SCOPE:
This specification applies to the Pb Free Signal Common mode filters
for MCI-453230SH1-SERIES-□
PRODUCT INDENTIFICATION
MCI- 453230 SH1 - 101 Y - E
①
②
③
④
⑤ ⑥
①
Product Code
②
Dimensions Code
③
Signal For AECQ-200
④
Inductance Code
⑤
Tolerance
Code
⑥
Inner Control Code
(1) SHAPES AND DIMENSIONS
A : 4.5 ± 0.2
B : 3.2 ± 0.2
C : 2.8 ± 0.2
mm
mm
mm
E : 0.75 Typ. mm
F : 0.75 Typ. mm
SCHEMATIC
Equivalent circuit
①
②
④
③
No Polarity
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS
L/Z : HP 4291B IMPEDANCE ANALYZER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
I.R : CHROMA MODEL 19073 AC/DC/IR HIPOT TESTER (or equivalent)
(3) CHARACTERISTICS
(3)-1 Operate temperature range …...
-40℃½+125℃
(Including self temp. rise)
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MCI-453230SH1-SERIES-□
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TABLE 1
MAGLAYERS
PT/NO.
MCI-453230SH1-110Y-E
MCI-453230SH1-220Y-E
MCI-453230SH1-510Y-E
MCI-453230SH1-101Y-E
Inductance
@100kHz/0.25V
L(μH)
11 +50%/-30%
22 +50%/-30%
51 +50%/-30%
100 +50%/-30%
Impedance Z(Ω)
@10MHz/0.5V
Min.
300
500
1000
2000
Typ.
600
1200
2800
5800
RDC (Ω)
Max.
0.60
1.00
1.00
2.00
Idc
Max.(A)
0.25
0.20
0.20
0.15
Rated
voltage
(V)max.
80V
80V
80V
80V
Insulation
Resistance
(MΩ)Min.
10
10
10
10
※
IDC: Based on temperature rise (△T: 30℃ Typ.)
TEST EQUIPMENT
1. Impedance / Inductance
Measured by using HP 4291B RF Impedance Analyzer.
2. DC Resistance
Measured by using Chroma 16502 mill ohm meter
3. Insulation Resistance
Measured by using Chroma 19073
Measurement voltage: 80v, Measurement time: 60 sec.
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MCI-453230SH1-SERIES-□
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(4) RELIABILITY TEST METHOD
Item
Solder ability
Specifications
It can be connected on the
Recommendation soldering condition.
Test conditions
Apply cream solder to the test circuit board .
It is mounted on the recommendation soldering condition.
Dip pads in flux and dip in solder pot ( 96.5 Sn/3.5 Ag
solder) at 260°C ±5°C.
Terminal
strength
The terminal electrode and the ferrite
must not be damaged.
Solder a chip to test substrate , and then laterally
apply a load 0.5Kg in the arrow direction.
The terminal electrode and the ferrite
must not be damaged.
Soldering a chip to a test substrate ,
bend the substrate by 2mm and then return.
Strength on
pc board
bending
Test board : Glass base epoxy multiplayer board pc board pattern.
PC board pattern : Recommended PC board pattern.
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Item
Specifications
Test conditions
High
temperature
1000hrs.at rated operating temperature (e.g. 125°C
part can be stored for 1000hrs.@ 125°C.Same
applies for 105°C and 85°C. Unpowered.
Measurement at 24±4 hours after test conclusion.
Appearance : Ferrite shall not be
Biased Humidity damaged.
Impedance:Within±20% of the
initial value.
insulation resistance: >10(MΩ)
DC resistance : standard value
inside.
Temperature
Cycling
1000hours 85°C/85%RH. Unpowered.
Measurement at 24±4hours after test conclusion.
1000 cycles (-40°C to +125°C) Measurement at 24±
4 hours after test conclusion.
30min maximum dwell time at each temperature
extreme. 1 min. maximum transition time.
Operational Life
1000hrs. @125°C. If 85°C or 105°C part will be
Tested at that temperature. Measurement at 24±4
hours after test conclusion
peak acceleration
:100
g's
Duration of pulse:6 ms
Waveform
:Half-sine
Velocity change
:12.3
ft/sec
Direction:X,Y,Z( 3axes/3 times)
Note: It is applicable to marked and/or coated
components.
Add Aqueous wash chemical OKEMCLEAN (A 6%
concentrated Oakite cleaner) or equivalent. Do not
use banned solvents.
Mechanical
Shock
Impedance:Within±20% of the
initial value.
Resistance to
Solvents
No apparent damage
Vibration
Appearance : Ferrite shall not be
damaged.
5g's for 20 minutes, 12 cycles each of 3
orientations. Test from 10-2000 Hz.
Resistance to
Soldering Heat
The chip shall not crack.
More than 75% of the terminal
electrode shall
be covered with solder.
Solder temperature : 260 ±5℃
Dip time: 10 ±1 seconds
The chip shall not crack.
More than 75% of the terminal electrode shall
be covered with solder.
Burning stops within 10 seconds on a vertical
specimen;
Drips of particles allowed as long as they are not
inflamed.
Flammability
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(5) RECOMMENDED SOLDERING CONDITIONS
(Please use this product by reflow soldering)
(5)-1 RECOMMENDED FOOTPRINT
Unit: mm
(5)-2 RECOMMENED REFLOW PATTERN
Temperature(℃)
300
260
200
150
100
50
Time
1 to 4 min.
10 sec
more than 2 min.
Preheating
Solding
260℃
Natural Cooling
(5)-3 IRON SOLDERING
Use a solder iron of less than 30W when soldering ,do not allow the soldering
iron tip directly touch the Ceramic body outside of terminal electrode.
3 seconds max. at 260℃.
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