1G bits DDR2 SDRAM
EDE1108AFBG | EDE1108AFBG-8E-F | EDE1108AFBG-8G-F | EDE1108AFBG-6E-F | |
---|---|---|---|---|
描述 | 1G bits DDR2 SDRAM | 1G bits DDR2 SDRAM | 1G bits DDR2 SDRAM | 1G bits DDR2 SDRAM |
厂商名称 | - | ELPIDA | ELPIDA | ELPIDA |
零件包装代码 | - | BGA | BGA | BGA |
包装说明 | - | TFBGA, | TFBGA, | TFBGA, |
针数 | - | 60 | 60 | 60 |
Reach Compliance Code | - | unknow | unknow | unknow |
ECCN代码 | - | EAR99 | EAR99 | EAR99 |
访问模式 | - | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST |
最长访问时间 | - | 0.4 ns | 0.4 ns | 0.45 ns |
其他特性 | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | - | R-PBGA-B60 | R-PBGA-B60 | R-PBGA-B60 |
长度 | - | 10.5 mm | 10.5 mm | 10.5 mm |
内存密度 | - | 1073741824 bi | 1073741824 bi | 1073741824 bi |
内存集成电路类型 | - | DDR DRAM | DDR DRAM | DDR DRAM |
内存宽度 | - | 8 | 8 | 8 |
功能数量 | - | 1 | 1 | 1 |
端口数量 | - | 1 | 1 | 1 |
端子数量 | - | 60 | 60 | 60 |
字数 | - | 134217728 words | 134217728 words | 134217728 words |
字数代码 | - | 128000000 | 128000000 | 128000000 |
工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | - | 95 °C | 95 °C | 95 °C |
组织 | - | 128MX8 | 128MX8 | 128MX8 |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | TFBGA | TFBGA | TFBGA |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 1.2 mm | 1.2 mm | 1.2 mm |
自我刷新 | - | YES | YES | YES |
最大供电电压 (Vsup) | - | 1.9 V | 1.9 V | 1.9 V |
最小供电电压 (Vsup) | - | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | - | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | - | YES | YES | YES |
技术 | - | CMOS | CMOS | CMOS |
温度等级 | - | OTHER | OTHER | OTHER |
端子形式 | - | BALL | BALL | BALL |
端子节距 | - | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | - | BOTTOM | BOTTOM | BOTTOM |
宽度 | - | 8 mm | 8 mm | 8 mm |
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