 | - | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
最低工作温度 | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | - | - | SOP | DIP | SOP | TSSOP | SSOP | SOP | TSSOP | - |
封装等效代码 | - | - | SOP16,.25 | DIP16,.3 | SOP16,.25 | TSSOP16,.25 | SSOP16,.3 | SOP16,.3 | TSSOP16,.25 | - |
封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | - | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
电源 | - | - | 2/6 V | 5 V | 5 V | 2/6 V | 2/6 V | 5 V | 5 V | - |
Prop。Delay @ Nom-Su | - | - | 45 ns | 44 ns | - | 45 ns | 45 ns | 44 ns | 44 ns | - |
认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
表面贴装 | - | - | YES | NO | YES | YES | YES | YES | YES | - |
技术 | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
温度等级 | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
端子形式 | - | - | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
端子节距 | - | - | 1.27 mm | 2.54 mm | 1.27 mm | 0.635 mm | 0.635 mm | 1.27 mm | 0.635 mm | - |
端子位置 | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - |
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