AFBR-16xxZ and AFBR-26x4Z/25x9Z
DC-50MBd Versatile Link Fiber Optic Transmitter
and Receiver for 1 mm POF and 200
m
PCS
Data Sheet
Description
The AFBR-16xxZ transmitter utilizes a 650 nm LED source
with integrated optics and driver IC for efficient coupling
into 1 mm Polymer Optical Fiber (POF). The AFBR-
26x4Z/25x9Z receiver consists of an IC with an integrated
photodiode to produce a logic compatible output. The
transmitter input and receiver output are compatible with
TTL logic families. The pair operates any type of signal
from DC up to 50 MBd at distances up to 50 m with 1 mm
POF, up to 200 m at 10 MBd and 120 m at 50 MBd with 200
m
Plastic-Clad Silica (PCS), respectively.
The transmitter is a 3-pin and the receiver is a 4-pin device,
packed in Versatile Link housing. Versatile Link compo-
nents can be interlocked (N-plexed together) to minimize
space and to provide dual connections with the duplex
connectors. Various simplex and duplex connectors, as
well as POF cables are available for Versatile Link compo-
nents. For details, contact Avago Technologies or visit our
company website at www.avagotech.com
AFBR-xxx4Z are delivering non-inverted output signals
while AFBR-xxx9Z deliver inverted output signals.
Features
RoHS-compliant
Data transmission at signal rates from DC up to 50 MBd
Transmitter: integrated 650 nm LED and driver IC with
TTL input logic
Receiver: integrated PIN diode and digitalizing IC with
TTL output logic
Up to 50 m distance with 1 mm Polymer Optical Fiber
(POF) over operating temperature range
Up to 200 m (10 MBd) distance and 120 m (50 MBd)
distance with 200
m
Plastic-Clad Silica (PCS) over
operating temperature range
Operating temperature range of -40
C
to +85
C
Compatible with Avago’s Versatile Link family of
connectors, for easy termination of fiber
Applications
Optical Transmitter and Receiver for 50 MBd systems and
below:
Industrial control and factory automation
Extension of RS-232 and RS-485
High voltage isolation
Elimination of ground loops
Reduces voltage transient susceptibility
AFBR-xxxxZ - Part number selection guide
AFBR –
x x x x Z
1
= Transmitter (TX)
2
= Receiver (RX)
5/6
= 650 nm products
2
= Horizontal Package
3
= Vertical Package
4
= Tilted (30°) Package
4
= 50 MBd Non-Inverted
9
= 50 MBd Inverted
Z
= Extended Temperature Range,
RoHS Compliant
Available options
Horizontal Package
Vertical Package
Tilted (30°) package
AFBR-x624Z
AFBR-x634Z
AFBR-x644Z
AFBR-1629Z
AFBR-1639Z
AFBR-2529Z
AFBR-2539Z
Application Literature
Application Note 1035 (Versatile Link) - AV02-0730EN
Handling
Versatile Link components are auto-insertable. When
wave soldering is performed with Versatile Link compo-
nents, the optical port plug should be left in to prevent
contamination of the port. Do not use reflow solder
processes (i.e., infrared reflow or vapor-phase reflow).
Nonhalogenated water soluble fluxes (i.e., 0% chloride),
not rosin based fluxes, are recommended for use with
Versatile Link components.
Versatile Link components are moisture sensitive
devices and are shipped in a moisture sealed bag. If the
components are exposed to air for an extended period of
time, they may require a baking step before the soldering
process. Refer to the special labeling on the shipping tube
for details.
Package and Handling Information
The compact Versatile Link package is made of a flame-
retardant material and uses the same pad layout as a
standard, eight-pin dual-in-line package. Horizontal,
Vertical, and Tilted (30°) packages are available. These
low profile Versatile Link packages are stackable and are
enclosed to provide a dust-resistant seal. Snap action
simplex, simplex latching, duplex, and duplex latching
connectors are offered with simplex or duplex cables.
Package Orientation
Performance and pinouts for the horizontal, vertical, and
tilted (30°) packages are identical. To provide additional
attachment support for the vertical Versatile Link
housing, the designer has the option of using a self-
tapping screw through a printed circuit board into a
mounting hole at the bottom of the package. For most
applications this is not necessary.
Recommended Chemicals for Cleaning/Degreasing
Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane,
heptane. Other: soap solution, naphtha.
Do not use partially halogenated hydrocarbons such
as 1,1.1 trichloroethane, ketones such as MEK, acetone,
chloroform, ethyl acetate, methylene dichloride, phenol,
methylene chloride, or N-methylpyrolldone. Also, Avago
does not recommend the use of cleaners that use
halogenated hydrocarbons because of their potential en-
vironmental harm.
Package Housing Color
Versatile Link components and simplex connectors are
color coded to eliminate confusion when making con-
nections. Receiver packages are black and transmitter
packages are gray in color respectively.
2
Mechanical Dimensions
Horizontal Module
2
[0.08]
Vertical Module
1
[0.04]
3.6
[0.14]
10.2
[0.40]
6.5
[0.26]
18.8
[0.74]
5.1
[0.20]
10.2
[0.40]
5.1
[0.20]
18.1
[0.71]
6.5
[0.26]
2
[0.08]
7.6
[0.30]
0.6
[0.03]
7.6
[0.30]
4.2
[0.17]
1.7
[0.07]
18.9
[0.75]
3.8
[
0.15
]
MAX.
7.7
[0.30]
3.6
[
0.14
]
MIN.
1.3
[0.05]
0.5
[0.02]
2.54
[0.100]
0.6
[0.02]
[
0 .6 ]
3
0.0
3.3
[
0.13
]
MAX
2.8
[
0.11
]
MIN
1.3
[0.05]
0.5
[0.02]
2.54
[0.100]
7.62
[0.300]
NOTES:
1) Dimensions: mm [in]
1.7
[0.07]
2.8
[0.11]
[
0.6 3]
0
0.
NOTES:
1) Dimensions: mm [in]
2) Optional mounting hole for #2 self-tapping-screw
(metric equivalent M2.2 x 0.45)
3.8
[0.15]
2)
Tilted (30°) Module
2
[0.08]
A
10.2
[0.40]
30°
0.4
[0.02]
.7
18 4]
7
[0.
6.6
[0.26]
0.6
[0.03]
4.6
[0.18]
4.6
[0.18]
15.2
[0.60]
6.5
[0.26]
A
2.54
[0.100]
0.5
[0.02]
1.3
[0.05]
0.7
[0.03]
7.62
[0.300]
1.1
[0.05]
8.7
[0.34]
10.1
[0.40]
2.2
[0.09]
NOTES:
1) Dimensions: mm [in]
19.3
[0.76]
3
3.8
[0.15]
Versatile Link Printed Board Layout Dimensions
Horizontal Module
7.62
[0.300]
2.54
[0.100]
1
[
0.0
4]
Vertical Module
7.62
[0.300]
2.54
[0.100]
4
3
2
1
[
7.7
[0.30]
0.0
1
4]
3.8
[0.15]
PCB EDGE
2.25 [0.09] clearance hole
for optional vertical mount
self-tapping-screw #2
4
3
2
1
5
8
1.9 MIN.
[0.07]
3.8
[0.15]
NOTES:
1) Dimensions: mm [in]
5
8
7.62
[0.300]
PCB EDGE
1.7
[0.07] MIN.
NOTES:
1) Dimensions: mm [in]
Footprint - TOP VIEW
Footprint - TOP VIEW
Tilted (30°) Module
7.62
[0.300]
2.54
[0.100]
1
[ 0
.04]
2
1
4
3
5
8
8.7
[0.34]
PCB EDGE
2.2 MIN.
[0.09]
NOTES:
1) Dimensions: mm [in]
Footprint - TOP VIEW
4
Interlocked (Stacked) Assemblies
(refer to Figure 1)
Horizontal packages may be stacked by placing units with pins facing upward. Initially engage the inter-
locking mechanism by sliding the L bracket body from above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked units into uniform alignment. This technique prevents
potential harm that could occur to fingers and hands of assemblers from the package pins. Stacked horizontal
packages can be disengaged if necessary. Repeated stacking and unstacking causes no damage to individual units.
To stack vertical packages, hold one unit in each hand, with the pins facing away and the optical ports on the bottom.
Slide the L bracket unit into the L slot unit. The straight edge used for horizontal package alignment is not needed.
Stacking Horizontal Modules
Stacking Vertical Modules
Tilted (30°) Module
Figure 1. Interlocked (stacked) Horizontal, Vertical and Tilted (30°) packages
5
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