■
APPLI
I
CATI
I
ON
■
APPL CAT ON
PDA, notebook, desktop, and server applications
Low profile, high current power supplies
Battery powered devices
DC/DC converters in distributed power systems
DC/DC converters for field programmable gate array
■
FEATURES
■
FEATURES
Super low resistance, ultra high current rating
Low profile for machine placement
High performance (I sat) realized by metal dust core
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PRODUCT I
I
DENTI
I
FI
I
CATI
I
ON
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PRODUCT DENT F CAT ON
①
②
③ ④ ⑤
MMD - 12EZ - 1R0 M - V1
①
Product Code
②
Dimensions : 13.7
X
12.9
X
5.0 mm
③
Inductance : 1R0 = 1.0μH
④
Tolerance : M =
±
20%
⑤
Series Type : V1 Type
NOTE：Please refer to the “Product Dimension” for detail dimensions.
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PRODUCT DI
I
MENSI
I
ON
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PRODUCT D MENS ON
MAG.LAYERS
MMD-12EZ-SERIES-V1
NOTE：Dimensions in mm
PRODUCT NO.
MMD-12EZ-SERIES-V1
A
13.7 Max
B
12.9 Max
C
5.0 Max
D
3.5
±
0.5
E
2.3
±
0.3
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ELECTRI
I
CAL REQUI
I
REMENTS
ELECTR CAL REQU REMENTS
PART NUMBER
INDUCTANCE
Lo(μH)±20%
@0A
0.10
0.22
0.33
0.47
0.56
0.68
0.82
1.0
1.5
1.8
2.2
3.3
4.7
5.6
6.8
7.8
8.2
10
R
dc
(mΩ)
Max
0.60
0.80
1.1
1.3
1.5
1.7
2.3
2.5
4.1
4.9
5.5
9.2
15.0
16.5
18.5
20.5
22.5
25.5
HEAT RATING
CURRENT(I
dc
)
DC AMPS
1
55
51
42
38
36
34
31
29
23
19
20
15
12
11.5
11
10
9.5
9.0
SATURATION
CURRENT(I
sat
)
DC AMPS
2
118
110
80
65
55
54
53
50
48
40
32
32
27
22
21
18
18
16
MMD-12EZ-R10M-V1
MMD-12EZ-R22M-V1
MMD-12EZ-R33M-V1
MMD-12EZ-R47M-V1
MMD-12EZ-R56M-V1
MMD-12EZ-R68M-V1
MMD-12EZ-R82M-V1
MMD-12EZ-1R0M-V1
MMD-12EZ-1R5M-V1
MMD-12EZ-1R8M-V1
MMD-12EZ-2R2M-V1
MMD-12EZ-3R3M-V1
MMD-12EZ-4R7M-V1
MMD-12EZ-5R6M-V1
MMD-12EZ-6R8M-V1
MMD-12EZ-7R8M-V1
MMD-12EZ-8R2M-V1
MMD-12EZ-100M-V1
TEST FREQUENCY:100KHz,0.25V
TESTING INSTRUMENT L :Agilent4284A,WK4235,CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE
R
dc
:CH11025,GOM802 MICRO OHMMETER
NOTES:
1.DC current (I
dc
) that will cause an approximate
△T
of 40℃
2.DC current (I
sat
) that will cause Lo to drop approximately 20%
3.All test data is referenced to 25℃ ambient
4.Operating Temperature Range -55℃ to +125℃
5.The part temperature (ambient + temp rise) should not exceed 125℃
under worst case operating conditions. Circuit design, component placement,
PWB trace size and thickness, airflow and other cooling provisions all affect
the part temperature. Part temperature should be verified in the end application.
MAG.LAYERS
MMD-12EZ-SERIES-V1
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