Standard SRAM, 16KX4, 35ns, CMOS, CQCC28,
参数名称 | 属性值 |
厂商名称 | TEMIC |
Reach Compliance Code | unknown |
最长访问时间 | 35 ns |
JESD-30 代码 | R-CQCC-N28 |
内存密度 | 65536 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 4 |
功能数量 | 1 |
端子数量 | 28 |
字数 | 16384 words |
字数代码 | 16000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 16KX4 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子位置 | QUAD |
Base Number Matches | 1 |
5962-8971202ZX | 5962-8971204ZX | 5962-8971201XX | 5962-8971203ZX | 5962-8971201ZX | |
---|---|---|---|---|---|
描述 | Standard SRAM, 16KX4, 35ns, CMOS, CQCC28, | Standard SRAM, 16KX4, 20ns, CMOS, CQCC28, | Standard SRAM, 16KX4, 45ns, CMOS, CDIP28, | Standard SRAM, 16KX4, 25ns, CMOS, CQCC28, | Standard SRAM, 16KX4, 45ns, CMOS, CQCC28, |
厂商名称 | TEMIC | TEMIC | TEMIC | TEMIC | TEMIC |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 35 ns | 20 ns | 45 ns | 25 ns | 45 ns |
JESD-30 代码 | R-CQCC-N28 | R-CQCC-N28 | R-GDIP-T28 | R-CQCC-N28 | R-CQCC-N28 |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 |
字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD |
端子位置 | QUAD | QUAD | DUAL | QUAD | QUAD |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved