■
APPLI
I
CATI
I
ON
■
APPL CAT ON
PDA, notebook, desktop, and server applications
Low profile, high current power supplies
Battery powered devices
DC/DC converters in distributed power systems
DC/DC converters for field programmable gate array
■
FEATURES
■
FEATURES
Super low resistance, ultra high current rating
Low profile for machine placement
High performance (I sat) realized by metal dust core
■
PRODUCT I
I
DENTI
I
FI
I
CATI
I
ON
■
PRODUCT DENT F CAT ON
①
②
③ ④ ⑤
MMD - 12FD - R47 M - V1
①
Product Code
②
Dimensions : 13.7
X
12.9
X
6.4 mm
③
Inductance : R47 = 0.47μH
④
Tolerance : M =
±
20%
⑤
Series Type : V1 Type
NOTE：Please refer to the “Product Dimension” for detail dimensions.
■
PRODUCT DI
I
MENSI
I
ON
■
PRODUCT D MENS ON
A
E
B
D
C
MAG.LAYERS
MMD-12FD-SERIES-V1-B6
NOTE：Dimensions in mm
PRODUCT NO.
MMD-12FD-SERIES-V1
A
13.2
±
0.5
B
12.9 Max
C
6.4 Max
D
3.2
±
0.5
E
2.3
±
0.3
■
ELECTRI
I
CAL REQUI
I
REMENTS
ELECTR CAL REQU REMENTS
INDUCTANCE
PART NUMBER
Lo(µH)±20%
@0A
R
dc
(
mΩ
)
Typ.
0.63
0.83
1.0
1.2
1.4
1.6
1.7
2.5
2.8
3.5
5.7
9.3
Max
0.7
0.9
1.2
1.4
1.6
1.9
2.0
3.0
3.2
4.2
6.8
11.2
HEAT RATING
CURRENT(Idc)
DC AMPS
1
SATURATION
CURRENT(Isat)
DC AMPS
2
MMD-12FD-R22M-V1
MMD-12FD-R33M-V1
MMD-12FD-R47M-V1
MMD-12FD-R56M-V1
MMD-12FD-R68M-V1
MMD-12FD-R82M-V1
MMD-12FD-1R0M-V1
MMD-12FD-1R5M-V1
MMD-12FD-1R8M-V1
MMD-12FD-2R2M-V1
MMD-12FD-3R3M-V1
MMD-12FD-4R7M-V1
0.22
0.33
0.47
0.56
0.68
0.82
1.0
1.5
1.8
2.2
3.3
4.7
53
46
41
37
35
33
32
27
24
22
18
13.5
112
65
63
62
60
50
49
45
41
40
35
30
TEST FREQUENCY:100KHz,0.25V
TESTING INSTRUMENT
L :Agilent4284A,WK4235,CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE
R
dc
:CH11025,GOM802 MICRO OHMMETER
NOTES:
1.DC current (I
dc
) that will cause an approximate
△T
of 40℃
2.DC current (I
sat
) that will cause Lo to drop approximately 20%
3.All test data is referenced to 25℃ ambient
4.Operating Temperature Range -55℃ to +125℃
5.The part temperature (ambient + temp rise) should not exceed 125℃
under worst case operating conditions. Circuit design, component placement,
PWB trace size and thickness, airflow and other cooling provisions all affect
the part temperature. Part temperature should be verified in the end application.
MAG.LAYERS
MMD-12FD-SERIES-V1-B6
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
