AME
AME5130
n
General Description
The AME5130 is a fixed off-time step-up DC/DC con-
verter in a small 5-lead SOT-25 package.The AME5130
is ideal for LCD panels requiring low current and high effi-
ciency as well as LED applications for cellular phone back-
lighting, PDAS,and other hand-held devices. The low
400ns off-time allows the use of tiny external compo-
nents.
AME5130 can drive up 8 white LEDs from a single Li-
Ion battery DC 2V to 5.5V; can be turned on by putting
more than 1V at pin 4(EN). To control LED brightness,
the LED current can be pulsed by applying a PWM (pulse
width modulated) signal with a frequency range of 100Hz
to 50KHz to the EN pin.
Micropower Step-Up
DC/DC Converter
n
Typical Application
V
IN
2.5V-4.2V
5
V
IN
L
10µH
1
SW
I
LED
C
OUT
4.7µF
Ceramic
AME5130
D
Option for
6LEDs
C
IN
4.7µF
Ceramic
>1.1V 4
EN
0V
GND
2
FB
3
R2
80Ω
* I
LED
=V
FB
/R2
n
Features
l
0.7Ω internal switch
l
Uses small surface mount components
l
Adjustable output voltage up to 20V
l
2V to 5.5V input range
l
Input undervoltage lockout
l
0.01µA shutdown current
l
Small 5-Lead SOT-25 package
l
All AME’ s Lead Free Product Meet RoHS
Standard
Figure 1
：
Six White LEDs Application in Li-lon
Battery
V
IN
2.5V-4.2V
L
15µH
D
20V
20mA
5
C
IN
4.7µF
Ceramic
4
V
IN
1
SW
R1
200K
AME5130
FB
3
EN
GND
2
R2
13K
C
OUT
4.7µF
Ceramic
n
Applications
l
l
l
l
l
White LED Back-Lighting
Hand-held Devices
Digital Cameras
Portable Applications
LCD Bias Power
Figure 2
：
Typical 20V Application
Rev.F.02
1
AME
AME5130
n
Function Block Diagram
L
V
IN
C
IN
V
IN
SW
D
Micropower Step-Up
DC/DC Converter
V
OUT
C
OUT
V
OUT
Vref=1.23
Enable
Comp
R1
FB
+
-
+
CL
Comp
-
400ns one
Shot
Current sensing
R2
CL Adjust
Driver
Under Voltage
Lockout
Logic
control
RUN
GND
Figure 3
：
AME5130 Block Diagram
2
Rev.F.02
AME
AME5130
n
Pin Configuration
SOT-25
Top View
5
4
Micropower Step-Up
DC/DC Converter
AME5130
1. SW
2. GND
AME5130
3. FB
4. EN
5. V
IN
* Die Attach:
Conductive Epoxy
1
2
3
n
Pin Description
Pin Number
1
Pin Name
SW
Pin Description
Power Switch input.
This is the drain of the internal NMOS power switch. Minimize the metal
trace area connected to this pin to minimize EMI.
Ground.
Tie directly to ground plane.
Output voltage feedback input.
Set the output voltage by selecting values for R1 and R2 using:
2
GND
3
FB
V
R
1
=
R
2
out
−
1
1 . 23
V
Connect the ground of the feedback network to an AGND(Analog Ground)
plane which should be tied directly to the GND pin.
4
EN
Shutdown control input, active low.
The shutdown pin is an active low control. Tie this pin above 1V to enable
the device. Tie this pin below 0.4V to turn off the device.
Analog and Power input.
Input Supply Pin. Bypass this pin with a capacitor as close to the device
as possible.
5
V
IN
Rev.F.02
3
AME
AME5130
n
Ordering Information
AME5130 x x x x xxx x
Special Feature
Output Voltage
Number of Pins
Package Type
Operating Ambient Temperature Range
Pin Configuration
Number
of
Pins
V: 5
Micropower Step-Up
DC/DC Converter
Pin
Configuration
A
(TSOT-25)
Operating Ambient
Package Type
Temperature Range
E: -40
O
C to +85
O
C
E: SOT-2X
Output Voltage
Special Feature
1. SW
2. GND
3. FB
4. EN
5. V
IN
ADJ: Adjustable
Z:
Lead free
n
Ordering Information
Part Number
AME5130AEEVADJZ
Marking*
BCLww
Output Voltage
ADJ
Package
SOT-25
Operating Ambient
Temperature Range
-40
O
C to +85
O
C
Note: ww represents the date code and pls refer to Date Code Rule before Package Dimension.
* A line on top of the first letter represents lead free plating such as BCLww.
Please consult AME sales office or authorized Rep./Distributor for the availability of package type.
4
Rev.F.02
AME
AME5130
n
Absolute Maximum Ratings
Parameter
Input Supply Voltage
RUN, V
FB
Voltages
SW Voltage
N-Channel Switch Sink Current
ESD Classification
Micropower Step-Up
DC/DC Converter
Symbol
V
IN
V
RUN
,V
FB
V
SW
I
SW
Maximum
6
V
IN
V
OUT
+0.3
800
B*
Unit
V
V
V
mA
Caution: Stress above the listed absolute maximum rating may cause permanent damage to the device
* HBM B: 2000V~3999V and SW pin pass 1500V only
n
Recommended Operating Conditions
Parameter
Ambient Temperature Range
Junction Temperature Range
Storage Temperature Range
Symbol
T
A
T
J
T
STG
Rating
-40 to +85
-40 to +125
-65 to +150
Unit
o
C
C
C
o
o
n
Thermal Information
Parameter
Thermal Resistance*
(Junction to Case)
Thermal Resistance
(Junction to Ambient)
Internal Power Dissipation
Maximum Junction Temperature
Solder Iron (10Sec)**
* Measure
θ
JC
on backside center of molding compund if IC has no tab.
** MIL-STD-202G 210F
Rev.F.02
5
Package
Die Attach
Symbol
θ
J
C
Maximum
81
Unit
o
C/W
SOT-25
Conductive Epoxy
θ
JA
P
D
260
400
150
350
mW
o
C
C
o
PCB设计
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